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LM8364BALMF45

Texas Instruments

LM8364BALMF45 by Texas Instruments

LM8364BALMF45 by Texas Instruments is a Power Management IC with 5 terminals, operating b/w -40 to 85 °C. It has a supply voltage range of 1-6V and nominal threshold voltage of +4.5V. Ideal for industrial applications requiring small outline, low profile packages in plastic/epoxy material.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,435 parts In-Stock

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Digiode

USA . 3,095 parts In-Stock

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ComSIT Distribution GmbH

Germany . 1,678 parts In-Stock

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Anansix

USA . 1,024 parts In-Stock

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GSS - Global Semi Support

USA . 452 parts In-Stock

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Prism Electronics

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One Stop Electronics

USA . 1,451 parts In-Stock

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$4.500

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$4.500

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AZTECH Wire

Italy . 758 parts In-Stock

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$11.240

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Parana Technologies

USA . 475 parts In-Stock

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$20.231

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$1,878.717

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$18.208

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DigiPath Technology Company

USA . 1,027 parts In-Stock

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$22.276

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$22.276

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ChromeModa Solutions

Germany . 1,421 parts In-Stock

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$22.731

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$18.639

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IDEA Electronic Components Group

UK . 218 parts In-Stock

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$22.731

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$21.594

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$20.458

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Kepictronics

USA . 20,000 parts In-Stock

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Corphita

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Perfect Parts

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Overview

Experience the unparalleled quality and reliability of Texas Instruments with the LM8364BALMF45 Power Management IC. This versatile component offers a wide range of applications in various industries, providing optimal power supply support for your electronic devices. With its compact design and high-performance capabilities, this IC ensures efficient power management while maintaining a low profile. Trust Texas Instruments to deliver superior products that exceed expectations, setting new standards in the industry. Elevate your projects with the LM8364BALMF45 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable for ease of handling and reliability.

Surface Mount: YES

Being surface mountable allows for easy installation and space-saving on the PCB.

Nominal Supply Voltage (Vsup): 1.5 V

The low nominal supply voltage of 1.5V is efficient and suitable for power management applications.

No. of Terminals: 5

Having 5 terminals provides flexibility in connecting to other components for a versatile power management solution.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this IC can withstand high temperature environments, making it reliable for industrial use.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40°C ensures functionality in various cold conditions.

Width (mm): 1.6 mm

The compact width of 1.6mm saves space on the PCB while providing efficient power management.

Minimum Supply Voltage (Vsup): 1 V

The minimum supply voltage of 1V allows for operation in low power situations without compromising performance.

Maximum Supply Voltage (Vsup): 6 V

With a maximum supply voltage of 6V, this IC can handle a wide range of power input, making it versatile for different applications.

Technical Specifications

Power Management ICs LM8364BALMF45 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 4.5 V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G5

Length:

2.92 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Maximum Seated Height:

1.22 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

1 V

Nominal Supply Voltage (Vsup):

1.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.5V

Width (mm):

1.6 mm

Trade Compliance

LM8364BALMF45 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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