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ISO7220BD

Texas Instruments

ISO7220BD by Texas Instruments

ISO7220BD by Texas Instruments is a dual-channel interface IC with CMOS technology. It operates b/w -40 to 125°C, suitable for automotive applications. With a supply voltage range of 3.3V to 5V and compact dimensions of 4.905mm x 3.895mm, it offers reliable signal isolation in small outline packages.

Median Price

$3.793

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 78 parts In-Stock

1+ parts

$3.710

100+ parts

$2.365

1k+ parts

-

10k+ parts

-

78

$3.710

$2.365

-

-

Mouser Electronics

USA . 332 parts In-Stock

1+ parts

$3.930

100+ parts

$2.890

1k+ parts

$2.460

10k+ parts

$2.080

332

$3.930

$2.890

$2.460

$2.080

RS (Exports)

UK . 936 parts In-Stock

1+ parts

-

100+ parts

$3.793

1k+ parts

-

10k+ parts

-

936

-

$3.793

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$1.946

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$1.946

-

-

-

Digiode

USA . 3,449 parts In-Stock

1+ parts

$3.524

100+ parts

-

1k+ parts

-

10k+ parts

-

3,449

$3.524

-

-

-

Chip Stock

USA . 21,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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21,000

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-

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Vyrian

USA . 8,176 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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8,176

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ComSIT Distribution GmbH

Germany . 59 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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59

-

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 6,420 parts In-Stock

1+ parts

$1.946

100+ parts

-

1k+ parts

-

10k+ parts

$1.907

6,420

$1.946

-

-

$1.907

Argo Parts USA

USA . 947 parts In-Stock

1+ parts

$1.946

100+ parts

-

1k+ parts

-

10k+ parts

-

947

$1.946

-

-

-

Netroflash

USA . 100 parts In-Stock

1+ parts

$1.946

100+ parts

-

1k+ parts

$1.848

10k+ parts

$1.809

100

$1.946

-

$1.848

$1.809

Corohmni

South Africa . 81 parts In-Stock

1+ parts

$2.075

100+ parts

-

1k+ parts

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10k+ parts

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81

$2.075

-

-

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Ampacity Inc.

Singapore . 335 parts In-Stock

1+ parts

$3.150

100+ parts

-

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335

$3.150

-

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Semicontronic

India . 84 parts In-Stock

1+ parts

$3.150

100+ parts

$3.071

1k+ parts

$3.056

10k+ parts

-

84

$3.150

$3.071

$3.056

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Corphita

USA . 2,125 parts In-Stock

1+ parts

$3.339

100+ parts

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2,125

$3.339

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Parana Technologies

USA . 1,217 parts In-Stock

1+ parts

$12.589

100+ parts

-

1k+ parts

$13.044

10k+ parts

-

1,217

$12.589

-

$13.044

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ChromeModa Solutions

Germany . 2,166 parts In-Stock

1+ parts

$14.145

100+ parts

$11.599

1k+ parts

-

10k+ parts

-

2,166

$14.145

$11.599

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-

IDEA Electronic Components Group

UK . 1,282 parts In-Stock

1+ parts

$14.145

100+ parts

$13.438

1k+ parts

$12.730

10k+ parts

-

1,282

$14.145

$13.438

$12.730

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Lixinc

USA . 17,299 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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17,299

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-

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S.R.D Solutions

India . 4,000 parts In-Stock

1+ parts

-

100+ parts

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4,000

-

-

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DigiPath Technology Company

USA . 30 parts In-Stock

1+ parts

-

100+ parts

$12.753

1k+ parts

-

10k+ parts

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30

-

$12.753

-

-

Overview

Experience the superior quality and reliability of Texas Instruments with the ISO7220BD, a cutting-edge interface circuit designed for a wide range of applications. With a small outline package and automotive-grade temperature rating, this IC offers unmatched performance and durability. Trust in Texas Instruments to provide innovative solutions that exceed your expectations, ensuring seamless integration and optimal functionality for your projects. Elevate your designs with the ISO7220BD and unlock limitless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material ensures product longevity and ease of handling.

Surface Mount: YES

Enables easy and efficient installation onto circuit boards.

Maximum Supply Voltage: 5 V

Supports a wide range of voltage requirements for compatibility with various systems.

Minimum Supply Voltage: 3.3 V

Allows for lower power operation when necessary.

Maximum Operating Temperature: 125 °C

Can withstand high temperature environments, suitable for automotive applications.

Minimum Operating Temperature: -40 °C

Operational in extreme cold conditions, enhancing product versatility.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides corrosion resistance and ensures stable electrical connections.

No. of Channels: 2

Offers multiple communication paths for enhanced functionality.

Technology: CMOS

Utilizes low power consumption and provides high noise immunity.

Temperature Grade: AUTOMOTIVE

Suitable for automotive use withstanding harsh temperature conditions.

Technical Specifications

Other Function Interface ICs ISO7220BD attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.905 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

5 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.895 mm

Trade Compliance

ISO7220BD Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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