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ISO7310FCQDQ1

Texas Instruments

ISO7310FCQDQ1 by Texas Instruments

ISO7310FCQDQ1 by Texas Instruments is an AEC-Q100 compliant interface IC with 8 terminals, operating at -40 to 125 °C. It has a supply voltage range of 3.3V to 5V and is designed for automotive applications requiring small outline packaging and surface mount capabilities.

Median Price

$2.959

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 150 parts In-Stock

1+ parts

$2.670

100+ parts

$1.680

1k+ parts

$1.540

10k+ parts

$1.500

150

$2.670

$1.680

$1.540

$1.500

Texas Instruments

USA . 4,012 parts In-Stock

1+ parts

$2.959

100+ parts

$2.444

1k+ parts

$1.321

10k+ parts

-

4,012

$2.959

$2.444

$1.321

-

Verical

USA . 150 parts In-Stock

1+ parts

-

100+ parts

$5.031

1k+ parts

$4.368

10k+ parts

$4.325

150

-

$5.031

$4.368

$4.325

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,633 parts In-Stock

1+ parts

$2.252

100+ parts

-

1k+ parts

-

10k+ parts

-

1,633

$2.252

-

-

-

Vyrian

USA . 4,048 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,048

-

-

-

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Sensible Micro Corp

USA . 1,183 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,183

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,909 parts In-Stock

1+ parts

$2.133

100+ parts

-

1k+ parts

-

10k+ parts

-

3,909

$2.133

-

-

-

Parana Technologies

USA . 123 parts In-Stock

1+ parts

$4.837

100+ parts

$449.203

1k+ parts

$4.353

10k+ parts

-

123

$4.837

$449.203

$4.353

-

DigiPath Technology Company

USA . 456 parts In-Stock

1+ parts

$5.326

100+ parts

-

1k+ parts

-

10k+ parts

-

456

$5.326

-

-

-

ChromeModa Solutions

Germany . 1,748 parts In-Stock

1+ parts

$5.435

100+ parts

$4.457

1k+ parts

-

10k+ parts

-

1,748

$5.435

$4.457

-

-

IDEA Electronic Components Group

UK . 451 parts In-Stock

1+ parts

$5.435

100+ parts

-

1k+ parts

$4.892

10k+ parts

-

451

$5.435

-

$4.892

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,000

-

-

-

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Perfect Parts

USA . 168 parts In-Stock

1+ parts

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100+ parts

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168

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Overview

Discover the superior quality and reliability of Texas Instruments with the ISO7310FCQDQ1, an interface IC designed for automotive applications. With a compact design and high-performance capabilities, this product offers customers unmatched value and benefits. Trust in Texas Instruments' years of experience and innovation to deliver a cutting-edge solution that meets your needs with precision and efficiency. Upgrade your automotive electronics with the ISO7310FCQDQ1 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures the IC is lightweight and durable, making it suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easier assembly processes and saves space on the PCB, making it a convenient choice for compact designs.

Maximum Supply Voltage: 5 V

With a high maximum supply voltage, this IC can handle a wide range of power inputs, increasing its versatility in different systems.

Screening Level: AEC-Q100

Having undergone AEC-Q100 screening ensures that this IC meets the automotive industry's stringent quality standards, making it suitable for automotive applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on the PCB, enabling compact and streamlined designs.

No. of Terminals: 8

The 8 terminals provide ample connectivity options for interfacing with other components, making it versatile for different circuit configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and is easy to handle during assembly, making it a practical choice for compact designs.

Minimum Supply Voltage: 3.3 V

The low minimum supply voltage ensures compatibility with systems that operate at lower power levels, enhancing its usability in a variety of applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature tolerance allows the IC to function reliably even in elevated temperature conditions, ensuring optimal performance in harsh environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the IC to operate effectively in cold environments, making it suitable for a wide range of operating conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections for stable performance over time.

Terminal Position: DUAL

The dual terminal position offers flexibility in PCB layout and enables secure connections, making it easier to integrate this IC into different circuit designs.

Maximum Seated Height: 1.75 mm

The low maximum seated height allows for a compact overall PCB profile, which is beneficial for space-constrained applications.

Width: 3.895 mm

The narrow width makes this IC suitable for applications where space is limited, enabling compact and efficient PCB designs.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature ensures proper soldering during assembly processes, contributing to the overall reliability of the IC.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature tolerance, this IC can withstand the soldering process without compromising its performance, ensuring robust reliability.

Length: 4.905 mm

The compact length of the IC contributes to space-saving on the PCB, making it suitable for small form factor designs.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this IC meets the stringent temperature requirements and durability standards of the automotive industry.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and ease of soldering during assembly, ensuring secure connections for reliable performance.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage indicates the standard operating voltage for this IC, ensuring compatibility with a wide range of systems and applications.

Terminal Pitch: 1.27 mm

The 1.27mm terminal pitch offers easy connections and facilitates PCB layout, making it convenient for assembly and integration into circuit designs.

Moisture Sensitivity Level (MSL): 2

With an MSL of 2, this IC can withstand moderate levels of moisture exposure during storage and assembly processes, ensuring long-term reliability.

Interface IC Type: INTERFACE CIRCUIT

As an interfacing circuit type IC, this product facilitates communication and data exchange between different components, making it essential for various electronic devices and systems.

Technical Specifications

Other Function Interface ICs ISO7310FCQDQ1 attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Additional Features:

IT ALSO OPERATES AT 5V

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.905 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

5 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.895 mm

Trade Compliance

ISO7310FCQDQ1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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