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JM38510/65352BCA

Texas Instruments

JM38510/65352BCA by Texas Instruments

JM38510/65352BCA by Texas Instruments is a MILITARY-grade latch with 2 functions, 42ns propagation delay at 5V. It has a max frequency of 18MHz and operates b/w -55 to 125 °C. Ideal for applications requiring fast response times in harsh environments.

Median Price

$29.600

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

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Chip1Stop

Japan . 26 parts In-Stock

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Vyrian

USA . 9,542 parts In-Stock

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Digiode

USA . 1,091 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 33 parts In-Stock

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Electronic Expediters

USA . 17 parts In-Stock

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PC Components Company LLC

USA . 10 parts In-Stock

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Bristol Electronics

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Resion

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Extreme Components

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Parana Technologies

USA . 1,362 parts In-Stock

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$8.563

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$9.223

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DigiPath Technology Company

USA . 1,837 parts In-Stock

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$9.429

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ChromeModa Solutions

Germany . 5,613 parts In-Stock

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$9.621

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$7.889

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IDEA Electronic Components Group

UK . 1,165 parts In-Stock

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$9.621

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$9.140

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$8.659

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AZTECH Wire

Italy . 705 parts In-Stock

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Microchip USA

USA . 2,662 parts In-Stock

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Corphita

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Overview

Enhance your electronic designs with the JM38510/65352BCA by Texas Instruments, a top-of-the-line latches & flip-flops component. Crafted from premium quality ceramic and glass-sealed materials, this product ensures reliability and durability. Ideal for military-grade applications, it offers fast propagation delay and a wide temperature range. Elevate your projects with the high value and superior performance that only Texas Instruments can deliver. Upgrade to excellence with the JM38510/65352BCA today!

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material provides excellent durability and protection, ensuring the latch or flip-flop will have a long lifespan even in challenging environments.

Propagation Delay At Nominal Supply: 42 ns

The fast propagation delay allows for quick operation and response times, making this latch or flip-flop suitable for high-speed applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage ensures compatibility with a wide range of systems and circuits.

Package Shape: RECTANGULAR

The rectangular package shape offers a compact design, making it easy to integrate this latch or flip-flop into existing circuit layouts.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this latch or flip-flop can reliably operate in demanding conditions without overheating.

Trigger Type: POSITIVE EDGE

The positive edge trigger type ensures precise and consistent signal triggering, making this latch or flip-flop suitable for applications requiring accurate timing.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this latch or flip-flop energy-efficient and reliable in noisy environments.

Technical Specifications

Latches & Flip-Flops JM38510/65352BCA attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

HCT

JESD-30 Code:

R-GDIP-T14

JESD-609 Code:

e0

Length:

19.56 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

18000000 Hz

Maximum I (ol):

4 Amp

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

42 ns

Propagation Delay (tpd):

42 ns

Qualification:

Not Qualified

Screening Level:

MIL-M-38510 Class B

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

6.67 mm

Minimum fmax:

20 MHz

Trade Compliance

JM38510/65352BCA Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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