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LMG3411R150RWHR

Texas Instruments

LMG3411R150RWHR by Texas Instruments

LMG3411R150RWHR by Texas Instruments is a Power Management IC with 32 terminals, operating voltage range of 6-18V, and temperature grade suitable for automotive applications. It features a square chip carrier package with nickel palladium gold finish, ideal for power supply support circuits in harsh environments. With surface mount capability and compact dimensions of 8x8mm, it offers high reliability and performance in various electronic systems.

Median Price

$11.170

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 188,022 parts In-Stock

1+ parts

$7.360

100+ parts

$6.000

1k+ parts

$4.000

10k+ parts

-

188,022

$7.360

$6.000

$4.000

-

Mouser Electronics

USA . 703 parts In-Stock

1+ parts

$11.170

100+ parts

$7.200

1k+ parts

$5.500

10k+ parts

$5.350

703

$11.170

$7.200

$5.500

$5.350

DigiKey

USA . 1,275 parts In-Stock

1+ parts

$11.550

100+ parts

$7.747

1k+ parts

$7.061

10k+ parts

$5.385

1,275

$11.550

$7.747

$7.061

$5.385

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 750 parts In-Stock

1+ parts

$6.870

100+ parts

-

1k+ parts

-

10k+ parts

-

750

$6.870

-

-

-

Digiode

USA . 3,665 parts In-Stock

1+ parts

$6.992

100+ parts

-

1k+ parts

-

10k+ parts

-

3,665

$6.992

-

-

-

Vyrian

USA . 63,258 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

63,258

-

-

-

-

Cyclops Electronics Ltd

UK . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 63,305 parts In-Stock

1+ parts

$6.260

100+ parts

-

1k+ parts

-

10k+ parts

-

63,305

$6.260

-

-

-

Semicontronic

India . 63,104 parts In-Stock

1+ parts

$6.260

100+ parts

$6.104

1k+ parts

$6.072

10k+ parts

-

63,104

$6.260

$6.104

$6.072

-

Corphita

USA . 3,017 parts In-Stock

1+ parts

$6.624

100+ parts

-

1k+ parts

-

10k+ parts

-

3,017

$6.624

-

-

-

Aranea Global

USA . 500 parts In-Stock

1+ parts

$6.733

100+ parts

-

1k+ parts

$6.463

10k+ parts

-

500

$6.733

-

$6.463

-

Continental Prestige Electronics

USA . 1,432 parts In-Stock

1+ parts

$6.870

100+ parts

-

1k+ parts

-

10k+ parts

$6.733

1,432

$6.870

-

-

$6.733

Advanced Electronics

New Zealand . 450 parts In-Stock

1+ parts

$7.007

100+ parts

$7.007

1k+ parts

$7.007

10k+ parts

-

450

$7.007

$7.007

$7.007

-

Parana Technologies

USA . 2,110 parts In-Stock

1+ parts

$9.163

100+ parts

-

1k+ parts

$9.811

10k+ parts

-

2,110

$9.163

-

$9.811

-

DigiPath Technology Company

USA . 1,132 parts In-Stock

1+ parts

$10.089

100+ parts

$9.282

1k+ parts

-

10k+ parts

-

1,132

$10.089

$9.282

-

-

IDEA Electronic Components Group

UK . 1,764 parts In-Stock

1+ parts

$10.295

100+ parts

$9.780

1k+ parts

$9.266

10k+ parts

-

1,764

$10.295

$9.780

$9.266

-

ChromeModa Solutions

Germany . 1,127 parts In-Stock

1+ parts

$10.295

100+ parts

$8.442

1k+ parts

-

10k+ parts

-

1,127

$10.295

$8.442

-

-

Corohmni

South Africa . 539 parts In-Stock

1+ parts

$18.755

100+ parts

-

1k+ parts

-

10k+ parts

-

539

$18.755

-

-

-

Argo Parts USA

USA . 4,633 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,633

-

-

-

-

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Overview

Experience unparalleled efficiency and reliability with the LMG3411R150RWHR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments sets the standard for quality power management ICs. This chip carrier, heat sink package is ideal for automotive applications, providing seamless power supply support without sacrificing performance. With a wide operating temperature range and excellent terminal finish, this power management IC offers unmatched value and benefits to customers looking for a reliable solution for their electronic devices. Trust Texas Instruments for superior power management solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection, making it suitable for various applications.

Surface Mount: YES

Allows for easy installation and saves space on the PCB, making it ideal for compact designs.

Package Shape: SQUARE

Ensures efficient use of board space and easy alignment during assembly.

Nominal Supply Voltage (Vsup): 6 V

Works well with low power systems and ensures stable operation within the specified voltage range.

No. of Terminals: 32

Provides flexibility in connecting to other components, making it versatile for different configurations.

Package Style: CHIP CARRIER, HEAT SINK/SLUG

Helps in heat dissipation and improves overall performance and reliability.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for demanding environments.

Minimum Operating Temperature: -40 °C

Works efficiently in extreme cold conditions, ensuring reliable performance in harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: QUAD

Allows for easy soldering and connection to the PCB, making installation quick and hassle-free.

Maximum Seated Height: 0.9 mm

Low profile design saves space and allows for compact designs in space-constrained applications.

Width (mm): 8 mm

Compact size fits easily on the PCB and is suitable for small form factor devices.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Helps in enhancing power management capabilities and ensures efficient power delivery.

Minimum Supply Voltage (Vsup): 9.5 V

Supports a wide input voltage range, allowing for compatibility with various power sources.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures reliable soldering during assembly, reducing the risk of component damage.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures during soldering process, ensuring proper connections.

Length: 8 mm

Compact size fits easily on the PCB and is ideal for space-constrained designs.

Temperature Grade: AUTOMOTIVE

Meets industry standards for automotive applications, ensuring reliability in automotive environments.

Terminal Form: NO LEAD

Lead-free design complies with environmental regulations and ensures compatibility with RoHS standards.

Moisture Sensitivity Level (MSL): 3

Designed to handle moderate exposure to moisture, ensuring reliability in humid conditions.

Maximum Supply Voltage (Vsup): 18 V

Supports a wide input voltage range, making it suitable for a variety of power supply applications.

Technical Specifications

Power Management ICs LMG3411R150RWHR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.9 mm

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

9.5 V

Nominal Supply Voltage (Vsup):

6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

8 mm

Trade Compliance

LMG3411R150RWHR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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