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JM38510/37204BRA

Texas Instruments

JM38510/37204BRA by Texas Instruments

JM38510/37204BRA by Texas Instruments is an 8-bit bus driver with a 5V supply voltage, 50 pF load capacitance, and 17 ns propagation delay. Ideal for military applications due to MIL-M-38510 Class B screening level and operating temperature range of -55°C to 125°C. Features include 3-STATE output characteristics and positive edge trigger type.

Median Price

$54.230

Lifecycle Status

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26

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1k+

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DigiKey

USA . 364 parts In-Stock

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Verical

USA . 364 parts In-Stock

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$67.787

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$60.650

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$57.075

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$57.075

Rochester

USA . 287 parts In-Stock

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$54.230

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$48.520

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$45.660

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Avnet

USA . 36 parts In-Stock

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$40.981

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Freelance Electronics

USA . 305 parts In-Stock

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$11.967

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$12.566

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$11.847

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Ace Electronics

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American Microsemiconductor Inc.

USA . 1,700 parts In-Stock

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Digiode

USA . 2,067 parts In-Stock

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$49.770

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Vyrian

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Electronic Expediters

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Microfarads

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Mil-Aero Solutions, Inc.

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ComSIT Distribution GmbH

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Bristol Electronics

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Electronics Depot

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Inland Empire Components Inc.

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Corel Iberica Componentes, S.L.

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Resion

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J & M Industries LLC

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DF Sales Co.

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MISTER SPROCKETS

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Legend Electronics Inc.

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Odi Ramu Company

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Andel Nordic

Denmark . 1,200 parts In-Stock

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$3.032

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$2.911

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Parana Technologies

USA . 1,369 parts In-Stock

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ChromeModa Solutions

Germany . 4,446 parts In-Stock

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IDEA Electronic Components Group

UK . 2,023 parts In-Stock

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Ampacity Inc.

Singapore . 64 parts In-Stock

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Corphita

USA . 4,995 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 15,260 parts In-Stock

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DigiPath Technology Company

USA . 1,978 parts In-Stock

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Microchip USA

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Perfect Parts

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Assy Fe

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Overview

Upgrade your electronic designs with the JM38510/37204BRA by Texas Instruments, a top-quality bus driver & transceiver that delivers reliable performance in military-grade applications. With a MIL-M-38510 Class B screening level and true output polarity, this product ensures seamless data transmission with a maximum I (ol) of 24 Amp. Trust in Texas Instruments' reputation for excellence and choose this product for its value-packed benefits, including a low propagation delay of 17 ns, 3-STATE output characteristics, and a durable ceramic, glass-sealed package. Get ahead in your projects with the JM38510/37204BRA today!

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed package body provides excellent durability and reliability, making this product suitable for rugged environments.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage ensures compatibility with a wide range of systems and applications, offering flexibility in usage.

Propagation Delay (tpd): 17 ns

The low propagation delay of 17 ns allows for fast data transmission, enhancing the overall performance of the product.

Temperature Grade: MILITARY

The military-grade temperature tolerance ensures reliable operation in harsh environmental conditions, making this product ideal for military and industrial applications.

Technology: TTL

The TTL technology provides compatibility with other TTL-based systems, offering seamless integration and communication.

Technical Specifications

Bus Driver & Transceivers JM38510/37204BRA attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

ALS

JESD-30 Code:

R-GDIP-T20

JESD-609 Code:

e0

Length:

24.195 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Power Supply Current (ICC):

31 mA

Propagation Delay (tpd):

17 ns

Qualification:

Not Qualified

Screening Level:

MIL-M-38510 Class B

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Trade Compliance

JM38510/37204BRA Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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