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LM25101ASDX/NOPB

Texas Instruments

LM25101ASDX/NOPB by Texas Instruments

LM25101ASDX/NOPB by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 0.056us. This driver is suitable for applications requiring high side drivers and small outline packages.

Median Price

$2.666

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 59,424 parts In-Stock

1+ parts

$2.666

100+ parts

$2.336

1k+ parts

$1.320

10k+ parts

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59,424

$2.666

$2.336

$1.320

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,334 parts In-Stock

1+ parts

$2.533

100+ parts

-

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3,334

$2.533

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Vyrian

USA . 5,576 parts In-Stock

1+ parts

-

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5,576

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ComSIT Distribution GmbH

Germany . 3 parts In-Stock

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3

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,370 parts In-Stock

1+ parts

$2.399

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2,370

$2.399

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Parana Technologies

USA . 1,684 parts In-Stock

1+ parts

$3.706

100+ parts

-

1k+ parts

$4.208

10k+ parts

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1,684

$3.706

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$4.208

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DigiPath Technology Company

USA . 2,219 parts In-Stock

1+ parts

$4.081

100+ parts

$3.754

1k+ parts

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2,219

$4.081

$3.754

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ChromeModa Solutions

Germany . 2,677 parts In-Stock

1+ parts

$4.164

100+ parts

$3.414

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2,677

$4.164

$3.414

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IDEA Electronic Components Group

UK . 1,687 parts In-Stock

1+ parts

$4.164

100+ parts

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$3.748

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1,687

$4.164

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$3.748

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AZTECH Wire

Italy . 1,066 parts In-Stock

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$10.170

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1,066

$10.170

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QUARKTWIN TECHNOLOGY LTD

USA . 19,712 parts In-Stock

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Microchip USA

USA . 6,819 parts In-Stock

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6,819

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Overview

Experience superior performance and reliability with the LM25101ASDX/NOPB by Texas Instruments, a leading manufacturer in the industry. As a high-quality MOSFET gate driver, this product offers unmatched precision and efficiency in various applications. Whether you're in automotive, industrial, or consumer electronics, this small outline, heat sink-compatible driver provides exceptional value, delivering fast turn-on/off times and a nominal output peak current limit of 3A. Trust Texas Instruments for innovative solutions that elevate your designs to new heights. Choose the LM25101ASDX/NOPB for top-notch performance and seamless integration.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability for the gate driver.

Surface Mount: YES

Surface mount capability allows for easy installation on circuit boards, saving space and making assembly more efficient.

Maximum Supply Voltage: 14 V

Can handle high supply voltages, suitable for a wide range of applications.

Minimum Supply Voltage: 9 V

Can operate effectively even with lower supply voltages, providing flexibility in power supply options.

Maximum Operating Temperature: 125 °C

Can operate at high temperatures, ideal for applications where heat dissipation is a concern.

No. of Channels: 2

Dual channel design allows for driving multiple MOSFETs simultaneously, expanding the capabilities of the driver.

Maximum Output Current: 3 A

High output current capability ensures the driver can effectively control larger MOSFETs with higher power ratings.

Terminal Form: NO LEAD

No-lead terminals provide improved reliability and resilience to mechanical stress during operation.

Nominal Supply Voltage: 12 V

Stable nominal supply voltage ensures consistent performance for the gate driver.

Turn-on Time: 0.056 us

Fast turn-on time allows for quick response and precise control of MOSFET switching, optimizing performance.

Technical Specifications

MOSFET Gate Drivers LM25101ASDX/NOPB attributes and parameters. Explore more MOSFET Gate Drivers devices from Texas Instruments

Specs

High Side Driver:

YES

Interface IC Type:

JESD-30 Code:

S-PDSO-N10

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

3 A

Nominal Output Peak Current Limit:

3 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC10,.16,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

MOSFET Drivers

Maximum Supply Current:

3 mA

Maximum Supply Voltage:

14 V

Minimum Supply Voltage:

9 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Turn-off Time:

.056 us

Turn-on Time:

.056 us

Width:

4 mm

Trade Compliance

LM25101ASDX/NOPB Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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