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ESD122DMXR

Texas Instruments

ESD122DMXR by Texas Instruments

ESD122DMXR by Texas Instruments is a transient suppression device with common anode, 2 elements. It has a max non-repetitive peak reverse power dissipation of 20W and max clamping voltage of 13.5V. Ideal for protecting electronic circuits from electrostatic discharge in various applications.

Median Price

$0.436

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 10,000 parts In-Stock

1+ parts

$0.344

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$0.234

1k+ parts

$0.120

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-

10,000

$0.344

$0.234

$0.120

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Arrow

USA . 183 parts In-Stock

1+ parts

$0.439

100+ parts

$0.310

1k+ parts

$0.214

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183

$0.439

$0.310

$0.214

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Mouser Electronics

USA . 9,694 parts In-Stock

1+ parts

$1.130

100+ parts

$0.463

1k+ parts

$0.302

10k+ parts

$0.247

9,694

$1.130

$0.463

$0.302

$0.247

DigiKey

USA . 57,714 parts In-Stock

1+ parts

$1.180

100+ parts

$0.484

1k+ parts

$0.340

10k+ parts

$0.278

57,714

$1.180

$0.484

$0.340

$0.278

Verical

USA . 4,996 parts In-Stock

1+ parts

-

100+ parts

$0.434

1k+ parts

$0.279

10k+ parts

$0.248

4,996

-

$0.434

$0.279

$0.248

Chip1Stop

Japan . 3,833 parts In-Stock

1+ parts

-

100+ parts

$0.228

1k+ parts

$0.157

10k+ parts

$0.130

3,833

-

$0.228

$0.157

$0.130

Distributors (In-Stock)

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$0.209

100+ parts

-

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100

$0.209

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Digiode

USA . 3,188 parts In-Stock

1+ parts

$0.327

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3,188

$0.327

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Cyclops Electronics Ltd

UK . 374,597 parts In-Stock

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374,597

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Sensible Micro Corp

USA . 70,885 parts In-Stock

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Component Sense

UK . 36,877 parts In-Stock

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Chip Stock

USA . 18,500 parts In-Stock

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Vyrian

USA . 11,193 parts In-Stock

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Bristol Electronics

USA . 280 parts In-Stock

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280

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Elcom Components

USA . 111 parts In-Stock

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111

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Prism Electronics

USA . 74 parts In-Stock

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74

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Semtec, LLC

USA . 40 parts In-Stock

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40

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 142 parts In-Stock

1+ parts

$0.039

100+ parts

-

1k+ parts

$1.423

10k+ parts

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142

$0.039

-

$1.423

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DigiPath Technology Company

USA . 258 parts In-Stock

1+ parts

$0.043

100+ parts

$0.040

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258

$0.043

$0.040

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ChromeModa Solutions

Germany . 2,824 parts In-Stock

1+ parts

$0.044

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$0.036

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2,824

$0.044

$0.036

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IDEA Electronic Components Group

UK . 1,229 parts In-Stock

1+ parts

$0.044

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$0.040

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1,229

$0.044

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$0.040

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Advanced Electronics

New Zealand . 15 parts In-Stock

1+ parts

$0.054

100+ parts

$0.051

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$0.051

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15

$0.054

$0.051

$0.051

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Corohmni

South Africa . 43 parts In-Stock

1+ parts

$0.099

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43

$0.099

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Continental Prestige Electronics

USA . 6,034 parts In-Stock

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$0.209

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$0.205

6,034

$0.209

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Argo Parts USA

USA . 3,490 parts In-Stock

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$0.209

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$0.203

3,490

$0.209

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Netroflash

USA . 100 parts In-Stock

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$0.209

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$0.205

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Ampacity Inc.

Singapore . 11,182 parts In-Stock

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$0.213

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Corphita

USA . 3,633 parts In-Stock

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$0.310

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Semicontronic

India . 14,686 parts In-Stock

1+ parts

$0.464

100+ parts

$0.452

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$0.450

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14,686

$0.464

$0.452

$0.450

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Kepictronics

USA . 46,870 parts In-Stock

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A-Z Elektronik GmbH

Germany . 14,804 parts In-Stock

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Lixinc

USA . 11,030 parts In-Stock

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Futuretech Components

Singapore . 10,000 parts In-Stock

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GreenTree Electronics

Israel . 10,000 parts In-Stock

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Formix International (Excess)

India . 642 parts In-Stock

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642

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Overview

Enhance the protection of your electronic devices with the ESD122DMXR by Texas Instruments, a top-notch transient suppression device designed to safeguard against voltage spikes and surges. Manufactured by industry-leading Texas Instruments, this product offers superior quality and reliability for a variety of applications. With its common anode configuration and bidirectional polarity, the ESD122DMXR ensures optimal performance and peace of mind for customers. Invest in the best with Texas Instruments and protect your valuable electronics today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside the package, ensuring long-term reliability.

Maximum Non Repetitive Peak Reverse Power Dissipation: 20 W

The high power dissipation capability makes this device suitable for handling surges and spikes in electrical systems.

Maximum Reverse Current: 0.01 uA

Low reverse current ensures minimal power loss and efficient operation of the device.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this device can withstand harsh environmental conditions.

Minimum Breakdown Voltage: 5 V

The low breakdown voltage means that the device can quickly divert excess voltage away from sensitive components, providing protection against transient events.

Technical Specifications

Transient Suppression Devices ESD122DMXR attributes and parameters. Explore more Transient Suppression Devices devices from Texas Instruments

Specs

Maximum Breakdown Voltage:

7.9 V

Minimum Breakdown Voltage:

5 V

Maximum Clamping Voltage:

13.5 V

Config:

COMMON ANODE, 2 ELEMENTS

Diode Element Material:

SILICON

JESD-30 Code:

R-PQFP-N3

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

Maximum Non Repetitive Peak Reverse Power Dissipation:

20 W

No. of Elements:

2

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Polarity:

BIDIRECTIONAL

Reference Standard:

IEC-61000-4-2, 4-4, 4-5

Maximum Repetitive Peak Reverse Voltage:

3.6 V

Maximum Reverse Current:

.01 uA

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

ESD122DMXR Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.80

SB

8541.10.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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