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XBUF802IRGTR

Texas Instruments

XBUF802IRGTR by Texas Instruments

XBUF802IRGTR by Texas Instruments is a BUFFER amplifier with 16 terminals, operating at -40 to 85 °C. It has a bandwidth of 3100 MHz and unity gain bandwidth of 3100000 kHz, suitable for industrial applications requiring high-speed signal buffering in compact spaces. With a low bias current of 0.0001 uA and small package size (3x3 mm), it's ideal for use in electronic devices where space and power consumption are critical factors.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,536 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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4,536

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Vyrian

USA . 2,685 parts In-Stock

1+ parts

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100+ parts

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2,685

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,394 parts In-Stock

1+ parts

$0.410

100+ parts

-

1k+ parts

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10k+ parts

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1,394

$0.410

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Parana Technologies

USA . 771 parts In-Stock

1+ parts

$1.176

100+ parts

-

1k+ parts

$1.981

10k+ parts

-

771

$1.176

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$1.981

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IDEA Electronic Components Group

UK . 1,703 parts In-Stock

1+ parts

$1.321

100+ parts

-

1k+ parts

$1.189

10k+ parts

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1,703

$1.321

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$1.189

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ChromeModa Solutions

Germany . 267 parts In-Stock

1+ parts

$1.321

100+ parts

$1.083

1k+ parts

-

10k+ parts

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267

$1.321

$1.083

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AZTECH Wire

Italy . 861 parts In-Stock

1+ parts

$8.567

100+ parts

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861

$8.567

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Corphita

USA . 2,106 parts In-Stock

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2,106

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DigiPath Technology Company

USA . 1,792 parts In-Stock

1+ parts

-

100+ parts

$1.191

1k+ parts

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1,792

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$1.191

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Overview

Elevate your electronic designs with the XBUF802IRGTR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-quality buffer amplifiers like this one for optimal performance. Ideal for various applications, this chip carrier-style buffer amplifier offers customers unmatched value with its high precision and reliability. Upgrade your projects with the XBUF802IRGTR and experience the benefits of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY as the package body material makes the product lightweight and durable.

Maximum Input Offset Voltage: 800000 uV

The high Maximum Input Offset Voltage ensures accurate signal processing and minimizes errors in the output.

Maximum Average Bias Current (IIB): 0.0001 uA

The low Maximum Average Bias Current allows for stable and efficient operation of the buffer amplifier.

Surface Mount: YES

Being surface mountable makes the installation and integration of the buffer amplifier easier and more convenient.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V is a common and easily available power source for various applications.

No. of Terminals: 16

Having 16 terminals provides flexibility in connections and allows for versatile usage of the buffer amplifier.

Maximum Supply Voltage Limit: 7 V

The maximum supply voltage limit of 7V ensures safe operation and protects the amplifier from damage due to overvoltage.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the buffer amplifier can function reliably even in challenging environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows the buffer amplifier to be used in a wide range of temperature conditions.

Nominal Unity Gain Bandwidth: 3100000 kHz

The high Nominal Unity Gain Bandwidth indicates that the amplifier can amplify signals efficiently across a wide range of frequencies.

Technical Specifications

Buffer Amplifiers XBUF802IRGTR attributes and parameters. Explore more Buffer Amplifiers devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

Bipolar

Total Functions:

1

Sub-Category:

Buffer Amplifiers

Performance Specifications

Nominal Bandwidth (3dB):

3100 MHz

Nominal Unity Gain Bandwidth:

3100 MHz

Nominal Slew Rate:

7000 V/us

Input Offset Voltage Limit:

800 mV

Peak Bias Current:

100 pA

Maximum Bias Current (IIB) @25 °C:

25 pA

Operational Characteristics

Maximum Supply Current:

38 mA

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

7 V

Nominal Negative Supply Voltage (Vsup):

-5 V

Maximum Negative Supply Voltage:

-7 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Physical Characteristics

Length:

0.118 in (3 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.039 in (1 mm)

Total Terminals:

16

Terminal Pitch:

0.02 in (0.5 mm)

Terminal Position:

Quad

Terminal Style:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Standards

JESD-30 Code:

S-PQCC-N16

Packaging and Shipping

Packing Method:

Tape And Reel, 13 inch

Package Code:

Package Shape:

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Equivalence Code:

LCC16,.12SQ,20

Trade Compliance

XBUF802IRGTR Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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