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LMH6401IRMZR

Texas Instruments

LMH6401IRMZR by Texas Instruments

LMH6401IRMZR by Texas Instruments is a BICMOS IC with 16 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with gain of 26 dB and supply voltage range of 4-5.25 V. Ideal for industrial applications requiring high-speed consumer circuit functionality in compact designs.

Median Price

$15.020

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 26 parts In-Stock

1+ parts

$14.050

100+ parts

$13.200

1k+ parts

$11.940

10k+ parts

$11.940

26

$14.050

$13.200

$11.940

$11.940

Texas Instruments

USA . 33,615 parts In-Stock

1+ parts

$15.989

100+ parts

$13.966

1k+ parts

$9.632

10k+ parts

-

33,615

$15.989

$13.966

$9.632

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,206 parts In-Stock

1+ parts

$13.348

100+ parts

-

1k+ parts

-

10k+ parts

-

1,206

$13.348

-

-

-

Vyrian

USA . 6,341 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,341

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,932 parts In-Stock

1+ parts

$0.461

100+ parts

-

1k+ parts

$1.611

10k+ parts

-

1,932

$0.461

-

$1.611

-

DigiPath Technology Company

USA . 1,992 parts In-Stock

1+ parts

$0.508

100+ parts

$0.467

1k+ parts

-

10k+ parts

-

1,992

$0.508

$0.467

-

-

ChromeModa Solutions

Germany . 3,492 parts In-Stock

1+ parts

$0.518

100+ parts

$0.425

1k+ parts

-

10k+ parts

-

3,492

$0.518

$0.425

-

-

IDEA Electronic Components Group

UK . 730 parts In-Stock

1+ parts

$0.518

100+ parts

-

1k+ parts

$0.466

10k+ parts

-

730

$0.518

-

$0.466

-

Corphita

USA . 2,141 parts In-Stock

1+ parts

$12.645

100+ parts

-

1k+ parts

-

10k+ parts

-

2,141

$12.645

-

-

-

Vigor

Singapore . 1,754 parts In-Stock

1+ parts

$12.970

100+ parts

-

1k+ parts

-

10k+ parts

-

1,754

$12.970

-

-

-

AZTECH Wire

Italy . 192 parts In-Stock

1+ parts

$16.150

100+ parts

-

1k+ parts

-

10k+ parts

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192

$16.150

-

-

-

Kepictronics

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,000

-

-

-

-

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,000

-

-

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Overview

Discover the LMH6401IRMZR by Texas Instruments, a top-quality consumer IC that offers exceptional performance and reliability. As an industry leader, Texas Instruments ensures that this chip carrier with a very thin profile meets the highest standards for industrial applications. With a wide operating temperature range and low supply voltage requirements, this IC is versatile and efficient. Whether you're designing audio equipment, communication systems, or medical devices, the LMH6401IRMZR provides the value, benefits, and advantages you need to bring your projects to the next level. Trust in Texas Instruments for cutting-edge technology that delivers outstanding results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for consumer electronics applications.

Surface Mount: YES

Being surface mountable, the product can be easily integrated into circuit boards for efficient and space-saving designs.

Package Shape: SQUARE

The square package shape allows for easy handling and placement during assembly, reducing the risk of errors.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer circuits, the IC is optimized for performance and efficiency in devices used by end-users.

No. of Terminals: 16

With a higher number of terminals, the IC can support more connections and functions, making it versatile for different applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures the IC can withstand harsh environmental conditions and operate reliably under stress.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the IC to function in cold environments without compromising performance.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent conductivity and solderability, ensuring a secure and reliable connection.

Maximum Seated Height: 0.65 mm

The low seated height of the IC is beneficial for compact designs and helps reduce the overall profile of the circuit board.

Minimum Supply Voltage (Vsup): 4 V

The low minimum supply voltage requirement makes the IC suitable for low-power applications, conserving energy and improving efficiency.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the IC can perform reliably in rugged industrial environments, making it a robust choice for various industries.

Technology: BICMOS

The use of BiCMOS technology combines the advantages of both bipolar and CMOS technologies, providing high-speed performance and low power consumption.

Technical Specifications

Other Function Consumer ICs LMH6401IRMZR attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

Gain:

26 dB

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.65 mm

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

LMH6401IRMZR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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