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LMG3410R150RWHT

Texas Instruments

LMG3410R150RWHT by Texas Instruments

LMG3410R150RWHT by Texas Instruments is a power management IC with a nominal voltage of 12V. It has a package style of chip carrier and is suitable for automotive applications. With a max operating temperature of 125°C, it offers reliable performance in demanding environments.

Median Price

$12.260

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 6,511 parts In-Stock

1+ parts

$8.832

100+ parts

$7.200

1k+ parts

$4.800

10k+ parts

-

6,511

$8.832

$7.200

$4.800

-

Mouser Electronics

USA . 110 parts In-Stock

1+ parts

$12.260

100+ parts

$8.670

1k+ parts

$7.470

10k+ parts

-

110

$12.260

$8.670

$7.470

-

DigiKey

USA . 19 parts In-Stock

1+ parts

$12.260

100+ parts

$8.251

1k+ parts

$7.595

10k+ parts

$7.480

19

$12.260

$8.251

$7.595

$7.480

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$7.190

100+ parts

-

1k+ parts

-

10k+ parts

-

150

$7.190

-

-

-

Digiode

USA . 2,923 parts In-Stock

1+ parts

$8.390

100+ parts

-

1k+ parts

-

10k+ parts

-

2,923

$8.390

-

-

-

Vyrian

USA . 5,172 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,172

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,163 parts In-Stock

1+ parts

$5.090

100+ parts

-

1k+ parts

-

10k+ parts

-

2,163

$5.090

-

-

-

Continental Prestige Electronics

USA . 6,807 parts In-Stock

1+ parts

$7.190

100+ parts

-

1k+ parts

-

10k+ parts

$7.046

6,807

$7.190

-

-

$7.046

Netroflash

USA . 500 parts In-Stock

1+ parts

$7.190

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$7.190

-

-

-

Corphita

USA . 1,483 parts In-Stock

1+ parts

$7.949

100+ parts

-

1k+ parts

-

10k+ parts

-

1,483

$7.949

-

-

-

Parana Technologies

USA . 2,176 parts In-Stock

1+ parts

$21.231

100+ parts

-

1k+ parts

$21.530

10k+ parts

-

2,176

$21.231

-

$21.530

-

Microchip USA

USA . 2,466 parts In-Stock

1+ parts

$23.533

100+ parts

-

1k+ parts

-

10k+ parts

-

2,466

$23.533

-

-

-

ChromeModa Solutions

Germany . 6,332 parts In-Stock

1+ parts

$23.855

100+ parts

$19.561

1k+ parts

-

10k+ parts

-

6,332

$23.855

$19.561

-

-

IDEA Electronic Components Group

UK . 1,383 parts In-Stock

1+ parts

$23.855

100+ parts

$22.662

1k+ parts

$21.470

10k+ parts

-

1,383

$23.855

$22.662

$21.470

-

QUARKTWIN TECHNOLOGY LTD

USA . 11,508 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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11,508

-

-

-

-

Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,000

-

-

-

-

Argo Parts USA

USA . 3,641 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,641

-

-

-

-

DigiPath Technology Company

USA . 436 parts In-Stock

1+ parts

-

100+ parts

$21.508

1k+ parts

-

10k+ parts

-

436

-

$21.508

-

-

Overview

Discover the LMG3410R150RWHT by Texas Instruments, a high-quality Power Management IC that offers unrivaled performance and reliability. With its advanced manufacturing techniques and cutting-edge technology, Texas Instruments ensures that this product meets the highest industry standards. The LMG3410R150RWHT is perfect for a wide range of applications, including power supply support circuits. Its compact design and surface mount capability make it easy to integrate into any project. Experience the value and benefits that this exceptional product brings to your applications, with features that include a nominal supply voltage of 12V, a maximum operating temperature of 125°C, and a minimum operating temperature of -40°C. Trust Texas Instruments for all your power management needs!

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides durability and protection for the power management IC, making it suitable for various applications.

Surface Mount:

YES - The surface mount feature allows for easy and efficient installation, saving time and effort during assembly.

Package Shape:

SQUARE - The square shape ensures compatibility with standard electronic components and facilitates efficient usage of available space on the printed circuit board.

Nominal Supply Voltage (Vsup):

12 V - The 12V supply voltage allows for compatibility with a wide range of devices and ensures stable power delivery.

No. of Terminals:

32 - With 32 terminals, this power management IC provides ample connectivity options, enabling efficient integration into complex electronic systems.

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG - The combination of chip carrier and heat sink/slug package style improves thermal management, enhancing the IC's performance and longevity.

Maximum Operating Temperature:

125 °C - The high maximum operating temperature allows the power management IC to withstand demanding operating conditions, ensuring reliable performance in various environments.

Minimum Operating Temperature:

40 °C - The low minimum operating temperature ensures the IC's functionality in extreme cold environments, making it versatile for a wide range of applications.

Terminal Finish:

NICKEL PALLADIUM GOLD - The Nickel Palladium Gold terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable electrical connections.

Terminal Position:

QUAD - The quad terminal position allows for stable and secure connection, ensuring proper integration and minimizing the risk of disconnection.

Maximum Seated Height:

0.9 mm - The low maximum seated height enables a compact design, making it suitable for space-constrained applications.

Width (mm):

8 mm - The 8mm width provides compatibility with standard PCB manufacturing processes and offers flexibility in designing compact systems.

Other IC type:

POWER SUPPLY SUPPORT CIRCUIT - This power management IC is specifically designed to efficiently support and regulate power supply, making it a reliable choice for devices requiring stable power delivery.

Minimum Supply Voltage (Vsup):

9.5 V - The low minimum supply voltage facilitates operation in low-power scenarios, making it suitable for energy-efficient applications.

Maximum Time At Peak Reflow Temperature (s):

30 - The IC's maximum time at peak reflow temperature of 30 seconds ensures safe soldering during assembly, preventing damage to the component.

Peak Reflow Temperature °C:

260 - With a peak reflow temperature of 260°C, the power management IC can withstand high-temperature soldering processes, ensuring reliable connections.

Length:

8 mm - The compact 8mm length allows for easy integration into various PCB designs, optimizing space usage.

Temperature Grade:

AUTOMOTIVE - The power management IC's automotive temperature grade indicates its suitability for use in automotive applications, where it can withstand harsh temperature conditions.

Terminal Form:

NO LEAD - The no-lead terminal form eliminates the use of lead-based materials, making the IC environmentally friendly and compliant with regulations.

Moisture Sensitivity Level (MSL):

3 - The MSL 3 rating indicates that the power management IC's moisture sensitivity is moderate, allowing for safe storage and handling.

Maximum Supply Voltage (Vsup):

18 V - With a maximum supply voltage of 18V, this IC can handle higher input voltages, making it versatile for various power supply applications.

Technical Specifications

Power Management ICs LMG3410R150RWHT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.9 mm

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

9.5 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

8 mm

Trade Compliance

LMG3410R150RWHT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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