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ISO7831FDWW

Texas Instruments

ISO7831FDWW by Texas Instruments

ISO7831FDWW by Texas Instruments is a 16-terminal IC with 3 functions, operating at -55 to 125 °C. It has a CMOS technology, MILITARY grade, and supports a max supply voltage of 5.5 V. Ideal for interface circuits in applications requiring small outline packages and surface mount capabilities.

Median Price

$9.712

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,768 parts In-Stock

1+ parts

$9.163

100+ parts

$8.029

1k+ parts

$4.536

10k+ parts

-

1,768

$9.163

$8.029

$4.536

-

Mouser Electronics

USA . 174 parts In-Stock

1+ parts

$10.260

100+ parts

$6.910

1k+ parts

$6.700

10k+ parts

$6.620

174

$10.260

$6.910

$6.700

$6.620

DigiKey

USA . 125 parts In-Stock

1+ parts

$10.260

100+ parts

$7.157

1k+ parts

-

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125

$10.260

$7.157

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-

Arrow

USA . 90 parts In-Stock

1+ parts

-

100+ parts

$6.628

1k+ parts

$6.320

10k+ parts

$6.182

90

-

$6.628

$6.320

$6.182

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$7.450

100+ parts

-

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100

$7.450

-

-

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Digiode

USA . 3,260 parts In-Stock

1+ parts

$7.800

100+ parts

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3,260

$7.800

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-

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Vyrian

USA . 6,361 parts In-Stock

1+ parts

-

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6,361

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-

-

Chip Stock

USA . 4,694 parts In-Stock

1+ parts

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4,694

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-

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TME

Poland . 90 parts In-Stock

1+ parts

-

100+ parts

$8.380

1k+ parts

-

10k+ parts

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90

-

$8.380

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 366 parts In-Stock

1+ parts

$6.980

100+ parts

-

1k+ parts

-

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366

$6.980

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-

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Corphita

USA . 1,315 parts In-Stock

1+ parts

$7.389

100+ parts

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1,315

$7.389

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Bastille Electronics

Australia . 1,000 parts In-Stock

1+ parts

$7.450

100+ parts

$7.078

1k+ parts

-

10k+ parts

$6.630

1,000

$7.450

$7.078

-

$6.630

Parana Technologies

USA . 528 parts In-Stock

1+ parts

$8.423

100+ parts

-

1k+ parts

$9.062

10k+ parts

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528

$8.423

-

$9.062

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DigiPath Technology Company

USA . 1,646 parts In-Stock

1+ parts

$9.275

100+ parts

-

1k+ parts

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10k+ parts

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1,646

$9.275

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ChromeModa Solutions

Germany . 5,220 parts In-Stock

1+ parts

$9.464

100+ parts

$7.760

1k+ parts

-

10k+ parts

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5,220

$9.464

$7.760

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-

IDEA Electronic Components Group

UK . 206 parts In-Stock

1+ parts

$9.464

100+ parts

$8.991

1k+ parts

$8.518

10k+ parts

-

206

$9.464

$8.991

$8.518

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QUARKTWIN TECHNOLOGY LTD

USA . 14,322 parts In-Stock

1+ parts

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14,322

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iodParts Technologies Inc.

India . 5,000 parts In-Stock

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100+ parts

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5,000

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Overview

Experience the superior quality and reliability of Texas Instruments with the ISO7831FDWW. This cutting-edge interface IC offers customers a seamless solution for a variety of applications, providing unmatched value and benefits. With a small outline package and military-grade temperature rating, this product is ideal for demanding environments. Trust in Texas Instruments to deliver top-notch performance and innovation in every aspect of your project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and cost-effective, making the product suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for efficient assembly and space-saving on circuit boards.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage ensures compatibility with a variety of systems and power sources.

No. of Functions: 3

Having multiple functions in a single IC reduces the need for additional components, saving space and cost.

Package Shape: RECTANGULAR

The rectangular shape is a common and practical design for easy integration into circuit board layouts.

No. of Terminals: 16

Having a sufficient number of terminals allows for versatile connectivity options with other components.

Minimum Supply Voltage: 2.25 V

The low minimum supply voltage ensures compatibility with a wide range of power sources while maintaining functionality.

Maximum Operating Temperature: 125 °C

Being able to operate at high temperatures makes this product suitable for demanding industrial or automotive environments.

Temperature Grade: MILITARY

The military-grade temperature rating ensures reliability and performance under harsh conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall efficiency and performance.

Technical Specifications

Other Function Interface ICs ISO7831FDWW attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

3

No. of Functions:

3

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10.3 mm

Trade Compliance

ISO7831FDWW Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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