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JM38510/65302BDA

Texas Instruments

JM38510/65302BDA by Texas Instruments

JM38510/65302BDA by Texas Instruments is a MILITARY-grade CMOS latch with 2 functions, 14 terminals, and a supply voltage range of 2-6V. It has a propagation delay of 250ns, operates b/w -55 to 125 °C, and features positive edge triggering. Ideal for applications requiring high-speed data transfer in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,084 parts In-Stock

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Digiode

USA . 1,509 parts In-Stock

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1,509

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Distributors (Availability)

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AZTECH Wire

Italy . 240 parts In-Stock

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$8.945

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240

$8.945

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Parana Technologies

USA . 1,341 parts In-Stock

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$14.535

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$14.975

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$14.535

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$14.975

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DigiPath Technology Company

USA . 2,321 parts In-Stock

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$16.004

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$16.004

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IDEA Electronic Components Group

UK . 1,059 parts In-Stock

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$16.331

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$15.514

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$14.698

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1,059

$16.331

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$14.698

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ChromeModa Solutions

Germany . 861 parts In-Stock

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$16.331

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$13.391

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861

$16.331

$13.391

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Advanced Electronics

New Zealand . 300 parts In-Stock

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$17.652

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$16.063

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$14.475

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300

$17.652

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$14.475

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One Stop Electronics

USA . 1,541 parts In-Stock

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$29.000

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Corphita

USA . 4,285 parts In-Stock

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Microchip USA

USA . 1,623 parts In-Stock

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Overview

Elevate your electronic designs with the JM38510/65302BDA by Texas Instruments. Crafted with precision and reliability in mind, this latches & flip-flops device boasts a MIL-M-38510 Class B screening level, ensuring top-notch performance under extreme conditions. With a compact flatpack design and a wide operating temperature range, this versatile component is ideal for a variety of applications. Experience seamless signal processing, efficient power consumption, and dependable operation with the JM38510/65302BDA, offering unmatched value and benefits to tech enthusiasts and professionals alike.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides excellent durability and protection for the internal components, ensuring long-lasting performance.

Surface Mount: YES

Allows for easy installation and integration onto circuit boards.

No. of Functions: 2

Provides versatility by offering multiple functions in a single component.

Nominal Supply Voltage / Vsup (V): 5

Works reliably within a common voltage range, making it compatible with a wide range of applications.

Propagation Delay (tpd): 250 ns

Delivers fast response times, ideal for applications requiring quick switching speeds.

Maximum Operating Temperature: 125 °C

Can operate efficiently in high-temperature environments, enhancing the product's reliability.

Minimum Operating Temperature: -55 °C

Capable of functioning in low-temperature conditions, making it suitable for a variety of settings.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity.

Technical Specifications

Latches & Flip-Flops JM38510/65302BDA attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

HC

JESD-30 Code:

R-GDFP-F14

JESD-609 Code:

e0

Length:

9.21 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

5.2 Amp

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Packing Method:

TUBE

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay (tpd):

250 ns

Qualification:

Not Qualified

Screening Level:

MIL-M-38510 Class B

Maximum Seated Height:

2.03 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

5.97 mm

Minimum fmax:

25 MHz

Trade Compliance

JM38510/65302BDA Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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