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LMH6517SQE/NOPB

Texas Instruments

LMH6517SQE/NOPB by Texas Instruments

LMH6517SQE/NOPB by Texas Instruments is a 32-terminal consumer IC with a square package style. It operates in industrial temperature range (-40 to 85°C) and has 2 channels with a min supply voltage of 4.5V, making it suitable for various consumer circuit applications.

Median Price

$11.550

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 52,224 parts In-Stock

1+ parts

$11.550

100+ parts

$10.089

1k+ parts

$6.958

10k+ parts

-

52,224

$11.550

$10.089

$6.958

-

Rochester

USA . 470 parts In-Stock

1+ parts

-

100+ parts

$10.000

1k+ parts

$8.950

10k+ parts

$8.420

470

-

$10.000

$8.950

$8.420

Verical

USA . 290 parts In-Stock

1+ parts

-

100+ parts

$12.500

1k+ parts

$11.188

10k+ parts

$10.525

290

-

$12.500

$11.188

$10.525

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$8.403

100+ parts

-

1k+ parts

-

10k+ parts

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300

$8.403

-

-

-

Digiode

USA . 1,698 parts In-Stock

1+ parts

$9.177

100+ parts

-

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-

10k+ parts

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1,698

$9.177

-

-

-

Bristol Electronics

USA . 241 parts In-Stock

1+ parts

$11.424

100+ parts

$6.854

1k+ parts

$6.569

10k+ parts

-

241

$11.424

$6.854

$6.569

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Vyrian

USA . 17,432 parts In-Stock

1+ parts

-

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17,432

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-

-

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Chip Stock

USA . 5,160 parts In-Stock

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5,160

-

-

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Cyclops Electronics Ltd

UK . 3,282 parts In-Stock

1+ parts

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3,282

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-

-

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Anansix

USA . 1,396 parts In-Stock

1+ parts

-

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1,396

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-

-

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Prism Electronics

USA . 352 parts In-Stock

1+ parts

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352

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ACDS - Activité Composants Distribution Service

France . 241 parts In-Stock

1+ parts

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241

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Dan-Mar Components

USA . 241 parts In-Stock

1+ parts

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241

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Next Level Components, LLC

USA . 81 parts In-Stock

1+ parts

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81

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Holdelec - ElecDif-Pro

France . 4 parts In-Stock

1+ parts

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4

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 17,466 parts In-Stock

1+ parts

$0.510

100+ parts

-

1k+ parts

-

10k+ parts

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17,466

$0.510

-

-

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Parana Technologies

USA . 1,724 parts In-Stock

1+ parts

$2.200

100+ parts

-

1k+ parts

$2.709

10k+ parts

-

1,724

$2.200

-

$2.709

-

DigiPath Technology Company

USA . 226 parts In-Stock

1+ parts

$2.423

100+ parts

$2.229

1k+ parts

-

10k+ parts

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226

$2.423

$2.229

-

-

ChromeModa Solutions

Germany . 5,291 parts In-Stock

1+ parts

$2.472

100+ parts

$2.027

1k+ parts

-

10k+ parts

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5,291

$2.472

$2.027

-

-

IDEA Electronic Components Group

UK . 1,749 parts In-Stock

1+ parts

$2.472

100+ parts

-

1k+ parts

$2.225

10k+ parts

-

1,749

$2.472

-

$2.225

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Aranea Global

USA . 500 parts In-Stock

1+ parts

$8.235

100+ parts

-

1k+ parts

$7.906

10k+ parts

-

500

$8.235

-

$7.906

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Corphita

USA . 3,839 parts In-Stock

1+ parts

$8.694

100+ parts

-

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-

10k+ parts

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3,839

$8.694

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-

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Microchip USA

USA . 100 parts In-Stock

1+ parts

$31.100

100+ parts

$30.660

1k+ parts

$30.440

10k+ parts

$30.210

100

$31.100

$30.660

$30.440

$30.210

QUARKTWIN TECHNOLOGY LTD

USA . 20,598 parts In-Stock

1+ parts

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20,598

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Perfect Parts

USA . 14,582 parts In-Stock

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14,582

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Lixinc

USA . 9,485 parts In-Stock

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9,485

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A-Z Elektronik GmbH

Germany . 8,057 parts In-Stock

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8,057

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Metaverse IC Inc.

Canada . 2,900 parts In-Stock

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2,900

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-

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iodParts Technologies Inc.

India . 241 parts In-Stock

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241

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Authorized Procurement Solutions

USA . 200 parts In-Stock

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-

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200

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-

Overview

Unlock the potential of your consumer electronics with the LMH6517SQE/NOPB by Texas Instruments. This high-quality IC offers unparalleled performance in a compact square package, making it ideal for a variety of applications. From enhancing audio systems to improving signal processing, this versatile chip is designed to deliver superior results. Trust in Texas Instruments' reputation for excellence and innovation, and experience the value and benefits that the LMH6517SQE/NOPB can bring to your projects. Elevate your designs with this cutting-edge solution today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost.

Package Shape: SQUARE

Square package shape provides a compact and space-saving design for the product.

General IC Type: CONSUMER CIRCUIT

Specifically designed for consumer applications, ensuring reliability and performance for everyday use.

No. of Terminals: 32

Ample number of terminals allow for versatile connectivity options with other components.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Multiple package styles offer flexibility in mounting and heat dissipation capabilities.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows for usage in extreme cold conditions.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance for extended product lifespan.

Terminal Position: QUAD

Quad terminal position facilitates easy and secure connection to the PCB.

Maximum Seated Height: 0.8 mm

Low profile with maximum seated height enables compact designs.

Width: 5 mm

Narrow width allows for space-efficient placement on the PCB.

Minimum Supply Voltage (Vsup): 4.5 V

Low minimum supply voltage requirement enables operation in low power scenarios.

Maximum Time At Peak Reflow Temperature (s): 30

Extended time at peak reflow temperature ensures proper soldering and component bonding.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability for reliable solder joints.

Length: 5 mm

Compact length for space-saving PCB layout.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments.

No. of Channels: 2

Multiple channels allow for handling different input signals simultaneously.

Terminal Form: NO LEAD

No lead terminal form complies with environmental regulations and reduces RoHS compliance concerns.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables dense PCB layouts and saves board space.

Moisture Sensitivity Level (MSL): 3

Moderate moisture sensitivity level ensures component reliability during storage and assembly.

Maximum Supply Voltage (Vsup): 5.25 V

High maximum supply voltage tolerance for robust performance under varying supply conditions.

Technical Specifications

Other Function Consumer ICs LMH6517SQE/NOPB attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

LMH6517SQE/NOPB General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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