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LM4857SP/NOPB

Texas Instruments

LM4857SP/NOPB by Texas Instruments

LM4857SP/NOPB by Texas Instruments is a consumer IC with 28 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with supply voltage ranging from 2.7V to 5.5V and max current of 21mA. Ideal for industrial applications requiring compact, low-power consumer circuits.

Median Price

$2.448

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 33,500 parts In-Stock

1+ parts

$2.448

100+ parts

$2.145

1k+ parts

$1.212

10k+ parts

-

33,500

$2.448

$2.145

$1.212

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,924 parts In-Stock

1+ parts

$2.326

100+ parts

-

1k+ parts

-

10k+ parts

-

4,924

$2.326

-

-

-

Vyrian

USA . 4,446 parts In-Stock

1+ parts

$2.448

100+ parts

-

1k+ parts

-

10k+ parts

-

4,446

$2.448

-

-

-

Anansix

USA . 1,838 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,838

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 830 parts In-Stock

1+ parts

$1.957

100+ parts

-

1k+ parts

$2.490

10k+ parts

-

830

$1.957

-

$2.490

-

DigiPath Technology Company

USA . 1,892 parts In-Stock

1+ parts

$2.155

100+ parts

-

1k+ parts

-

10k+ parts

-

1,892

$2.155

-

-

-

ChromeModa Solutions

Germany . 5,817 parts In-Stock

1+ parts

$2.199

100+ parts

$1.803

1k+ parts

-

10k+ parts

-

5,817

$2.199

$1.803

-

-

IDEA Electronic Components Group

UK . 2,103 parts In-Stock

1+ parts

$2.199

100+ parts

-

1k+ parts

$1.979

10k+ parts

-

2,103

$2.199

-

$1.979

-

Corphita

USA . 4,047 parts In-Stock

1+ parts

$2.203

100+ parts

-

1k+ parts

-

10k+ parts

-

4,047

$2.203

-

-

-

Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$4.692

100+ parts

$4.270

1k+ parts

$3.847

10k+ parts

-

2,500

$4.692

$4.270

$3.847

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Overview

Elevate your audio experience with the LM4857SP/NOPB by Texas Instruments. Crafted with precision and expertise, this consumer IC delivers exceptional sound quality in a compact package. Perfect for a wide range of applications, this versatile chip carrier boasts a very thin profile and is designed to operate at industrial temperatures. With a low supply voltage and minimal power consumption, the LM4857SP/NOPB offers customers unbeatable value and performance. Upgrade your audio solutions today with Texas Instruments.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, making this product suitable for mass production.

Package Shape: SQUARE

Square packages offer efficient use of board space and can be more easily integrated into designs compared to other shapes.

Power Supplies (V): 3/5

Support for multiple power supply voltages allows for compatibility with a variety of systems, increasing the versatility of the product.

No. of Terminals: 28

Having a higher number of terminals provides more connectivity options and functionality for the consumer.

Maximum Operating Temperature: 85 °C

A high maximum operating temperature ensures reliability and performance in a wide range of environmental conditions.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures makes this product suitable for use in demanding environments or applications.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and durability, ensuring secure connections during assembly and use.

Width: 5 mm

Compact width allows for space-efficient PCB layout and integration into smaller devices or designs.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures robust soldering process and reliability during assembly.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the product can withstand harsh temperature conditions typically found in industrial applications.

Technical Specifications

Other Function Consumer ICs LM4857SP/NOPB attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-XQCC-N28

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC28,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

.6 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

21 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

LM4857SP/NOPB General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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