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JM38510/07401BDA

Texas Instruments

JM38510/07401BDA by Texas Instruments

JM38510/07401BDA by Texas Instruments is a TTL Logic Gates IC with 2 functions, 4 inputs, and 10ns propagation delay at 5V. It operates in military-grade temperature range (-55 to 125 °C) and has a flatpack package style for surface mount applications.

Median Price

$25.480

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 175 parts In-Stock

1+ parts

$22.170

100+ parts

$21.730

1k+ parts

$21.280

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175

$22.170

$21.730

$21.280

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DigiKey

USA . 175 parts In-Stock

1+ parts

-

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$28.790

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175

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$28.790

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Distributors (In-Stock)

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$22.296

100+ parts

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500

$22.296

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Digiode

USA . 4,415 parts In-Stock

1+ parts

$27.607

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4,415

$27.607

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Vyrian

USA . 6,047 parts In-Stock

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6,047

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Mil-Aero Solutions, Inc.

USA . 756 parts In-Stock

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756

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Electronic Expediters

USA . 193 parts In-Stock

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193

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Resion

USA . 28 parts In-Stock

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28

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Odi Ramu Company

Canada . 1 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 823 parts In-Stock

1+ parts

$9.383

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-

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823

$9.383

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Parana Technologies

USA . 515 parts In-Stock

1+ parts

$13.294

100+ parts

$1,234.543

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$11.965

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515

$13.294

$1,234.543

$11.965

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DigiPath Technology Company

USA . 583 parts In-Stock

1+ parts

$14.638

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$13.467

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583

$14.638

$13.467

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IDEA Electronic Components Group

UK . 575 parts In-Stock

1+ parts

$14.937

100+ parts

$14.190

1k+ parts

$13.443

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575

$14.937

$14.190

$13.443

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ChromeModa Solutions

Germany . 445 parts In-Stock

1+ parts

$14.937

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$12.248

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445

$14.937

$12.248

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Ampacity Inc.

Singapore . 73 parts In-Stock

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$24.470

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73

$24.470

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Corphita

USA . 4,429 parts In-Stock

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$26.154

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Microchip USA

USA . 1,071 parts In-Stock

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Overview

Elevate your electronic projects with the JM38510/07401BDA by Texas Instruments, a top-tier manufacturer known for high-quality components. This logic gate offers unmatched reliability and performance in a compact package, making it ideal for a wide range of applications. With fast propagation delays, dual functions, and military-grade screening, this component ensures seamless operation even in harsh environments. Experience the value and benefits of Texas Instruments' expertise with the JM38510/07401BDA, delivering precision and efficiency for your projects.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides excellent durability and reliability, making the product suitable for harsh environments.

Propagation Delay At Nominal Supply: 10 ns

Fast propagation delay ensures quick response times, making the product efficient for high-speed applications.

No. of Functions: 2

Having multiple functions in a single component saves space and simplifies circuit design.

No. of Inputs: 4

Multiple inputs allow for complex logic operations to be performed with ease.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard supply voltage makes integration with existing systems easier.

Load Capacitance (CL): 50 pF

Suitable load capacitance for efficient performance in typical applications.

Temperature Grade: MILITARY

Military-grade components are designed to meet stringent reliability and performance standards, ensuring durability in rugged conditions.

Technology: TTL

TTL technology offers fast switching speeds and low power consumption, making the product ideal for various logic operations.

Technical Specifications

Logic Gates JM38510/07401BDA attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Additional Features:

ANOTHER FUNCTION HAS 6 INPUT

Family:

S

JESD-30 Code:

R-CDFP-F14

JESD-609 Code:

e0

Length:

9.21 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

-.4 Amp

No. of Functions:

2

No. of Inputs:

4

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Power Supply Current (ICC):

22 mA

Propagation Delay At Nominal Supply:

10 ns

Propagation Delay (tpd):

5.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Screening Level:

MIL-STD-883

Maximum Seated Height:

2.03 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.29 mm

Trade Compliance

JM38510/07401BDA Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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