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JM38510/37101BCA

Texas Instruments

JM38510/37101BCA by Texas Instruments

JM38510/37101BCA by Texas Instruments is a MILITARY-grade TTL latch with 2 functions, 23ns propagation delay, and 5V supply voltage. It has a ceramic package, operates b/w -55 to 125 °C, and is ideal for applications requiring fast response times in harsh environments.

Median Price

$17.730

Lifecycle Status

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27

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1k+

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Rochester

USA . 19 parts In-Stock

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$17.730

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$17.380

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$17.020

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Freelance Electronics

USA . 1,602 parts In-Stock

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Ace Electronics

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NAC Semi

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American Microsemiconductor Inc.

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Resion

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Corel Iberica Componentes, S.L.

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Mil-Aero Solutions, Inc.

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Inland Empire Components Inc.

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A2Z Electronics, Inc.

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Bristol Electronics

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Prism Electronics

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Sinequanon

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Eagle Technology Solutions

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Mentor Electronics Marketing, LLC

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Odi Ramu Company

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Legend Electronics Inc.

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Distributors (Availability)

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AZTECH Wire

Italy . 458 parts In-Stock

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Parana Technologies

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IDEA Electronic Components Group

UK . 1,616 parts In-Stock

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ChromeModa Solutions

Germany . 522 parts In-Stock

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One Stop Electronics

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DigiPath Technology Company

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Overview

Discover the unmatched reliability and precision of the JM38510/37101BCA by Texas Instruments. Crafted with top-tier materials and cutting-edge technology, this latches & flip-flops device ensures seamless performance in a variety of applications. From military-grade screenings to superior packaging, Texas Instruments guarantees quality every step of the way. Unlock the potential of your projects with a product that offers fast propagation delays, low power consumption, and a wide operating temperature range. Trust Texas Instruments to deliver excellence with the JM38510/37101BCA.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material provides durability and protection for the latch or flip-flop, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 23 ns

This fast propagation delay allows for quick response times, making it ideal for applications that require rapid switching.

No. of Functions: 2

Having multiple functions in one device saves space on the circuit board and simplifies the overall design.

Nominal Supply Voltage / Vsup (V): 5

Operating at a commonly used supply voltage simplifies integration with other components in the system.

Maximum Frequency At Nominal Supply: 25000000 Hz

Operating at a high frequency allows for fast data processing and high-speed applications.

Technical Specifications

Latches & Flip-Flops JM38510/37101BCA attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

ALS

JESD-30 Code:

R-GDIP-T14

JESD-609 Code:

e0

Length:

19.56 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

25000000 Hz

Maximum I (ol):

8 Amp

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Maximum Power Supply Current (ICC):

4 mA

Propagation Delay At Nominal Supply:

23 ns

Propagation Delay (tpd):

23 ns

Qualification:

Not Qualified

Screening Level:

MIL-M-38510 Class B

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

6.67 mm

Minimum fmax:

25 MHz

Trade Compliance

JM38510/37101BCA Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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