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JM38510/65701B2A

Texas Instruments

JM38510/65701B2A by Texas Instruments

JM38510/65701B2A by Texas Instruments is a CMOS Logic Gates chip with 6 functions, 125ns propagation delay, and 4A max I (ol). Suitable for military applications, it operates b/w -55 to 125°C with a supply voltage range of 2-6V.

Median Price

$33.458

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 140 parts In-Stock

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-

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$29.740

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$26.610

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$25.040

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$26.610

$25.040

DigiKey

USA . 140 parts In-Stock

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Verical

USA . 140 parts In-Stock

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$37.175

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$33.263

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$31.300

140

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$37.175

$33.263

$31.300

Distributors (In-Stock)

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Freelance Electronics

USA . 20 parts In-Stock

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$15.075

100+ parts

$15.829

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$14.924

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20

$15.075

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Digiode

USA . 632 parts In-Stock

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$27.294

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Vyrian

USA . 4,564 parts In-Stock

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DigiKey Marketplace

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Electronic Expediters

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Distributors (Availability)

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Parana Technologies

USA . 940 parts In-Stock

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$18.044

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$18.194

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940

$18.044

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$18.194

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DigiPath Technology Company

USA . 477 parts In-Stock

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$19.869

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$18.279

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ChromeModa Solutions

Germany . 1,460 parts In-Stock

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$20.274

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$16.625

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$20.274

$16.625

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IDEA Electronic Components Group

UK . 285 parts In-Stock

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$20.274

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$19.260

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$18.247

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Corphita

USA . 1,489 parts In-Stock

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$25.857

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Microchip USA

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Overview

Experience the unparalleled quality and reliability of Texas Instruments with the JM38510/65701B2A Logic Gates. Perfect for a wide range of applications, this product offers customers exceptional value and benefits. With its advanced technology and military-grade screening level, you can trust in the performance and durability of this chip carrier package. Say goodbye to compromises and hello to top-notch functionality with Texas Instruments JM38510/65701B2A Logic Gates.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides durability and protection, making the product suitable for harsh environments.

Surface Mount: YES

Easy to install and saves space on the circuit board.

No. of Functions: 6

Offers versatility and can handle multiple logic operations.

Screening Level: MIL-M-38510 Class B

Meets military standards for reliability and performance.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard voltage levels, ensuring compatibility with other components.

No. of Terminals: 20

Plenty of connection options for various input and output configurations.

Propagation Delay (tpd): 125 ns

Fast response time for efficient logic operations.

Maximum Operating Temperature: 125 °C

Can operate in high-temperature environments without performance degradation.

Technology: CMOS

Low power consumption and high noise immunity, ideal for digital logic applications.

Technical Specifications

Logic Gates JM38510/65701B2A attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

S-CQCC-N20

JESD-609 Code:

e0

Length:

8.89 mm

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay (tpd):

125 ns

Qualification:

Not Qualified

Screening Level:

MIL-M-38510 Class B

Maximum Seated Height:

2.03 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

8.89 mm

Trade Compliance

JM38510/65701B2A Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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