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GC5330IZEV

Texas Instruments

GC5330IZEV by Texas Instruments

Texas Instruments GC5330IZEV is a DSP with 484 terminals, operating at 310MHz. It has an 8-bit address bus width and supports a 16-bit external data bus. Ideal for industrial applications requiring high-speed processing in a compact package.

Median Price

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Lifecycle Status

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5

In-Stock Inventory

1k+

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Vyrian

USA . 2,700 parts In-Stock

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Digiode

USA . 1,642 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 2 parts In-Stock

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Bristol Electronics

USA . 2 parts In-Stock

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Dan-Mar Components

USA . 2 parts In-Stock

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One Stop Electronics

USA . 1,435 parts In-Stock

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$13.000

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AZTECH Wire

Italy . 537 parts In-Stock

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$16.299

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537

$16.299

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Parana Technologies

USA . 95 parts In-Stock

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$24.562

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$25.229

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95

$24.562

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$25.229

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DigiPath Technology Company

USA . 615 parts In-Stock

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$27.046

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615

$27.046

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ChromeModa Solutions

Germany . 6,518 parts In-Stock

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$27.598

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$22.630

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$22.630

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IDEA Electronic Components Group

UK . 124 parts In-Stock

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$27.598

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$26.218

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$24.838

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Corohmni

South Africa . 828 parts In-Stock

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$59.137

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Native Components

USA . 586 parts In-Stock

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$63.779

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$61.228

586

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Northwest PG Solutions

USA . 40 parts In-Stock

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$70.157

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Lixinc

USA . 11,989 parts In-Stock

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Corphita

USA . 2,910 parts In-Stock

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Kepictronics

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A-Z Elektronik GmbH

Germany . 270 parts In-Stock

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Perfect Parts

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Overview

Experience unparalleled performance and efficiency with the GC5330IZEV by Texas Instruments, a leading manufacturer of cutting-edge Digital Signal Processors. Perfect for a wide range of applications, this DSP offers customers unmatched value and benefits. With a maximum clock frequency of 310 MHz and a temperature grade of industrial, this product delivers superior quality and reliability. Say goodbye to limitations and elevate your projects with the GC5330IZEV.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package material offers good durability and protection for the DSP, making it suitable for a variety of environments.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on PCBs, saving space and enabling automated assembly processes.

Maximum Supply Voltage: 1.15 V

With a maximum supply voltage of 1.15V, this DSP is efficient in terms of power consumption, making it suitable for applications where power efficiency is important.

Address Bus Width: 8

The wide address bus width of 8 enhances the processing capabilities of the DSP, allowing for efficient data manipulation and management.

Package Shape: SQUARE

The square package shape is space-efficient and allows for easy placement on PCBs, contributing to a compact overall design.

Power Supplies (V): 1.2, 1.8, 3.3

Having multiple power supply options (1.2V, 1.8V, 3.3V) provides flexibility in designing and powering the DSP according to the specific requirements of the application.

No. of Terminals: 484

The high number of terminals (484) allows for a wide range of input/output connections, enabling versatility in connectivity for various interfaces and peripherals.

Package Style (Meter): GRID ARRAY

The grid array package style offers enhanced reliability and signal integrity, making it suitable for high-performance applications requiring stable and consistent connections.

Minimum Supply Voltage: 1.05 V

With a minimum supply voltage of 1.05V, the DSP can operate efficiently even at lower power inputs, ensuring reliable performance in diverse operating conditions.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows the DSP to function reliably in elevated temperature environments without performance degradation.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures the DSP can operate in cold conditions without loss of functionality or reliability.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides good conductivity and corrosion resistance, ensuring stable and secure connections for long-term performance.

Terminal Position: BOTTOM

Having the terminals positioned at the bottom simplifies PCB layout and assembly, making it easier to integrate the DSP into circuit designs.

Maximum Seated Height: 2.48 mm

The low maximum seated height of 2.48 mm allows for a compact overall design, contributing to space-saving and efficient board layout.

Width: 23 mm

The moderate width of 23 mm provides a good balance between size and functionality, making the DSP suitable for various applications without compromising on performance.

Boundary Scan: YES

Having boundary scan capability enhances testing and debugging processes, ensuring easier and more accurate detection of faults or errors in the DSP.

External Data Bus Width: 16

The wide external data bus width of 16 enables fast and efficient data transfer between the DSP and external components, enhancing overall processing speed and performance.

Maximum Clock Frequency: 310 MHz

The high maximum clock frequency of 310 MHz allows for rapid data processing and high-speed performance, making the DSP suitable for demanding real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

The DSP can withstand a peak reflow temperature for up to 30 seconds, ensuring reliable soldering and assembly processes without risking damage to the component.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures proper soldering and bonding during assembly, contributing to the overall reliability and longevity of the DSP.

Internal Bus Architecture: SINGLE

The single internal bus architecture simplifies data flow and processing within the DSP, enhancing efficiency and reducing complexity in designing and implementing algorithms.

Length: 23 mm

The moderate length of 23 mm complements the width and height dimensions, contributing to a balanced and compact package that can be easily integrated into various system designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environmental conditions, making the DSP suitable for industrial and automotive applications requiring robust performance.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

With a peripheral IC type of digital signal processor and other functionality, this DSP offers versatile processing capabilities and can be customized for specific application requirements.

Technology: CMOS

Utilizing CMOS technology provides low power consumption and high integration density, making the DSP energy-efficient and suitable for portable devices and battery-powered applications.

Terminal Form: BALL

The ball terminal form ensures secure and reliable connections, allowing for efficient heat dissipation and ensuring stable performance under varying thermal conditions.

Nominal Supply Voltage: 1.1 V

The nominal supply voltage of 1.1V provides a stable operating voltage for the DSP, ensuring consistent performance and reliable operation over a range of operating conditions.

Terminal Pitch: 1 mm

The small terminal pitch of 1 mm facilitates high-density mounting and compact PCB design, enabling efficient use of PCB space and supporting miniaturization of electronic devices.

Format: FLOATING POINT

Featuring a floating-point format enhances numerical precision and enables accurate computation of complex algorithms, making the DSP suitable for applications requiring high computational accuracy.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates that the DSP is moderately sensitive to moisture exposure, requiring proper handling and storage to prevent potential damage during assembly and operation.

Technical Specifications

Digital Signal Processors (DSPs) GC5330IZEV attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

8

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

310 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

NO

Internal Bus Architecture:

SINGLE

JESD-30 Code:

S-PBGA-B484

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

484

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA484,22X22,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.48 mm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.15 V

Minimum Supply Voltage:

1.05 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

GC5330IZEV Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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