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LM8364BALMFX27

Texas Instruments

LM8364BALMFX27 by Texas Instruments

LM8364BALMFX27 by Texas Instruments is a Power Management IC with 5 terminals and a supply voltage range of 1V to 6V. It has a small outline package style, operates in industrial temperature grades (-40°C to 85°C), and supports power supply circuits. Ideal for applications requiring low profile components in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,129 parts In-Stock

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5,129

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Anansix

USA . 987 parts In-Stock

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987

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Digiode

USA . 619 parts In-Stock

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619

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Distributors (Availability)

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One Stop Electronics

USA . 1,637 parts In-Stock

1+ parts

$6.500

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1,637

$6.500

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AZTECH Wire

Italy . 280 parts In-Stock

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$11.218

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280

$11.218

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Parana Technologies

USA . 887 parts In-Stock

1+ parts

$20.871

100+ parts

$1,938.225

1k+ parts

$18.784

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887

$20.871

$1,938.225

$18.784

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DigiPath Technology Company

USA . 790 parts In-Stock

1+ parts

$22.982

100+ parts

$21.143

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790

$22.982

$21.143

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ChromeModa Solutions

Germany . 2,414 parts In-Stock

1+ parts

$23.451

100+ parts

$19.230

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2,414

$23.451

$19.230

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IDEA Electronic Components Group

UK . 2,300 parts In-Stock

1+ parts

$23.451

100+ parts

$22.278

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$21.106

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2,300

$23.451

$22.278

$21.106

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Kepictronics

USA . 27,000 parts In-Stock

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Corphita

USA . 5,118 parts In-Stock

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Overview

Experience the power of superior technology with the LM8364BALMFX27 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments has crafted this Power Management IC to deliver unmatched quality and performance. Designed for a wide range of applications, this IC offers reliable power supply support circuitry in a small, compact package. Trust in Texas Instruments to provide you with the solutions you need for your power management needs. Elevate your projects with the LM8364BALMFX27 and discover the value and benefits it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy integration onto circuit boards, saving space and enabling efficient PCB design.

Nominal Supply Voltage (Vsup): 1.5 V

Suitable for low power applications, ideal for efficient power management in various devices.

No. of Terminals: 5

Provides necessary connectivity for power input and output, contributing to the functionality of the power management IC.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even in high-temperature environments, making the product versatile for different operating conditions.

Minimum Operating Temperature: -40 °C

Allows the power management IC to function in extreme cold temperatures, expanding its usability in various climates.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Designed specifically to support power supply functions, ensuring efficient and stable power delivery for connected devices.

Technical Specifications

Power Management ICs LM8364BALMFX27 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 2.7 V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G5

Length:

2.92 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Maximum Seated Height:

1.22 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

1 V

Nominal Supply Voltage (Vsup):

1.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.7V

Width (mm):

1.6 mm

Trade Compliance

LM8364BALMFX27 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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