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ISO722MDRG4

Texas Instruments

ISO722MDRG4 by Texas Instruments

ISO722MDRG4 by Texas Instruments is an 8-terminal interface IC with a supply voltage range of 3.3V to 5V, operating b/w -40°C to 125°C. It features a small outline package style suitable for automotive applications, with nickel palladium gold terminal finish and gull wing form factor. This IC is designed for surface mount assembly in various electronic systems requiring reliable signal isolation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,183 parts In-Stock

1+ parts

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8,183

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Digiode

USA . 3,083 parts In-Stock

1+ parts

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3,083

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Nova Conductors

Japan . 90 parts In-Stock

1+ parts

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90

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 684 parts In-Stock

1+ parts

$5.099

100+ parts

-

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684

$5.099

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Ampacity Inc.

Singapore . 1,531 parts In-Stock

1+ parts

$9.500

100+ parts

-

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1,531

$9.500

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Parana Technologies

USA . 1,062 parts In-Stock

1+ parts

$10.855

100+ parts

-

1k+ parts

$11.332

10k+ parts

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1,062

$10.855

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$11.332

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DigiPath Technology Company

USA . 1,666 parts In-Stock

1+ parts

$11.953

100+ parts

$10.997

1k+ parts

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10k+ parts

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1,666

$11.953

$10.997

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ChromeModa Solutions

Germany . 1,164 parts In-Stock

1+ parts

$12.197

100+ parts

$10.002

1k+ parts

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10k+ parts

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1,164

$12.197

$10.002

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IDEA Electronic Components Group

UK . 1,118 parts In-Stock

1+ parts

$12.197

100+ parts

$11.587

1k+ parts

$10.977

10k+ parts

-

1,118

$12.197

$11.587

$10.977

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AZTECH Wire

Italy . 641 parts In-Stock

1+ parts

$16.798

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641

$16.798

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One Stop Electronics

USA . 765 parts In-Stock

1+ parts

$41.500

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765

$41.500

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Argo Parts USA

USA . 1,550 parts In-Stock

1+ parts

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1,550

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Corphita

USA . 890 parts In-Stock

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890

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Continental Prestige Electronics

USA . 163 parts In-Stock

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163

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Bastille Electronics

Australia . 120 parts In-Stock

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120

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Overview

Experience top-notch performance and reliability with the Texas Instruments ISO722MDRG4, a cutting-edge interface circuit designed for various applications. Texas Instruments, a renowned manufacturer, ensures superior quality and innovation in every product. With its compact design and advanced features, this IC offers unmatched value and benefits to customers looking for seamless integration and enhanced functionality in their projects. Upgrade your systems with the ISO722MDRG4 and unlock a world of possibilities in automotive and industrial applications.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package ensures durability and protection for the IC, making it reliable for various applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and simplifying assembly processes.

Maximum Supply Voltage: 5 V

Support for a maximum supply voltage of 5V enables compatibility with a wide range of systems and power sources.

Package Shape: RECTANGULAR

Rectangular package shape provides efficient use of space on the PCB, optimizing layout and design.

No. of Terminals: 8

Having 8 terminals allows for versatile connectivity options and enables the IC to interface with multiple components.

Minimum Supply Voltage: 3.3 V

Support for a minimum supply voltage of 3.3V ensures flexibility in power requirements and compatibility with lower voltage systems.

Maximum Operating Temperature: 125 °C

High maximum operating temperature of 125°C ensures reliable performance in demanding environments without overheating.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C allows for use in extreme cold conditions without compromising functionality.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Width: 3.9 mm

Compact width of 3.9mm enables the IC to be used in space-constrained designs without sacrificing performance.

Length: 4.9 mm

Short length of 4.9mm contributes to the overall small form factor of the IC, making it suitable for compact devices.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature tolerance ensures the IC can withstand harsh temperature fluctuations commonly found in automotive applications.

Terminal Form: GULL WING

Gull Wing terminal form simplifies soldering and PCB assembly, making the installation process more efficient and reliable.

Terminal Pitch: 1.27 mm

Fine terminal pitch of 1.27mm allows for high-density mounting on the PCB, facilitating compact and space-saving designs.

Interface IC Type: INTERFACE CIRCUIT

Designed specifically as an interface circuit IC, this product offers specialized functionality for seamless communication between different components.

Technical Specifications

Other Function Interface ICs ISO722MDRG4 attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

5 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

ISO722MDRG4 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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