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ISO7821DW

Texas Instruments

ISO7821DW by Texas Instruments

ISO7821DW by Texas Instruments is a dual-function interface IC with 16 terminals. It operates b/w -55 to 125 °C, suitable for military-grade applications. With a supply voltage range of 2.25V to 5.5V, it features CMOS technology and is surface-mountable in small outline package style.

Median Price

$7.140

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 24,850 parts In-Stock

1+ parts

$5.670

100+ parts

$4.968

1k+ parts

$2.807

10k+ parts

-

24,850

$5.670

$4.968

$2.807

-

Mouser Electronics

USA . 200 parts In-Stock

1+ parts

$7.140

100+ parts

$4.930

1k+ parts

$4.470

10k+ parts

-

200

$7.140

$4.930

$4.470

-

DigiKey

USA . 105 parts In-Stock

1+ parts

$7.140

100+ parts

$4.928

1k+ parts

-

10k+ parts

-

105

$7.140

$4.928

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$3.903

100+ parts

-

1k+ parts

-

10k+ parts

-

150

$3.903

-

-

-

Digiode

USA . 2,558 parts In-Stock

1+ parts

$5.386

100+ parts

-

1k+ parts

-

10k+ parts

-

2,558

$5.386

-

-

-

Chip Stock

USA . 7,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,500

-

-

-

-

Vyrian

USA . 4,312 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,312

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$3.903

100+ parts

-

1k+ parts

$3.708

10k+ parts

$3.630

2,000

$3.903

-

$3.708

$3.630

Ampacity Inc.

Singapore . 8,024 parts In-Stock

1+ parts

$4.820

100+ parts

-

1k+ parts

-

10k+ parts

-

8,024

$4.820

-

-

-

Corphita

USA . 3,425 parts In-Stock

1+ parts

$5.103

100+ parts

-

1k+ parts

-

10k+ parts

-

3,425

$5.103

-

-

-

Parana Technologies

USA . 2,251 parts In-Stock

1+ parts

$7.933

100+ parts

$736.659

1k+ parts

$7.139

10k+ parts

-

2,251

$7.933

$736.659

$7.139

-

DigiPath Technology Company

USA . 713 parts In-Stock

1+ parts

$8.735

100+ parts

$8.036

1k+ parts

-

10k+ parts

-

713

$8.735

$8.036

-

-

ChromeModa Solutions

Germany . 1,833 parts In-Stock

1+ parts

$8.913

100+ parts

$7.309

1k+ parts

-

10k+ parts

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1,833

$8.913

$7.309

-

-

IDEA Electronic Components Group

UK . 532 parts In-Stock

1+ parts

$8.913

100+ parts

$8.467

1k+ parts

$8.022

10k+ parts

-

532

$8.913

$8.467

$8.022

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Lixinc

USA . 9,750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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9,750

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-

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,000

-

-

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Overview

Enhance your electronic designs with the ISO7821DW by Texas Instruments, a top-quality interface IC that offers reliability and performance. Manufactured by a trusted industry leader, this product boasts a wide range of applications in various electronic devices. With its small outline package style and military-grade temperature grade, this IC provides customers with durable and efficient solutions for their projects. Experience the benefits of dual functions, nickel palladium gold terminal finish, and a maximum supply voltage of 5.5V. Trust Texas Instruments to deliver exceptional value and innovation with the ISO7821DW.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the IC, ensuring long-term reliability.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and cost in manufacturing.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this IC can handle a wide range of power inputs, making it versatile for various applications.

No. of Functions: 2

Having multiple functions in a single IC saves space on the PCB and simplifies the overall design of the system.

Package Shape: RECTANGULAR

Rectangular package shape is common and easy to work with during PCB layout and assembly.

No. of Terminals: 16

With 16 terminals, this IC can provide multiple connection points for interfacing with other components or devices.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB, allowing for more compact and efficient electronic designs.

Minimum Supply Voltage: 2.25 V

Low minimum supply voltage enables operation in low-power environments, ideal for energy-efficient applications.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures the IC can function reliably in challenging thermal environments.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature allows for the IC to operate in extreme cold conditions without issues.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish provides good conductivity and corrosion resistance, enhancing the longevity of the IC.

Terminal Position: DUAL

Dual terminal position offers flexibility in PCB layout and ensures secure connections for reliable performance.

Maximum Seated Height: 2.65 mm

Low seated height saves vertical space in the overall system design, useful for compact electronic devices.

Width: 7.5 mm

Narrow width helps in accommodating the IC in tight spaces or densely populated PCB layouts.

Maximum Time At Peak Reflow Temperature (s): 30

A short time at peak reflow temperature ensures proper soldering and assembly of the IC without damage.

Peak Reflow Temperature °C: 260

High peak reflow temperature withstands the soldering process, ensuring secure attachment to the PCB.

Length: 10.3 mm

Compact length makes it easier to place the IC on the PCB and optimize the use of available space.

Temperature Grade: MILITARY

Military-grade temperature rating indicates high reliability and performance in harsh environmental conditions.

No. of Channels: 2

Having 2 channels allows for concurrent operations or interfacing with multiple devices, enhancing functionality.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC suitable for a wide range of applications.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and inspection during PCB assembly, ensuring proper connectivity.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage ensures consistent performance and compatibility with common power sources.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows for easy routing of traces on the PCB and compatibility with common assembly processes.

Moisture Sensitivity Level (MSL): 2

MSL level 2 indicates moderate sensitivity to moisture, making the IC suitable for a wide range of storage and operating conditions.

Interface IC Type: INTERFACE CIRCUIT

Being an interface circuit IC, this product facilitates communication between different parts of a system, enabling seamless operation.

Technical Specifications

Other Function Interface ICs ISO7821DW attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

2

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

ISO7821DW Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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