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LMG3410R070RWHT

Texas Instruments

LMG3410R070RWHT by Texas Instruments

LMG3410R070RWHT by Texas Instruments is a Power Management IC with 32 terminals, operating temperature range of -40 to 125°C. It supports supply voltages from 9.5V to 18V and is ideal for automotive applications due to its compact chip carrier package and surface mount capability.

Median Price

$11.054

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2 parts In-Stock

1+ parts

$1.575

100+ parts

-

1k+ parts

-

10k+ parts

-

2

$1.575

-

-

-

Verical

USA . 2 parts In-Stock

1+ parts

$1.575

100+ parts

-

1k+ parts

-

10k+ parts

-

2

$1.575

-

-

-

Chip1Stop

Japan . 13 parts In-Stock

1+ parts

$10.553

100+ parts

-

1k+ parts

-

10k+ parts

-

13

$10.553

-

-

-

Texas Instruments

USA . 52,223 parts In-Stock

1+ parts

$11.554

100+ parts

$10.092

1k+ parts

$6.960

10k+ parts

-

52,223

$11.554

$10.092

$6.960

-

Mouser Electronics

USA . 574 parts In-Stock

1+ parts

$17.200

100+ parts

$11.810

1k+ parts

$11.320

10k+ parts

-

574

$17.200

$11.810

$11.320

-

DigiKey

USA . 94 parts In-Stock

1+ parts

$17.200

100+ parts

$11.805

1k+ parts

$10.922

10k+ parts

-

94

$17.200

$11.805

$10.922

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 75 parts In-Stock

1+ parts

$8.756

100+ parts

-

1k+ parts

-

10k+ parts

-

75

$8.756

-

-

-

Digiode

USA . 3,878 parts In-Stock

1+ parts

$9.507

100+ parts

-

1k+ parts

-

10k+ parts

-

3,878

$9.507

-

-

-

Chip Stock

USA . 14,450 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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14,450

-

-

-

-

Vyrian

USA . 8,726 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,726

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 8,446 parts In-Stock

1+ parts

$8.300

100+ parts

-

1k+ parts

-

10k+ parts

-

8,446

$8.300

-

-

-

Aranea Global

USA . 100 parts In-Stock

1+ parts

$8.581

100+ parts

-

1k+ parts

$8.238

10k+ parts

-

100

$8.581

-

$8.238

-

Corphita

USA . 1,170 parts In-Stock

1+ parts

$9.006

100+ parts

-

1k+ parts

-

10k+ parts

-

1,170

$9.006

-

-

-

Parana Technologies

USA . 1,654 parts In-Stock

1+ parts

$16.890

100+ parts

-

1k+ parts

$17.130

10k+ parts

-

1,654

$16.890

-

$17.130

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DigiPath Technology Company

USA . 964 parts In-Stock

1+ parts

$18.598

100+ parts

$17.111

1k+ parts

-

10k+ parts

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964

$18.598

$17.111

-

-

IDEA Electronic Components Group

UK . 2,059 parts In-Stock

1+ parts

$18.978

100+ parts

$18.029

1k+ parts

$17.080

10k+ parts

-

2,059

$18.978

$18.029

$17.080

-

ChromeModa Solutions

Germany . 1,923 parts In-Stock

1+ parts

$18.978

100+ parts

$15.562

1k+ parts

-

10k+ parts

-

1,923

$18.978

$15.562

-

-

Microchip USA

USA . 2,158 parts In-Stock

1+ parts

$30.510

100+ parts

$30.070

1k+ parts

$29.850

10k+ parts

$29.640

2,158

$30.510

$30.070

$29.850

$29.640

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,000

-

-

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Overview

Experience superior power management with the LMG3410R070RWHT by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers exceptional quality and reliability in their products. The LMG3410R070RWHT is a versatile Power Management IC suitable for various applications, offering customers unmatched value and benefits. With a wide operating temperature range and high supply voltage capabilities, this IC is perfect for automotive use and other demanding environments. Trust Texas Instruments for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is widely used in electronic components for its durability and insulation properties, ensuring the longevity and safety of the product.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the component onto a printed circuit board, saving time and reducing overall production costs.

Nominal Supply Voltage (Vsup): 12 V

Operating at a stable 12V supply voltage, this power management IC is suitable for various electronic devices that require this specific power level.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this power management IC can withstand extended periods of use without overheating, ensuring reliable performance in challenging environments.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards, this power management IC is ideal for use in vehicles where temperature fluctuations and harsh conditions are common.

Technical Specifications

Power Management ICs LMG3410R070RWHT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.9 mm

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

9.5 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

8 mm

Trade Compliance

LMG3410R070RWHT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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