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ISO7831DWW

Texas Instruments

ISO7831DWW by Texas Instruments

ISO7831DWW by Texas Instruments is a 16-terminal IC with 3 functions, operating b/w -55 to 125 °C. It features a CMOS technology, MILITARY grade, and supports a max supply voltage of 5.5 V. Ideal for applications requiring small outline package style and dual terminal position.

Median Price

$7.296

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,147 parts In-Stock

1+ parts

$5.430

100+ parts

$5.320

1k+ parts

$5.210

10k+ parts

-

1,147

$5.430

$5.320

$5.210

-

Texas Instruments

USA . 20,850 parts In-Stock

1+ parts

$9.163

100+ parts

$8.029

1k+ parts

$4.536

10k+ parts

-

20,850

$9.163

$8.029

$4.536

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,421 parts In-Stock

1+ parts

$5.158

100+ parts

-

1k+ parts

-

10k+ parts

-

3,421

$5.158

-

-

-

Vyrian

USA . 6,420 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,420

-

-

-

-

Chip Stock

USA . 1,125 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,125

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,457 parts In-Stock

1+ parts

$4.887

100+ parts

-

1k+ parts

-

10k+ parts

-

2,457

$4.887

-

-

-

Parana Technologies

USA . 867 parts In-Stock

1+ parts

$6.634

100+ parts

-

1k+ parts

$7.353

10k+ parts

-

867

$6.634

-

$7.353

-

DigiPath Technology Company

USA . 1,842 parts In-Stock

1+ parts

$7.305

100+ parts

$6.721

1k+ parts

-

10k+ parts

-

1,842

$7.305

$6.721

-

-

ChromeModa Solutions

Germany . 5,584 parts In-Stock

1+ parts

$7.454

100+ parts

$6.112

1k+ parts

-

10k+ parts

-

5,584

$7.454

$6.112

-

-

IDEA Electronic Components Group

UK . 2,117 parts In-Stock

1+ parts

$7.454

100+ parts

-

1k+ parts

$6.709

10k+ parts

-

2,117

$7.454

-

$6.709

-

AZTECH Wire

Italy . 202 parts In-Stock

1+ parts

$12.610

100+ parts

-

1k+ parts

-

10k+ parts

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202

$12.610

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 15,999 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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15,999

-

-

-

-

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,000

-

-

-

-

Overview

Discover the innovative ISO7831DWW by Texas Instruments, a top-quality product in the category of Other Function Interface ICs. With its advanced technology and military-grade temperature grade, this interface circuit offers unmatched reliability and performance. Perfect for a wide range of applications, this small outline package boasts three functions and dual terminal positions, making it a versatile solution for your electronic needs. Trust Texas Instruments for cutting-edge products that deliver value and benefits to customers, ensuring seamless integration and superior results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This lightweight and durable material ensures the IC is protected from external elements, making it suitable for a wide range of applications.

Surface Mount: YES

The surface mount feature enables easy and efficient installation of the IC on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows the IC to operate reliably in various voltage conditions, improving its overall performance and versatility.

No. of Functions: 3

With multiple functions integrated into a single IC, it offers enhanced functionality while saving space and cost in the circuit design.

Package Shape: RECTANGULAR

The rectangular package shape gives a compact form factor, facilitating easy integration of the IC into different electronic devices with limited space.

No. of Terminals: 16

The high number of terminals provide flexibility in connecting the IC to external components, enabling complex circuit designs and diverse functionality.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, allowing for higher component density and more compact electronic devices.

Minimum Supply Voltage: 2.25 V

The low minimum supply voltage ensures efficient power consumption and operation at lower voltage levels, suitable for a wide range of applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature range ensures the IC can withstand elevated temperatures without performance degradation, enhancing its reliability in harsh environments.

Minimum Operating Temperature: -55 °C

The wide temperature range allows the IC to function effectively in extreme cold conditions, making it suitable for use in diverse environments.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections and long-term performance of the IC.

Maximum Seated Height: 2.65 mm

The low seated height allows for a slim profile and compact design, making the IC suitable for space-constrained applications and slim devices.

Width: 10.3 mm

The compact width of the IC enables efficient utilization of space on the circuit board, allowing for streamlined design and layout.

Maximum Time At Peak Reflow Temperature (s): 30

This specification indicates the maximum time the IC can be exposed to peak reflow temperature during assembly, ensuring proper soldering and optimal performance.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for reliable soldering of the IC on the circuit board, ensuring strong connections and durability.

Length: 14 mm

The moderate length of the IC contributes to its compact form factor and ease of integration into various electronic devices and systems.

Temperature Grade: MILITARY

The military-grade temperature rating ensures the IC can operate in demanding environmental conditions, making it suitable for rugged applications.

No. of Channels: 3

With multiple channels available, the IC can handle multiple signals or data streams simultaneously, enhancing its functionality and versatility.

Technology: CMOS

The CMOS technology used in the IC offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems for efficient operation.

Terminal Form: GULL WING

The gull wing terminal form allows for easy soldering and secure mounting of the IC on the circuit board, ensuring reliable connections and long-term performance.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage provides a standard operating voltage for the IC, ensuring consistent performance and compatibility with other components in the system.

Terminal Pitch: 1.27 mm

The tight terminal pitch allows for close spacing of terminals, enabling high-density mounting and compact design of the IC on the circuit board.

Moisture Sensitivity Level (MSL): 2

The MSL rating indicates the IC's sensitivity to moisture during storage and assembly, ensuring proper handling and storage procedures to prevent damage.

Interface IC Type: INTERFACE CIRCUIT

As an interface circuit IC, this product facilitates communication and data exchange between different components or systems, enhancing connectivity and interoperability.

Technical Specifications

Other Function Interface ICs ISO7831DWW attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

3

No. of Functions:

3

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10.3 mm

Trade Compliance

ISO7831DWW Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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