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ISO7820FDW

Texas Instruments

ISO7820FDW by Texas Instruments

The Texas Instruments ISO7820FDW is a dual-function interface IC with 16 terminals, operating b/w -55 to 125°C. It has a supply voltage range of 2.25-5.5V and uses CMOS technology. Ideal for military-grade applications requiring small outline packages and surface-mount capabilities at peak reflow temperatures up to 260°C.

Median Price

$6.148

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,182 parts In-Stock

1+ parts

$5.155

100+ parts

$4.517

1k+ parts

$2.552

10k+ parts

-

2,182

$5.155

$4.517

$2.552

-

DigiKey

USA . 386 parts In-Stock

1+ parts

$7.140

100+ parts

$4.928

1k+ parts

$4.414

10k+ parts

-

386

$7.140

$4.928

$4.414

-

Mouser Electronics

USA . 162 parts In-Stock

1+ parts

$7.140

100+ parts

$4.930

1k+ parts

$4.290

10k+ parts

-

162

$7.140

$4.930

$4.290

-

Arrow

USA . 400 parts In-Stock

1+ parts

-

100+ parts

$3.280

1k+ parts

$3.032

10k+ parts

-

400

-

$3.280

$3.032

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 644 parts In-Stock

1+ parts

$4.094

100+ parts

-

1k+ parts

-

10k+ parts

-

644

$4.094

-

-

-

Vyrian

USA . 5,520 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,520

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,609 parts In-Stock

1+ parts

$3.879

100+ parts

-

1k+ parts

-

10k+ parts

-

1,609

$3.879

-

-

-

Parana Technologies

USA . 750 parts In-Stock

1+ parts

$5.251

100+ parts

$487.635

1k+ parts

$4.726

10k+ parts

-

750

$5.251

$487.635

$4.726

-

DigiPath Technology Company

USA . 2,249 parts In-Stock

1+ parts

$5.782

100+ parts

$5.319

1k+ parts

-

10k+ parts

-

2,249

$5.782

$5.319

-

-

ChromeModa Solutions

Germany . 3,281 parts In-Stock

1+ parts

$5.900

100+ parts

$4.838

1k+ parts

-

10k+ parts

-

3,281

$5.900

$4.838

-

-

IDEA Electronic Components Group

UK . 1,430 parts In-Stock

1+ parts

$5.900

100+ parts

-

1k+ parts

$5.310

10k+ parts

-

1,430

$5.900

-

$5.310

-

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,000

-

-

-

-

Perfect Parts

USA . 224 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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224

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-

-

Overview

Unlock seamless connectivity and reliable performance with the Texas Instruments ISO7820FDW. Crafted with precision and expertise, this cutting-edge Other Function Interface IC offers unparalleled quality and versatility for a wide range of applications. From industrial automation to automotive systems, this small outline package delivers superior functionality with dual channels and a military-grade temperature grade. Elevate your projects with the value and benefits this innovative technology brings, ensuring optimal performance and efficiency every time. Trust Texas Instruments to provide unmatched solutions for your interface circuit needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and cost-effective.

Surface Mount: YES

Being surface mountable allows for easier and more efficient PCB assembly.

Maximum Supply Voltage: 5.5 V

Supports a relatively high supply voltage, suitable for various applications.

No. of Functions: 2

Having multiple functions in a single IC increases versatility and efficiency.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into circuit designs.

No. of Terminals: 16

Sufficient number of terminals for connecting to external components.

Package Style (Meter): SMALL OUTLINE

Small outline package saves space on the PCB and enables compact designs.

Minimum Operating Temperature: -55 °C

Wide operating temperature range allows for use in different environmental conditions.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliable performance even in extreme conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish provides good conductivity and prevents corrosion.

Terminal Position: DUAL

Dual terminal position offers flexibility in the layout and connection options.

Width: 7.5 mm

Narrow width enables compact placement on the PCB.

Maximum Seated Height: 2.65 mm

Low seated height saves vertical space in the system design.

Technology: CMOS

CMOS technology ensures low power consumption and compatibility with various devices.

Nominal Supply Voltage: 2.5 V

Stable and standard supply voltage for efficient operation.

Terminal Pitch: 1.27 mm

Standard terminal pitch for easy PCB layout and soldering.

Technical Specifications

Other Function Interface ICs ISO7820FDW attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRED VCC2 SUPPLY 2.25-5.5V SUPPLY

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

2

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

ISO7820FDW Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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