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LM4859SPX

Texas Instruments

LM4859SPX by Texas Instruments

Texas Instruments' LM4859SPX is a square-shaped consumer IC with 28 terminals. Operating b/w -40 to 85°C, it supports power supplies from 2.7V to 5.5V. Ideal for industrial applications requiring a very thin profile chip carrier package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,838 parts In-Stock

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7,838

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Digiode

USA . 3,927 parts In-Stock

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3,927

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Anansix

USA . 313 parts In-Stock

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313

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 699 parts In-Stock

1+ parts

$0.744

100+ parts

-

1k+ parts

$1.753

10k+ parts

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699

$0.744

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$1.753

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DigiPath Technology Company

USA . 890 parts In-Stock

1+ parts

$0.819

100+ parts

$0.754

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890

$0.819

$0.754

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IDEA Electronic Components Group

UK . 1,254 parts In-Stock

1+ parts

$0.836

100+ parts

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$0.752

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1,254

$0.836

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$0.752

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ChromeModa Solutions

Germany . 528 parts In-Stock

1+ parts

$0.836

100+ parts

$0.686

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528

$0.836

$0.686

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One Stop Electronics

USA . 190 parts In-Stock

1+ parts

$3.800

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190

$3.800

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AZTECH Wire

Italy . 765 parts In-Stock

1+ parts

$6.937

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765

$6.937

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A-Z Elektronik GmbH

Germany . 7,540 parts In-Stock

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7,540

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Alle Elektronik GmbH

Germany . 4,293 parts In-Stock

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Corphita

USA . 1,499 parts In-Stock

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1,499

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Kepictronics

USA . 544 parts In-Stock

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544

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Overview

Enhance your consumer electronics with the LM4859SPX by Texas Instruments, a high-quality and reliable IC designed for various applications. With Texas Instruments' reputable manufacturing standards, this square-shaped chip carrier offers exceptional value and performance. Whether you're looking to improve audio systems or enhance functionality in portable devices, this consumer circuit provides the power and efficiency you need. Trust in Texas Instruments to deliver cutting-edge solutions that exceed expectations.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, making this product suitable for mass production and advanced electronics applications.

Package Shape: SQUARE

The square package shape helps in easy mounting and integration into electronic circuits, saving space and ensuring a neat layout.

Power Supplies (V): 3/5

Support for dual power supplies at 3V and 5V provides flexibility in designing and compatibility with a wide range of electronic devices.

No. of Terminals: 28

Having 28 terminals allows for connecting multiple components and peripherals, enabling complex electronic functions and features.

Maximum Operating Temperature: 85 °C

High maximum operating temperature makes this product suitable for industrial environments and ensures reliable performance even under extreme conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for usage in cold environments without compromising the functionality and stability of the product.

Technical Specifications

Other Function Consumer ICs LM4859SPX attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-XQCC-N28

JESD-609 Code:

e0

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC28,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

.6 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

LM4859SPX General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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