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LM4859TLX/NOPB

Texas Instruments

LM4859TLX/NOPB by Texas Instruments

LM4859TLX/NOPB by Texas Instruments is a consumer IC with 30 terminals in a grid array package. It operates at -40 to 85°C, with supply voltage ranging from 2.7V to 5.5V and max current of 21mA. Ideal for industrial applications requiring fine pitch and thin profile designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,573 parts In-Stock

1+ parts

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7,573

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Digiode

USA . 4,240 parts In-Stock

1+ parts

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4,240

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Anansix

USA . 1,616 parts In-Stock

1+ parts

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1,616

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,352 parts In-Stock

1+ parts

$0.990

100+ parts

-

1k+ parts

$1.877

10k+ parts

-

2,352

$0.990

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$1.877

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DigiPath Technology Company

USA . 1,407 parts In-Stock

1+ parts

$1.090

100+ parts

$1.003

1k+ parts

-

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1,407

$1.090

$1.003

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ChromeModa Solutions

Germany . 6,799 parts In-Stock

1+ parts

$1.112

100+ parts

$0.912

1k+ parts

-

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6,799

$1.112

$0.912

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IDEA Electronic Components Group

UK . 290 parts In-Stock

1+ parts

$1.112

100+ parts

-

1k+ parts

$1.001

10k+ parts

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290

$1.112

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$1.001

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AZTECH Wire

Italy . 551 parts In-Stock

1+ parts

$5.887

100+ parts

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551

$5.887

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One Stop Electronics

USA . 332 parts In-Stock

1+ parts

$18.800

100+ parts

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332

$18.800

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Component Stockers USA

USA . 745 parts In-Stock

1+ parts

$99.990

100+ parts

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745

$99.990

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Microchip USA

USA . 4,285 parts In-Stock

1+ parts

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4,285

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Corphita

USA . 3,281 parts In-Stock

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3,281

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Overview

Elevate your consumer electronics with the LM4859TLX/NOPB by Texas Instruments. Crafted with precision and expertise, this innovative IC offers unparalleled quality and reliability for a wide range of applications. From enhancing audio performance to optimizing power efficiency, this versatile product delivers exceptional value and functionality. Experience the superior advantages of Texas Instruments technology and unlock new possibilities for your electronic projects. Trust in the excellence of Texas Instruments and elevate your designs with the LM4859TLX/NOPB.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in consumer ICs due to its cost-effectiveness and durability.

Surface Mount: YES

Surface mount technology allows for a more compact design, making the product suitable for small consumer devices.

Package Shape: RECTANGULAR

Rectangular packaging is efficient for space utilization and easy integration into circuit boards.

Power Supplies (V): 3/5

Support for multiple power supply voltages makes the product versatile and compatible with various systems.

No. of Terminals: 30

Having a higher number of terminals allows for more functionality and connectivity options in the circuit.

Maximum Operating Temperature: 85 °C

With a high operating temperature range, the product can withstand harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures makes the product suitable for different climates and applications.

Terminal Finish: TIN SILVER COPPER

This finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: BOTTOM

Bottom terminal positioning simplifies the assembly process and enhances signal integrity.

Width: 2.55 mm

Narrow width allows for a compact form factor, ideal for space-constrained consumer devices.

Maximum Supply Current: 21 mA

Low supply current consumption makes the product energy-efficient and suitable for portable devices.

Technical Specifications

Other Function Consumer ICs LM4859TLX/NOPB attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PBGA-B30

JESD-609 Code:

e1

Length:

2.959 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

30

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA30,5X6,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

.675 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

21 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2.55 mm

Trade Compliance

LM4859TLX/NOPB General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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