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LMG3422R050RQZT

Texas Instruments

LMG3422R050RQZT by Texas Instruments

LMG3422R050RQZT by Texas Instruments is a N-CHANNEL FET with 600V DS Breakdown Voltage, ideal for SWITCHING applications. Featuring a max ID of 44A and 0.055 ohm Drain-Source On Resistance, this ENHANCEMENT MODE transistor operates b/w -40 to 125 °C, with turn on/off times of 56/86 ns.

Median Price

$18.298

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,080 parts In-Stock

1+ parts

$15.816

100+ parts

$13.816

1k+ parts

$9.528

10k+ parts

-

1,080

$15.816

$13.816

$9.528

-

Mouser Electronics

USA . 123 parts In-Stock

1+ parts

$20.780

100+ parts

$14.510

1k+ parts

$12.950

10k+ parts

-

123

$20.780

$14.510

$12.950

-

DigiKey

USA . 95 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

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95

-

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Distributors (In-Stock)

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Nova Conductors

Japan . 700 parts In-Stock

1+ parts

$14.645

100+ parts

-

1k+ parts

-

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700

$14.645

-

-

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Digiode

USA . 1,586 parts In-Stock

1+ parts

$15.025

100+ parts

-

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-

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1,586

$15.025

-

-

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Vyrian

USA . 7,637 parts In-Stock

1+ parts

-

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-

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7,637

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-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 430 parts In-Stock

1+ parts

$1.052

100+ parts

-

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-

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430

$1.052

-

-

-

Parana Technologies

USA . 1,188 parts In-Stock

1+ parts

$1.655

100+ parts

-

1k+ parts

$2.266

10k+ parts

-

1,188

$1.655

-

$2.266

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DigiPath Technology Company

USA . 371 parts In-Stock

1+ parts

$1.822

100+ parts

$1.676

1k+ parts

-

10k+ parts

-

371

$1.822

$1.676

-

-

ChromeModa Solutions

Germany . 5,273 parts In-Stock

1+ parts

$1.859

100+ parts

$1.524

1k+ parts

-

10k+ parts

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5,273

$1.859

$1.524

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IDEA Electronic Components Group

UK . 1,247 parts In-Stock

1+ parts

$1.859

100+ parts

-

1k+ parts

$1.673

10k+ parts

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1,247

$1.859

-

$1.673

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Semicontronic

India . 412 parts In-Stock

1+ parts

$10.870

100+ parts

$10.598

1k+ parts

$10.544

10k+ parts

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412

$10.870

$10.598

$10.544

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Corphita

USA . 3,816 parts In-Stock

1+ parts

$14.234

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3,816

$14.234

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Continental Prestige Electronics

USA . 6,618 parts In-Stock

1+ parts

$14.645

100+ parts

-

1k+ parts

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10k+ parts

$14.352

6,618

$14.645

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-

$14.352

Netroflash

USA . 50 parts In-Stock

1+ parts

$14.645

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-

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50

$14.645

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Advanced Electronics

New Zealand . 270 parts In-Stock

1+ parts

$14.937

100+ parts

$14.937

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$14.937

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270

$14.937

$14.937

$14.937

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Ampacity Inc.

Singapore . 80 parts In-Stock

1+ parts

$23.660

100+ parts

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80

$23.660

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Microchip USA

USA . 2,176 parts In-Stock

1+ parts

$42.590

100+ parts

$41.980

1k+ parts

$41.680

10k+ parts

$41.380

2,176

$42.590

$41.980

$41.680

$41.380

Argo Parts USA

USA . 2,114 parts In-Stock

1+ parts

-

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2,114

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Robosynatics

Brazil . 500 parts In-Stock

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500

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Lucentia Tech

USA . 500 parts In-Stock

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500

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Overview

Unleash the power of cutting-edge technology with the LMG3422R050RQZT by Texas Instruments, a top-tier player in the field of Power Field Effect Transistors (FET). This high-performance device offers unmatched reliability and efficiency in switching applications. With a robust design and state-of-the-art materials, this N-CHANNEL FET is engineered to deliver superior performance in complex configurations. Experience seamless operation and enhanced functionality with this advanced transistor that guarantees maximum value and benefits for all your power management needs. Trust Texas Instruments for quality products that set new standards in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides durability and protection for the transistors, making them a reliable choice in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs offer better performance and efficiency compared to P-channel FETs, making them ideal for high-speed switching applications.

Configuration: COMPLEX

The complex configuration allows for versatile and flexible use in different circuit designs, making these transistors suitable for various applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, these FETs offer high efficiency and fast response times, making them ideal for controlling power in electronics.

Surface Mount: YES

The surface mount capability of these transistors makes them easy to integrate into PCBs, saving space and simplifying the assembly process.

Minimum DS Breakdown Voltage: 600 V

With a minimum breakdown voltage of 600V, these transistors can handle high voltages, making them suitable for power applications that require high voltage tolerance.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the PCB, making these transistors a great choice for compact electronic devices.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the soldering process and reduces the risk of short circuits, ensuring reliable connections.

Operating Mode: ENHANCEMENT MODE

Operating in enhancement mode enables these transistors to provide high current and low resistance, making them ideal for power management applications.

Maximum Drain Current (Abs) (ID): 44 A

With a maximum drain current of 44A, these transistors can handle high power loads, making them suitable for applications that require high current capabilities.

Technical Specifications

Power Field Effect Transistors (FET) LMG3422R050RQZT attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Texas Instruments

Specs

Configuration:

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

44 A

Maximum Drain-Source On Resistance:

.055 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PQCC-N54

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

3

No. of Elements:

1

No. of Terminals:

54

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

GALLIUM NITRIDE

Maximum Turn Off Time (toff):

86 ns

Maximum Turn On Time (ton):

56 ns

Trade Compliance

LMG3422R050RQZT Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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