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ESD130B1W0201E6327XTSA1

Infineon Technologies

ESD130B1W0201E6327XTSA1 by Infineon Technologies

Infineon Technologies' ESD130B1W0201E6327XTSA1 is a single-configured, surface mount transient suppression device with a max non-repetitive peak reverse power dissipation of 27.5 W. It operates in temperatures ranging from -55 to 125 °C and complies with IEC-61000-4-2, 4-4, and 4-5 standards. This diode-type device is commonly used for voltage suppression applications due to its bidirectional polarity and silicon diode element material.

Median Price

$0.139

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Distrelec

Netherlands . 14,975 parts In-Stock

1+ parts

$0.225

100+ parts

$0.172

1k+ parts

$0.118

10k+ parts

$0.096

14,975

$0.225

$0.172

$0.118

$0.096

Mouser Electronics

USA . 64,706 parts In-Stock

1+ parts

$0.230

100+ parts

$0.082

1k+ parts

$0.047

10k+ parts

$0.033

64,706

$0.230

$0.082

$0.047

$0.033

Newark

USA . 13,525 parts In-Stock

1+ parts

$0.238

100+ parts

$0.083

1k+ parts

$0.048

10k+ parts

-

13,525

$0.238

$0.083

$0.048

-

DigiKey

USA . 68,513 parts In-Stock

1+ parts

$0.250

100+ parts

$0.093

1k+ parts

$0.060

10k+ parts

$0.045

68,513

$0.250

$0.093

$0.060

$0.045

Rochester

USA . 40,688,740 parts In-Stock

1+ parts

-

100+ parts

$0.028

1k+ parts

$0.023

10k+ parts

$0.021

40,688,740

-

$0.028

$0.023

$0.021

Verical

USA . 40,353,650 parts In-Stock

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-

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40,353,650

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Arrow

USA . 45,000 parts In-Stock

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45,000

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Future Electronics

Canada . 15,000 parts In-Stock

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15,000

-

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Element14

Singapore . 14,890 parts In-Stock

1+ parts

-

100+ parts

$0.064

1k+ parts

$0.036

10k+ parts

$0.035

14,890

-

$0.064

$0.036

$0.035

RS (Exports)

UK . 14,880 parts In-Stock

1+ parts

-

100+ parts

$0.139

1k+ parts

$0.121

10k+ parts

$0.077

14,880

-

$0.139

$0.121

$0.077

Farnell

UK . 14,540 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.024

10k+ parts

$0.023

14,540

-

-

$0.024

$0.023

Chip1Stop

Japan . 6,632 parts In-Stock

1+ parts

-

100+ parts

$0.018

1k+ parts

$0.018

10k+ parts

$0.017

6,632

-

$0.018

$0.018

$0.017

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 735 parts In-Stock

1+ parts

$0.022

100+ parts

-

1k+ parts

-

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735

$0.022

-

-

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Nova Conductors

Japan . 51 parts In-Stock

1+ parts

$0.046

100+ parts

-

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51

$0.046

-

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Vyrian

USA . 5,343,890 parts In-Stock

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5,343,890

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Chip Stock

USA . 16,180 parts In-Stock

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TME

Poland . 15,000 parts In-Stock

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Greenchips

USA . 14,950 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 6,303,009 parts In-Stock

1+ parts

$0.015

100+ parts

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6,303,009

$0.015

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Semicontronic

India . 6,302,859 parts In-Stock

1+ parts

$0.015

100+ parts

$0.015

1k+ parts

$0.015

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-

6,302,859

$0.015

$0.015

$0.015

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Aztec Data Supply Inc.

USA . 24,207 parts In-Stock

1+ parts

$0.020

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24,207

$0.020

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Corphita

USA . 552 parts In-Stock

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$0.021

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552

$0.021

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Argo Parts USA

USA . 3,463 parts In-Stock

1+ parts

$0.046

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$0.045

3,463

$0.046

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-

$0.045

Netroflash

USA . 100 parts In-Stock

1+ parts

$0.046

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100

$0.046

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Modulus Dynamics

Lithuania . 4,073 parts In-Stock

1+ parts

$0.052

100+ parts

$0.050

1k+ parts

$0.048

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4,073

$0.052

$0.050

$0.048

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Corohmni

South Africa . 165 parts In-Stock

1+ parts

$0.105

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165

$0.105

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Epart123

USA . 210,000 parts In-Stock

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210,000

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Continental Prestige Electronics

USA . 15,870 parts In-Stock

1+ parts

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100+ parts

$0.046

1k+ parts

$0.031

10k+ parts

$0.019

15,870

-

$0.046

$0.031

$0.019

GreenTree Electronics

Israel . 13,313 parts In-Stock

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13,313

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Overview

Discover the ESD130B1W0201E6327XTSA1, a high-quality Transient Suppression Device from Infineon Technologies. Designed with precision and expertise, this product offers exceptional performance in protecting sensitive electronics against voltage surges. With its bidirectional polarity and avalanche technology, it ensures reliable and efficient operation in various applications. Whether you need advanced protection for automotive, industrial, or consumer electronics, this chip carrier package device is your ultimate solution. Trust in Infineon's reputation for excellence and choose the ESD130B1W0201E6327XTSA1 for unparalleled quality and peace of mind.

Feature Benefit Bullets

Config: SINGLE

The single configuration ensures simplicity and ease of installation, making this product suitable for various applications.

Surface Mount: YES

With surface mount compatibility, this product can be easily integrated into modern electronic circuit boards, saving space and enhancing assembly efficiency.

Maximum Non Repetitive Peak Reverse Power Dissipation: 27.5 W

The high maximum power dissipation ensures the device can effectively handle transient voltage spikes, offering reliable protection and durability.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space, making it ideal for compact designs where every millimeter matters.

No. of Terminals: 2

With only two terminals, this device simplifies the circuit connection process, making it convenient for both experienced technicians and DIY enthusiasts.

Package Style (Meter): CHIP CARRIER

The chip carrier package style provides excellent thermal performance and mechanical stability, enhancing the product's overall reliability.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures the device can withstand extreme environments, guaranteeing continued functionality without compromising safety.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature allows this device to function reliably even in harsh cold environments.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy PCB layout and component placement, enabling streamlined manufacturing processes.

Reference Standard: IEC-61000-4-2, 4-4, 4-5

Compliance with these international standards ensures the product meets strict quality requirements and provides reliable protection against electrostatic discharge and other transient events.

Diode Type: TRANS VOLTAGE SUPPRESSOR DIODE

Being a trans voltage suppressor diode, this product effectively clamps and suppresses overvoltage surges, safeguarding sensitive circuitry and preventing damage.

Technology: AVALANCHE

Utilizing avalanche technology, this device offers fast response times and high surge-handling capabilities, ensuring efficient transient suppression.

Terminal Form: NO LEAD

With a no-lead terminal form, this product eliminates the risks associated with leaded components, such as potential toxicity and mechanical failure.

No. of Elements: 1

Having a single element simplifies the product's design and integration, reducing the chances of failure and enhancing overall reliability.

Maximum Repetitive Peak Reverse Voltage: 5.5 V

The high maximum repetitive peak reverse voltage rating allows this device to effectively handle repetitive transients, making it suitable for various applications where voltage spikes occur.

Moisture Sensitivity Level (MSL): 1

The MSL rating of 1 indicates that this product has excellent moisture resistance, ensuring its performance and protection capabilities throughout its lifespan.

Polarity: BIDIRECTIONAL

The bidirectional polarity feature enables the device to suppress transients in both positive and negative voltage directions, providing comprehensive protection.

Diode Element Material: SILICON

Utilizing silicon as the diode element material ensures high efficiency and reliability, making this device an excellent choice for transient suppression.

Technical Specifications

Transient Suppression Devices ESD130B1W0201E6327XTSA1 attributes and parameters. Explore more Transient Suppression Devices devices from Infineon Technologies

Specs

Config:

SINGLE

Diode Element Material:

SILICON

JESD-30 Code:

R-XBCC-N2

Moisture Sensitivity Level (MSL):

1

Maximum Non Repetitive Peak Reverse Power Dissipation:

27.5 W

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

CHIP CARRIER

Polarity:

BIDIRECTIONAL

Reference Standard:

IEC-61000-4-2, 4-4, 4-5

Maximum Repetitive Peak Reverse Voltage:

5.5 V

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Form:

Terminal Position:

Trade Compliance

ESD130B1W0201E6327XTSA1 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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