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LM4859TLX

Texas Instruments

LM4859TLX by Texas Instruments

LM4859TLX by Texas Instruments is a consumer IC with 30 terminals in a grid array package. It operates b/w -40°C to 85°C, with supply voltage ranging from 2.7V to 5.5V. This IC is ideal for industrial applications requiring fine pitch surface mount technology.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,825 parts In-Stock

1+ parts

-

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7,825

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Anansix

USA . 1,893 parts In-Stock

1+ parts

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1,893

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Digiode

USA . 569 parts In-Stock

1+ parts

-

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569

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 778 parts In-Stock

1+ parts

$3.296

100+ parts

-

1k+ parts

$3.820

10k+ parts

-

778

$3.296

-

$3.820

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ChromeModa Solutions

Germany . 4,170 parts In-Stock

1+ parts

$3.703

100+ parts

$3.036

1k+ parts

-

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4,170

$3.703

$3.036

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IDEA Electronic Components Group

UK . 1,140 parts In-Stock

1+ parts

$3.703

100+ parts

-

1k+ parts

$3.333

10k+ parts

-

1,140

$3.703

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$3.333

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AZTECH Wire

Italy . 869 parts In-Stock

1+ parts

$6.565

100+ parts

-

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869

$6.565

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One Stop Electronics

USA . 593 parts In-Stock

1+ parts

$11.800

100+ parts

-

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593

$11.800

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A-Z Elektronik GmbH

Germany . 7,188 parts In-Stock

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7,188

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Alle Elektronik GmbH

Germany . 4,792 parts In-Stock

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4,792

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Corphita

USA . 3,127 parts In-Stock

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3,127

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Kepictronics

USA . 2,877 parts In-Stock

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2,877

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Authorized Procurement Solutions

USA . 2,700 parts In-Stock

1+ parts

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2,700

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DigiPath Technology Company

USA . 932 parts In-Stock

1+ parts

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100+ parts

$3.339

1k+ parts

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932

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$3.339

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Overview

Elevate your consumer electronics with the LM4859TLX by Texas Instruments. Known for their superior quality and innovative technology, Texas Instruments delivers reliable solutions for all your electronic needs. The LM4859TLX is a versatile consumer IC that offers exceptional performance in a compact package. From audio amplifiers to power management, this IC provides high-value benefits and advantages to customers seeking top-notch reliability and efficiency in their devices. Upgrade your products with the LM4859TLX and experience the difference Texas Instruments can make in your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good protection for the internal components of the IC and is lightweight, making the product easy to handle and install.

Surface Mount: YES

Enables easy and efficient PCB assembly, reducing production time and costs.

Package Shape: RECTANGULAR

Optimal shape for efficient space utilization on the PCB, allowing for compact and sleek designs.

Terminal Finish: TIN LEAD

Ensures reliable electrical connections and good solderability, enhancing overall product performance and longevity.

Minimum Supply Voltage (Vsup): 2.7 V

Allows the IC to operate efficiently even at lower voltages, making it suitable for a wide range of applications.

Maximum Operating Temperature: 85 °C

Ensures stable and reliable performance in varying environmental conditions, such as industrial settings.

Technical Specifications

Other Function Consumer ICs LM4859TLX attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PBGA-B30

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

30

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Trade Compliance

LM4859TLX General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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