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ISO7760DW

Texas Instruments

ISO7760DW by Texas Instruments

ISO7760DW by Texas Instruments is a CMOS interface IC with 6 functions, 6 channels, and MILITARY temperature grade. It operates b/w -55 to 125 °C, with supply voltage range of 2.25-5.5 V. Ideal for applications requiring small outline package style and dual terminal position.

Median Price

$4.785

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 7,859 parts In-Stock

1+ parts

$3.812

100+ parts

$3.108

1k+ parts

$2.072

10k+ parts

-

7,859

$3.812

$3.108

$2.072

-

Farnell

UK . 6 parts In-Stock

1+ parts

$4.080

100+ parts

-

1k+ parts

-

10k+ parts

-

6

$4.080

-

-

-

DigiKey

USA . 102 parts In-Stock

1+ parts

$5.490

100+ parts

$3.739

1k+ parts

-

10k+ parts

-

102

$5.490

$3.739

-

-

Mouser Electronics

USA . 76 parts In-Stock

1+ parts

$7.270

100+ parts

$5.080

1k+ parts

$3.210

10k+ parts

$3.050

76

$7.270

$5.080

$3.210

$3.050

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 39 parts In-Stock

1+ parts

$3.108

100+ parts

-

1k+ parts

-

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39

$3.108

-

-

-

Digiode

USA . 4,972 parts In-Stock

1+ parts

$3.621

100+ parts

-

1k+ parts

-

10k+ parts

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4,972

$3.621

-

-

-

EXC GmbH

Germany . 214 parts In-Stock

1+ parts

$18.312

100+ parts

-

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-

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214

$18.312

-

-

-

Vyrian

USA . 2,239 parts In-Stock

1+ parts

-

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2,239

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 2,861 parts In-Stock

1+ parts

$3.108

100+ parts

-

1k+ parts

-

10k+ parts

-

2,861

$3.108

-

-

-

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$3.108

100+ parts

-

1k+ parts

$2.953

10k+ parts

$2.890

1,000

$3.108

-

$2.953

$2.890

Ampacity Inc.

Singapore . 2,051 parts In-Stock

1+ parts

$3.240

100+ parts

-

1k+ parts

-

10k+ parts

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2,051

$3.240

-

-

-

Corphita

USA . 2,924 parts In-Stock

1+ parts

$3.431

100+ parts

-

1k+ parts

-

10k+ parts

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2,924

$3.431

-

-

-

Continental Prestige Electronics

USA . 6 parts In-Stock

1+ parts

$4.080

100+ parts

-

1k+ parts

-

10k+ parts

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6

$4.080

-

-

-

Corohmni

South Africa . 1 parts In-Stock

1+ parts

$7.162

100+ parts

-

1k+ parts

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10k+ parts

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1

$7.162

-

-

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Parana Technologies

USA . 1,463 parts In-Stock

1+ parts

$10.269

100+ parts

-

1k+ parts

$10.801

10k+ parts

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1,463

$10.269

-

$10.801

-

DigiPath Technology Company

USA . 934 parts In-Stock

1+ parts

$11.307

100+ parts

-

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934

$11.307

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-

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IDEA Electronic Components Group

UK . 1,911 parts In-Stock

1+ parts

$11.538

100+ parts

$10.961

1k+ parts

$10.384

10k+ parts

-

1,911

$11.538

$10.961

$10.384

-

ChromeModa Solutions

Germany . 854 parts In-Stock

1+ parts

$11.538

100+ parts

$9.461

1k+ parts

-

10k+ parts

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854

$11.538

$9.461

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Lixinc

USA . 6,176 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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6,176

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A-Z Elektronik GmbH

Germany . 1,419 parts In-Stock

1+ parts

-

100+ parts

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1,419

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Overview

Unlock a world of seamless connectivity and reliability with the Texas Instruments ISO7760DW. As a leader in the industry, Texas Instruments sets the standard for quality and innovation. This versatile interface circuit offers 6 functions in a compact package, making it ideal for a wide range of applications. With a maximum supply voltage of 5.5V and military-grade temperature tolerance, the ISO7760DW ensures optimal performance in any environment. Trust Texas Instruments to deliver superior products that provide value, reliability, and peace of mind to our customers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and cost-effectiveness, making it a reliable choice for various applications.

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards, saving time and reducing manufacturing costs.

Maximum Supply Voltage: 5.5 V

Supports a wide range of voltage inputs, increasing compatibility with different power sources.

No. of Functions: 6

Offers multiple functions in a single component, saving space and simplifying design complexity.

Package Shape: RECTANGULAR

Compact and standardized shape allows for easy integration into existing electronic designs.

No. of Terminals: 16

Provides multiple connection points for interfacing with other components, improving overall system flexibility.

Package Style (Meter): SMALL OUTLINE

Compact size makes it suitable for applications with space constraints without compromising functionality.

Minimum Supply Voltage: 2.25 V

Accommodates lower voltage requirements, ensuring compatibility with a wide range of devices.

Maximum Operating Temperature: 125 °C

Withstands high temperatures, making it suitable for operation in challenging environments.

Minimum Operating Temperature: -55 °C

Capable of functioning in extreme cold conditions, expanding the range of possible applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Provides corrosion resistance and reliable electrical connections for long-term performance.

Terminal Position: DUAL

Dual terminal positioning offers redundancy and improved signal integrity for critical applications.

Maximum Seated Height: 2.65 mm

Low-profile design saves space and allows for compact product designs.

Width: 7.5 mm

Narrow width enables efficient use of PCB real estate, optimizing overall system layout.

Peak Reflow Temperature °C: 260

Capable of withstanding high-temperature soldering processes, ensuring reliable assembly.

Length: 10.3 mm

Compact length enhances versatility and compatibility with various circuit board layouts.

Temperature Grade: MILITARY

Military-grade components offer enhanced reliability and performance in demanding applications.

No. of Channels: 6

Multiple channels provide increased functionality and flexibility for signal processing and communication.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and robust mechanical connections for reliability in harsh environments.

Nominal Supply Voltage: 2.5 V

Standard voltage level for compatibility with common power sources, ensuring ease of integration.

Terminal Pitch: 1.27 mm

Standard terminal pitch simplifies PCB layout and enables compatibility with industry-standard components.

Moisture Sensitivity Level (MSL): 2

MSL 2 rating indicates moderate sensitivity to moisture, suitable for most manufacturing environments.

Interface IC Type: INTERFACE CIRCUIT

Provides seamless integration between different parts of a system, enhancing overall performance and functionality.

Technical Specifications

Other Function Interface ICs ISO7760DW attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRED VCC2 2.25-5.5V SUPPLY; ALSO OPERATE WITH 3.3V AND 5V SUPPLY

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

6

No. of Functions:

6

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

ISO7760DW Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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