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GC5337IZEV

Texas Instruments

GC5337IZEV by Texas Instruments

Texas Instruments GC5337IZEV is a DSP with 16-bit external data bus, 310 MHz clock frequency, and 484 terminals. Ideal for industrial applications, it operates b/w -40 to 85°C with a supply voltage range of 1.05-1.2 V and supports boundary scan testing.

Median Price

$120.480

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 1 parts In-Stock

1+ parts

$30.120

100+ parts

-

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1

$30.120

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Rochester

USA . 1,494 parts In-Stock

1+ parts

$123.530

100+ parts

$116.120

1k+ parts

$108.710

10k+ parts

-

1,494

$123.530

$116.120

$108.710

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DigiKey

USA . 1,494 parts In-Stock

1+ parts

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1,494

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Arrow

USA . 1 parts In-Stock

1+ parts

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100+ parts

$120.480

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1

-

$120.480

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,127 parts In-Stock

1+ parts

$30.120

100+ parts

-

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4,127

$30.120

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Digiode

USA . 2,797 parts In-Stock

1+ parts

$114.456

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2,797

$114.456

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Connector Distribution Corp

USA . 25 parts In-Stock

1+ parts

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25

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Right Parts Inc.

USA . 25 parts In-Stock

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25

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 1,936 parts In-Stock

1+ parts

$19.960

100+ parts

-

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1,936

$19.960

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Native Components

USA . 936 parts In-Stock

1+ parts

$26.563

100+ parts

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936

$26.563

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Parana Technologies

USA . 459 parts In-Stock

1+ parts

$28.610

100+ parts

-

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$49.503

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459

$28.610

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$49.503

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Northwest PG Solutions

USA . 93 parts In-Stock

1+ parts

$29.219

100+ parts

$26.297

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93

$29.219

$26.297

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ChromeModa Solutions

Germany . 3,868 parts In-Stock

1+ parts

$32.146

100+ parts

$26.360

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3,868

$32.146

$26.360

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IDEA Electronic Components Group

UK . 2,086 parts In-Stock

1+ parts

$32.146

100+ parts

$30.539

1k+ parts

$28.931

10k+ parts

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2,086

$32.146

$30.539

$28.931

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Corphita

USA . 2,213 parts In-Stock

1+ parts

$108.432

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2,213

$108.432

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Authorized Procurement Solutions

USA . 6,500 parts In-Stock

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6,500

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DigiPath Technology Company

USA . 1,676 parts In-Stock

1+ parts

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100+ parts

$28.983

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1,676

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$28.983

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Kepictronics

USA . 366 parts In-Stock

1+ parts

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366

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Infinite Electronics LLP (Excess)

. 68 parts In-Stock

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68

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Overview

Experience unparalleled performance with the GC5337IZEV by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality digital signal processors that are perfect for a wide range of applications. This versatile DSP offers customers exceptional value, benefits, and advantages, making it the perfect choice for your next project. Transform your designs with the cutting-edge technology and reliability that only Texas Instruments can provide. Choose the GC5337IZEV and see the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product reliable and affordable.

Surface Mount: YES

Being surface mountable allows for easier and more efficient assembly of electronic devices.

Maximum Supply Voltage: 1.15 V

Operates efficiently within a safe voltage range to prevent damage to the device.

Address Bus Width: 8

With a wider address bus, the DSP can handle a larger amount of memory and process more data efficiently.

Package Shape: SQUARE

Square shape packages are known for their compact design, saving space in electronic devices.

Power Supplies (V): 1.2, 1.8, 3.3

Supports multiple power supply options for versatility in different applications.

No. of Terminals: 484

Having a high number of terminals allows for more connections and functionalities in the DSP.

Package Style (Meter): GRID ARRAY

Grid array packages provide better electrical performance and thermal characteristics compared to other styles.

Minimum Supply Voltage: 1.05 V

Even at lower voltage levels, the DSP can operate efficiently without compromising performance.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures, making it suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Works reliably in cold temperatures, ensuring functionality in various operating conditions.

Terminal Finish: TIN SILVER COPPER

This finish provides good electrical conductivity and corrosion resistance for reliable connections.

Terminal Position: BOTTOM

Bottom terminal position allows for easier PCB layout and routing of traces.

Maximum Seated Height: 2.48 mm

Low profile design saves space and enables the DSP to be used in compact electronic devices.

Width: 23 mm

Optimal width for fitting into standard electronic equipment and PCB layouts.

Boundary Scan: YES

Boundary scan feature helps in testing and debugging the DSP during production and maintenance.

External Data Bus Width: 16

With a wider data bus, the DSP can handle larger chunks of data for processing efficiently.

Maximum Clock Frequency: 310 MHz

High clock frequency allows for fast data processing and performance in real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand high reflow temperatures for a specified duration during manufacturing processes.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C ensures efficient soldering during assembly.

Internal Bus Architecture: SINGLE

Single bus architecture simplifies the design and operation of the DSP, improving efficiency.

Length: 23 mm

Compact length allows for easy integration and placement in electronic devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environmental conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Supports various peripheral ICs for added functionality and versatility in different applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall performance.

Terminal Form: BALL

Ball terminal form provides reliable connections and easy soldering during assembly.

Nominal Supply Voltage: 1.1 V

Stable nominal supply voltage ensures consistent performance of the DSP.

Terminal Pitch: 1 mm

Fine terminal pitch allows for high-density mounting and compact design of the DSP.

Format: FLOATING POINT

Floating-point format enables precise mathematical calculations and complex signal processing tasks.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate moisture sensitivity, suitable for standard manufacturing and assembly processes.

Technical Specifications

Digital Signal Processors (DSPs) GC5337IZEV attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

8

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

310 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

NO

Internal Bus Architecture:

SINGLE

JESD-30 Code:

S-PBGA-B484

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

484

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA484,22X22,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.48 mm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.15 V

Minimum Supply Voltage:

1.05 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

GC5337IZEV Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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