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LM8365BALMFX22

Texas Instruments

LM8365BALMFX22 by Texas Instruments

LM8365BALMFX22 by Texas Instruments is a Power Management IC with 5 terminals and a supply voltage range of 1V to 6V. It has a small outline package style, operates in industrial temperature grade (-40 to 85 °C), and supports power supply circuits. Ideal for applications requiring low profile components in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,627 parts In-Stock

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Digiode

USA . 2,639 parts In-Stock

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Anansix

USA . 2,467 parts In-Stock

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Classic Components Corporation

USA . 8 parts In-Stock

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One Stop Electronics

USA . 1,267 parts In-Stock

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$0.500

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1,267

$0.500

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Parana Technologies

USA . 1,988 parts In-Stock

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$6.343

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$7.094

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1,988

$6.343

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$7.094

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DigiPath Technology Company

USA . 433 parts In-Stock

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$6.984

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$6.426

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433

$6.984

$6.426

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ChromeModa Solutions

Germany . 3,209 parts In-Stock

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$7.127

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$5.844

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3,209

$7.127

$5.844

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IDEA Electronic Components Group

UK . 2,180 parts In-Stock

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$7.127

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$6.414

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AZTECH Wire

Italy . 357 parts In-Stock

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$8.233

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357

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Component Stockers USA

USA . 686 parts In-Stock

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$99.990

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Corphita

USA . 4,520 parts In-Stock

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Authorized Procurement Solutions

USA . 2,800 parts In-Stock

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Microchip USA

USA . 454 parts In-Stock

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A-Z Elektronik GmbH

Germany . 350 parts In-Stock

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Overview

Experience the seamless power management capabilities of Texas Instruments with the LM8365BALMFX22. Designed for industrial applications, this small outline, low profile IC offers reliable performance and durability. With a nominal supply voltage of 1.5V and a wide operating temperature range, this power management IC ensures optimal functionality in various environments. Trust Texas Instruments for high-quality solutions that deliver efficiency and precision to your projects. Elevate your power management systems with the LM8365BALMFX22 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material offers durability and protection, making the product suitable for industrial environments.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort during production.

Nominal Supply Voltage (Vsup): 1.5 V

Operating at a nominal supply voltage of 1.5V, this power management IC is energy-efficient and can help reduce power consumption in electronic devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this power management IC can withstand elevated temperatures and maintain performance under harsh conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable operation even in cold environments, making this product versatile and suitable for various applications.

Width (mm): 1.6 mm

Compact dimensions with a width of 1.6mm allow for space-saving and efficient PCB layout, making it ideal for designs with limited space.

Nominal Threshold Voltage (V): +2.2V

The nominal threshold voltage of +2.2V provides a stable reference for power supply monitoring and regulation, ensuring accurate and consistent performance.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this power management IC meets the stringent requirements and reliability standards of industrial environments.

Maximum Supply Voltage (Vsup): 6 V

With a maximum supply voltage of 6V, this power management IC can handle higher voltage levels, offering flexibility and compatibility with a wide range of power sources.

Technical Specifications

Power Management ICs LM8365BALMFX22 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

DETECT THRESHOLD VOLTAGE IS 2.2V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G5

Length:

2.92 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Maximum Seated Height:

1.22 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

1 V

Nominal Supply Voltage (Vsup):

1.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.953 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.2V

Width (mm):

1.6 mm

Trade Compliance

LM8365BALMFX22 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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