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ISO7230ADWG4

Texas Instruments

ISO7230ADWG4 by Texas Instruments

ISO7230ADWG4 by Texas Instruments is a 16-terminal IC with 3 functions, operating at -40 to 125 °C. It has a supply voltage range of 3.15-3.6 V and is suitable for automotive applications due to its small outline package style and dual terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,850 parts In-Stock

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7,850

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Digiode

USA . 3,349 parts In-Stock

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3,349

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 792 parts In-Stock

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792

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 862 parts In-Stock

1+ parts

$5.561

100+ parts

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862

$5.561

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Parana Technologies

USA . 1,529 parts In-Stock

1+ parts

$9.274

100+ parts

-

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$9.906

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1,529

$9.274

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$9.906

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DigiPath Technology Company

USA . 1,413 parts In-Stock

1+ parts

$10.212

100+ parts

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1,413

$10.212

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ChromeModa Solutions

Germany . 3,224 parts In-Stock

1+ parts

$10.420

100+ parts

$8.544

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3,224

$10.420

$8.544

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IDEA Electronic Components Group

UK . 794 parts In-Stock

1+ parts

$10.420

100+ parts

$9.899

1k+ parts

$9.378

10k+ parts

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794

$10.420

$9.899

$9.378

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One Stop Electronics

USA . 559 parts In-Stock

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$33.500

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559

$33.500

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QUARKTWIN TECHNOLOGY LTD

USA . 23,685 parts In-Stock

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23,685

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Corphita

USA . 4,482 parts In-Stock

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4,482

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A-Z Elektronik GmbH

Germany . 543 parts In-Stock

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543

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Overview

Unlock a world of reliable connectivity and seamless integration with the ISO7230ADWG4 by Texas Instruments. Crafted with precision and expertise, this interface IC offers unmatched quality and performance for a wide range of applications. Whether you're in automotive electronics or industrial automation, this product delivers superior functionality and efficiency. Trust in Texas Instruments to provide you with cutting-edge solutions that enhance your projects and streamline your operations. Elevate your designs with the ISO7230ADWG4 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and resistance to environmental factors, making the product suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage ensures compatibility with a wide range of power sources, increasing the versatility of the product.

No. of Functions: 3

Having multiple functions in a single IC simplifies circuit design and integration, reducing the overall complexity of the system.

Package Shape: RECTANGULAR

Rectangular package shape allows for efficient use of space on the circuit board, optimizing the layout and design of the overall system.

No. of Terminals: 16

Having a sufficient number of terminals provides flexibility in connecting the IC to other components, enabling a wide range of applications.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space and allows for compact designs, particularly beneficial in applications with limited board space.

Minimum Supply Voltage: 3.15 V

The low minimum supply voltage ensures efficient operation even with lower power sources, enhancing the product's compatibility with different systems.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Nickel/Palladium/Gold terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable performance over an extended period.

Terminal Position: DUAL

Dual terminal position allows for flexible mounting options, facilitating easy installation and enhancing the product's usability.

Maximum Seated Height: 2.65 mm

Low maximum seated height minimizes the overall profile of the IC, contributing to space-saving design and efficient use of board space.

Width: 7.5 mm

Compact width dimension enables the IC to fit in narrow spaces, increasing design flexibility and allowing for versatile integration in various applications.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures secure soldering during assembly, guaranteeing the reliability and longevity of the product.

Length: 10.3 mm

Optimal length dimension provides a balance between space-saving design and functional integration, contributing to the overall efficiency of the product.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade certification indicates the IC's reliability and suitability for automotive applications, meeting industry standards for performance and durability.

Terminal Form: GULL WING

Gull wing terminal form allows for easy soldering and reliable connection, simplifying installation and ensuring stable performance in various operating conditions.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage defines the standard operating voltage of the IC, providing compatibility with typical power sources and ensuring consistent performance.

Terminal Pitch: 1.27 mm

The standard terminal pitch allows for easy connection to other components, facilitating efficient integration and ensuring compatibility with industry-standard spacing.

Moisture Sensitivity Level (MSL): 2

MSL 2 rating indicates the IC's resistance to moisture and humidity, ensuring reliability in various environmental conditions and extending the product's lifespan.

Interface IC Type: INTERFACE CIRCUIT

Designed as an interface circuit, the IC enables seamless communication between different components and systems, enhancing the overall functionality and performance of the product.

Technical Specifications

Other Function Interface ICs ISO7230ADWG4 attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 4.5V TO 5.5V SUPPLY

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

3

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.15 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

ISO7230ADWG4 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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