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ISO7321FCD

Texas Instruments

ISO7321FCD by Texas Instruments

ISO7321FCD by Texas Instruments is a dual-function interface IC with 2 channels. It operates b/w -40 to 125°C, suitable for automotive applications. With a small outline package and nickel palladium gold finish, it supports a supply voltage range of 3.3V to 5V.

Median Price

$5.892

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 46,742 parts In-Stock

1+ parts

$2.834

100+ parts

$2.483

1k+ parts

$1.403

10k+ parts

-

46,742

$2.834

$2.483

$1.403

-

DigiKey

USA . 152 parts In-Stock

1+ parts

$8.950

100+ parts

$6.004

1k+ parts

$5.783

10k+ parts

-

152

$8.950

$6.004

$5.783

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 200 parts In-Stock

1+ parts

$2.105

100+ parts

-

1k+ parts

-

10k+ parts

-

200

$2.105

-

-

-

Digiode

USA . 2,104 parts In-Stock

1+ parts

$2.692

100+ parts

-

1k+ parts

-

10k+ parts

-

2,104

$2.692

-

-

-

Chip Stock

USA . 26,100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

26,100

-

-

-

-

Vyrian

USA . 2,331 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,331

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 4,243 parts In-Stock

1+ parts

$2.105

100+ parts

-

1k+ parts

-

10k+ parts

$2.062

4,243

$2.105

-

-

$2.062

Argo Parts USA

USA . 1,938 parts In-Stock

1+ parts

$2.105

100+ parts

-

1k+ parts

-

10k+ parts

-

1,938

$2.105

-

-

-

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$2.105

100+ parts

-

1k+ parts

$1.999

10k+ parts

$1.957

1,000

$2.105

-

$1.999

$1.957

Semicontronic

India . 23,318 parts In-Stock

1+ parts

$2.410

100+ parts

$2.350

1k+ parts

$2.338

10k+ parts

-

23,318

$2.410

$2.350

$2.338

-

Ampacity Inc.

Singapore . 23,161 parts In-Stock

1+ parts

$2.410

100+ parts

-

1k+ parts

-

10k+ parts

-

23,161

$2.410

-

-

-

Corphita

USA . 1,044 parts In-Stock

1+ parts

$2.551

100+ parts

-

1k+ parts

-

10k+ parts

-

1,044

$2.551

-

-

-

Parana Technologies

USA . 1,470 parts In-Stock

1+ parts

$12.605

100+ parts

$1,170.572

1k+ parts

$11.345

10k+ parts

-

1,470

$12.605

$1,170.572

$11.345

-

Corohmni

South Africa . 286 parts In-Stock

1+ parts

$12.863

100+ parts

-

1k+ parts

-

10k+ parts

-

286

$12.863

-

-

-

DigiPath Technology Company

USA . 1,295 parts In-Stock

1+ parts

$13.880

100+ parts

-

1k+ parts

-

10k+ parts

-

1,295

$13.880

-

-

-

ChromeModa Solutions

Germany . 473 parts In-Stock

1+ parts

$14.163

100+ parts

$11.614

1k+ parts

-

10k+ parts

-

473

$14.163

$11.614

-

-

IDEA Electronic Components Group

UK . 407 parts In-Stock

1+ parts

$14.163

100+ parts

$13.455

1k+ parts

$12.747

10k+ parts

-

407

$14.163

$13.455

$12.747

-

Lixinc

USA . 4,340 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,340

-

-

-

-

Robosynatics

Brazil . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

Lucentia Tech

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

Overview

Experience superior quality and reliability with the ISO7321FCD by Texas Instruments, a leading manufacturer in the industry. This versatile interface IC offers a wide range of applications, ensuring seamless integration into various systems. With its compact design and high-performance capabilities, this product provides unmatched value and benefits to customers. Trust in Texas Instruments for innovative solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and provides good protection to the internal components of the IC.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and reducing costs.

Maximum Supply Voltage: 5 V

Can handle higher supply voltages, making it versatile for various applications.

No. of Functions: 2

Having multiple functions in a single IC reduces the need for additional components and saves space on the PCB.

Package Shape: RECTANGULAR

Rectangular shape is common and easy to mount on PCBs.

No. of Terminals: 8

Sufficient number of terminals for connecting to other components in the circuit.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB and is ideal for compact designs.

Minimum Supply Voltage: 3.3 V

Can operate at lower supply voltages, suitable for low power applications.

Maximum Operating Temperature: 125 °C

Can withstand high operating temperatures, suitable for automotive and industrial applications.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold temperatures, making it suitable for outdoor and rugged environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish provides good electrical conductivity and prevents corrosion.

Terminal Position: DUAL

Dual terminal position allows for easy and secure connection to the PCB.

Maximum Seated Height: 1.75 mm

Low seated height saves space on the PCB and is suitable for thin designs.

Width: 3.895 mm

Compact width helps in designing compact and space-saving PCB layouts.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a sufficient duration during assembly process.

Peak Reflow Temperature °C: 260

Can handle high reflow temperatures during the soldering process.

Length: 4.905 mm

Compact length helps in designing compact and space-saving PCB layouts.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards for reliability and performance in automotive applications.

No. of Channels: 2

Having multiple channels allows for handling multiple signals or data streams simultaneously.

Terminal Form: GULL WING

Gull wing terminal form provides secure mechanical and electrical connection to the PCB.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage for consistent performance in various applications.

Terminal Pitch: 1.27 mm

Standard terminal pitch for easy PCB layout and assembly.

Moisture Sensitivity Level (MSL): 2

MSL 2 indicates that the IC can withstand standard moisture exposure during storage and transport.

Interface IC Type: INTERFACE CIRCUIT

Specifically designed as an interface circuit for connecting different components in a system.

Technical Specifications

Other Function Interface ICs ISO7321FCD attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Additional Features:

VCC2 SUPPLY FROM 3 TO 5.5 V

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.905 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

2

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

5 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.895 mm

Trade Compliance

ISO7321FCD Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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