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ISO7721QDWQ1

Texas Instruments

ISO7721QDWQ1 by Texas Instruments

ISO7721QDWQ1 by Texas Instruments is a CMOS digital isolator with 2 channels, operating at -40 to 125 °C. It has a supply voltage range of 2.25-5.5 V and AEC-Q100 screening for automotive applications. The package is small outline, rectangular in shape, with 16 terminals on a gull wing form factor.

Median Price

$2.380

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 765 parts In-Stock

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$2.380

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765

$2.380

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Distributors (In-Stock)

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Digiode

USA . 2,806 parts In-Stock

1+ parts

$2.261

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2,806

$2.261

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Chip Stock

USA . 23,845 parts In-Stock

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Vyrian

USA . 4,470 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 3,055 parts In-Stock

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$2.142

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$2.142

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Parana Technologies

USA . 640 parts In-Stock

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$10.830

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$11.309

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640

$10.830

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$11.309

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AZTECH Wire

Italy . 257 parts In-Stock

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$11.080

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257

$11.080

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DigiPath Technology Company

USA . 2,018 parts In-Stock

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$11.926

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$10.972

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$11.926

$10.972

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IDEA Electronic Components Group

UK . 2,241 parts In-Stock

1+ parts

$12.169

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$11.561

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$10.952

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$12.169

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$10.952

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ChromeModa Solutions

Germany . 1,044 parts In-Stock

1+ parts

$12.169

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$9.979

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$12.169

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Overview

Discover the superior quality and reliability of the ISO7721QDWQ1 by Texas Instruments, a leading manufacturer in the industry. This digital isolator offers a wide range of applications in automotive settings, ensuring optimal performance and safety. With its advanced technology and durable construction, this product guarantees seamless operation and peace of mind for customers. Upgrade your systems with the ISO7721QDWQ1 and experience unparalleled value and efficiency like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for automotive applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5V, this product can handle a wide range of voltage inputs, making it versatile for different applications.

No. of Functions: 2

Having 2 functions in one IC allows for more functionality in a single component, reducing the need for multiple ICs and simplifying the design.

Screening Level: AEC-Q100

The AEC-Q100 screening level indicates that this product meets the rigorous automotive industry standards for reliability and performance.

Package Shape: RECTANGULAR

The rectangular package shape is common and easy to handle, fitting well in standard circuit board designs.

No. of Terminals: 16

Having 16 terminals provides sufficient connectivity options for various input and output requirements, making it adaptable to different circuit configurations.

Minimum Operating Temperature: -40 °C

The wide temperature range of -40 to 125°C ensures that the product can function reliably in extreme temperature conditions, such as automotive environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish offers excellent conductivity, corrosion resistance, and solderability, ensuring reliable connections and long-term performance.

Width: 7.5 mm

The compact width of 7.5mm saves space on the circuit board, allowing for more components to be integrated within a limited area.

Technical Specifications

Other Function Interface ICs ISO7721QDWQ1 attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRED VCC2 SUPPLY 2.25-5.5V SUPPLY; ALSO OPERATE WITH 3.3V AND 5V SUPPLY

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

2

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

ISO7721QDWQ1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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