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LMH6517SQ

Texas Instruments

LMH6517SQ by Texas Instruments

LMH6517SQ by Texas Instruments is a 32-terminal CONSUMER CIRCUIT IC with SQUARE package style. Operating b/w -40 to 85 °C, it has a supply voltage range of 4.5-5.25 V. Ideal for industrial applications requiring compact design and high thermal performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 5,388 parts In-Stock

1+ parts

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5,388

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Digiode

USA . 3,866 parts In-Stock

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3,866

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Vyrian

USA . 3,318 parts In-Stock

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3,318

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Anansix

USA . 2,708 parts In-Stock

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2,708

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Prism Electronics

USA . 6 parts In-Stock

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6

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 708 parts In-Stock

1+ parts

$0.637

100+ parts

-

1k+ parts

$1.703

10k+ parts

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708

$0.637

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$1.703

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DigiPath Technology Company

USA . 958 parts In-Stock

1+ parts

$0.702

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958

$0.702

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ChromeModa Solutions

Germany . 3,085 parts In-Stock

1+ parts

$0.716

100+ parts

$0.587

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3,085

$0.716

$0.587

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IDEA Electronic Components Group

UK . 636 parts In-Stock

1+ parts

$0.716

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$0.644

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636

$0.716

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$0.644

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One Stop Electronics

USA . 1,204 parts In-Stock

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$3.800

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1,204

$3.800

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Ampacity Inc.

Singapore . 625 parts In-Stock

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$13.800

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625

$13.800

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AZTECH Wire

Italy . 282 parts In-Stock

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$14.587

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282

$14.587

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Alle Elektronik GmbH

Germany . 3,896 parts In-Stock

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Kepictronics

USA . 3,734 parts In-Stock

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Corphita

USA . 1,239 parts In-Stock

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Overview

Elevate your consumer electronic designs with the LMH6517SQ from Texas Instruments. This high-quality IC offers unparalleled performance and reliability, thanks to the expertise of its manufacturer. Ideal for a wide range of applications in the consumer electronics industry, this square-shaped chip carrier boasts a very thin profile for space-saving design. With a minimum operating temperature of -40°C and maximum operating temperature of 85°C, the LMH6517SQ ensures optimal functionality in any environment. Trust Texas Instruments to deliver cutting-edge solutions that exceed expectations.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology makes it easy to assemble and solder the IC onto a circuit board, simplifying the manufacturing process.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the circuit board, making it suitable for compact consumer electronic devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand a wide range of environmental conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures that the IC can function reliably even in extreme cold conditions.

Minimum Supply Voltage (Vsup): 4.5 V

The low minimum supply voltage requirement allows this IC to operate efficiently in low-power consumer devices.

Technical Specifications

Other Function Consumer ICs LMH6517SQ attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e0

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

5 mm

Trade Compliance

LMH6517SQ General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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