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LM4859TL

Texas Instruments

LM4859TL by Texas Instruments

LM4859TL by Texas Instruments is a consumer IC with 30 terminals in a grid array package. It operates b/w -40°C to 85°C, with supply voltage ranging from 2.7V to 5.5V. This IC is ideal for industrial applications requiring fine pitch surface mount technology.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,399 parts In-Stock

1+ parts

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7,399

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Anansix

USA . 2,518 parts In-Stock

1+ parts

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2,518

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Digiode

USA . 2,354 parts In-Stock

1+ parts

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2,354

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,439 parts In-Stock

1+ parts

$2.162

100+ parts

-

1k+ parts

$2.675

10k+ parts

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1,439

$2.162

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$2.675

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DigiPath Technology Company

USA . 1,358 parts In-Stock

1+ parts

$2.380

100+ parts

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10k+ parts

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1,358

$2.380

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ChromeModa Solutions

Germany . 5,511 parts In-Stock

1+ parts

$2.429

100+ parts

$1.992

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5,511

$2.429

$1.992

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IDEA Electronic Components Group

UK . 1,113 parts In-Stock

1+ parts

$2.429

100+ parts

-

1k+ parts

$2.186

10k+ parts

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1,113

$2.429

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$2.186

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AZTECH Wire

Italy . 467 parts In-Stock

1+ parts

$13.147

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467

$13.147

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One Stop Electronics

USA . 1,628 parts In-Stock

1+ parts

$16.800

100+ parts

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1,628

$16.800

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Alle Elektronik GmbH

Germany . 3,717 parts In-Stock

1+ parts

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3,717

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Authorized Procurement Solutions

USA . 1,500 parts In-Stock

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1,500

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Corphita

USA . 1,356 parts In-Stock

1+ parts

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1,356

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Metaverse IC Inc.

Canada . 299 parts In-Stock

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299

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Overview

Unleash the power of cutting-edge technology with the LM4859TL by Texas Instruments. As a leader in the industry, Texas Instruments guarantees top-notch quality and reliability. This versatile consumer IC is perfect for a wide range of applications, offering unmatched performance and efficiency. With its advanced features and innovative design, the LM4859TL provides exceptional value and benefits to customers looking for the best in the market. Upgrade your electronics with Texas Instruments and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package durable and resistant to external elements, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount capability allows for easy installation and integration into circuit boards, saving time and effort during assembly.

Package Shape: RECTANGULAR

Rectangular shape provides a standard form factor that fits well with most electronic devices, making it versatile for various applications.

No. of Terminals: 30

Having 30 terminals allows for a wide range of connections and functionalities, making the product suitable for complex circuit designs.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability and performance even under harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures the product can function in cold environments without any issues, increasing its usability.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good solderability and conductivity, ensuring reliable connections and signal transmission.

Minimum Supply Voltage (Vsup): 2.7 V

Low minimum supply voltage allows the product to operate efficiently even with limited power sources, making it suitable for portable devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the product can withstand a wide range of temperature fluctuations, making it suitable for industrial applications.

Terminal Pitch: 0.5 mm

Small terminal pitch allows for dense packing of components, saving board space and enabling compact designs.

Maximum Supply Voltage (Vsup): 5.5 V

High maximum supply voltage provides flexibility and compatibility with various power sources, making the product versatile for different applications.

Technical Specifications

Other Function Consumer ICs LM4859TL attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PBGA-B30

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

30

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Trade Compliance

LM4859TL General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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