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ISO7810FDWW

Texas Instruments

ISO7810FDWW by Texas Instruments

The Texas Instruments ISO7810FDWW is a small outline interface IC with 16 terminals, operating b/w -55 to 125 °C. It has a supply voltage range of 2.25V to 5.5V and uses CMOS technology. Ideal for military-grade applications requiring a max reflow temperature of 260C in a moisture-sensitive environment (MSL:3).

Median Price

$7.576

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,047 parts In-Stock

1+ parts

$5.723

100+ parts

$5.014

1k+ parts

$2.833

10k+ parts

-

4,047

$5.723

$5.014

$2.833

-

Mouser Electronics

USA . 210 parts In-Stock

1+ parts

$9.430

100+ parts

$5.240

1k+ parts

$4.810

10k+ parts

$4.490

210

$9.430

$5.240

$4.810

$4.490

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,630 parts In-Stock

1+ parts

$5.437

100+ parts

-

1k+ parts

-

10k+ parts

-

2,630

$5.437

-

-

-

Cyclops Electronics Ltd

UK . 6,600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,600

-

-

-

-

Vyrian

USA . 5,549 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,549

-

-

-

-

Chip Stock

USA . 2,618 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,618

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,505 parts In-Stock

1+ parts

$5.151

100+ parts

-

1k+ parts

-

10k+ parts

-

3,505

$5.151

-

-

-

Parana Technologies

USA . 1,209 parts In-Stock

1+ parts

$10.675

100+ parts

-

1k+ parts

$11.168

10k+ parts

-

1,209

$10.675

-

$11.168

-

DigiPath Technology Company

USA . 1,534 parts In-Stock

1+ parts

$11.754

100+ parts

$10.814

1k+ parts

-

10k+ parts

-

1,534

$11.754

$10.814

-

-

ChromeModa Solutions

Germany . 6,103 parts In-Stock

1+ parts

$11.994

100+ parts

$9.835

1k+ parts

-

10k+ parts

-

6,103

$11.994

$9.835

-

-

IDEA Electronic Components Group

UK . 1,655 parts In-Stock

1+ parts

$11.994

100+ parts

$11.394

1k+ parts

$10.795

10k+ parts

-

1,655

$11.994

$11.394

$10.795

-

Authorized Procurement Solutions

USA . 3,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,500

-

-

-

-

Overview

Discover the cutting-edge technology of the ISO7810FDWW by Texas Instruments, a top-of-the-line Other Function Interface IC that guarantees unparalleled quality and reliability. Designed with precision and expertise, this industry-leading product offers a wide array of applications, making it ideal for various projects. From its superior package body material to its advanced terminal finish, every detail has been thoughtfully crafted to exceed expectations. Elevate your work with the unmatched value, benefits, and advantages that only Texas Instruments can provide. Experience innovation like never before with the ISO7810FDWW.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide a durable and lightweight package for the IC, ensuring long-term reliability and ease of handling.

Surface Mount: YES

Surface mount technology allows for easy and efficient mounting on PCBs, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 5.5 V

Supports a wide range of supply voltages, making it versatile for different power requirements in various applications.

Package Shape: RECTANGULAR

Rectangular shape is a common form factor, making it compatible with standard PCB layouts and integration into existing designs.

No. of Terminals: 16

With 16 terminals, this IC offers ample connectivity options for interfacing with other components in a circuit.

Package Style (Meter): SMALL OUTLINE

Small outline package style helps in conserving space on the PCB, ideal for compact electronic devices and systems.

Minimum Supply Voltage: 2.25 V

Supports lower supply voltage operation, enabling energy-efficient performance and compatibility with low-power applications.

Maximum Operating Temperature: 125 °C

High maximum operating temperature tolerance ensures reliable operation even in harsh environmental conditions or during heavy usage.

Minimum Operating Temperature: -55 °C

Wide temperature range allows for operation in extreme cold environments, making it suitable for a variety of applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel, palladium, and gold terminal finish offer excellent conductivity, corrosion resistance, and solderability for reliable electrical connections.

Terminal Position: DUAL

Dual terminal position provides flexibility in PCB layout and component orientation, accommodating different design requirements.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time allows for quick and efficient assembly during manufacturing processes, reducing production time and costs.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper solder melting and joint formation, leading to reliable mechanical and electrical connections.

Temperature Grade: MILITARY

Military-grade temperature rating indicates high reliability and performance under extreme temperature conditions, suitable for demanding applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems and devices.

Terminal Form: GULL WING

Gull-wing terminal form provides secure mechanical attachment during soldering, preventing joint failure and ensuring long-term reliability.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage simplifies power management and ensures consistent performance in the target operating range.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, requiring standard precautions during storage and handling to prevent damage.

Interface IC Type: INTERFACE CIRCUIT

Designed specifically as an interface circuit IC, it offers dedicated functionality for connecting different parts of a system or enabling communication between devices.

Technical Specifications

Other Function Interface ICs ISO7810FDWW attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRE VCC2 FROM 2.25 -5.5V; ALSO OPERATE WITH 3.3V AND 5 V SUPPLY

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

ISO7810FDWW Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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