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ESD112B102ELSE6327XTSA1

Infineon Technologies

ESD112B102ELSE6327XTSA1 by Infineon Technologies

Infineon's ESD112B102ELSE6327XTSA1 is a single bidirectional Trans Voltage Suppressor Diode with 7V breakdown voltage, ideal for transient suppression. With avalanche technology and silicon diode element, it operates b/w -55°C to 125°C. This chip carrier package has gold terminal finish and is surface mountable.

Median Price

$0.088

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 179,100 parts In-Stock

1+ parts

-

100+ parts

$0.091

1k+ parts

$0.076

10k+ parts

$0.068

179,100

-

$0.091

$0.076

$0.068

Verical

USA . 179,100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.085

179,100

-

-

-

$0.085

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$0.058

100+ parts

-

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-

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10

$0.058

-

-

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Digiode

USA . 757 parts In-Stock

1+ parts

$0.071

100+ parts

-

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757

$0.071

-

-

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Chip Stock

USA . 137,000 parts In-Stock

1+ parts

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137,000

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Contempo Components LLC

USA . 23,109 parts In-Stock

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23,109

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Vyrian

USA . 6,134 parts In-Stock

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6,134

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Semtec, LLC

USA . 550 parts In-Stock

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550

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Prism Electronics

USA . 41 parts In-Stock

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41

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 4,821 parts In-Stock

1+ parts

$0.058

100+ parts

-

1k+ parts

-

10k+ parts

$0.057

4,821

$0.058

-

-

$0.057

Argo Parts USA

USA . 3,357 parts In-Stock

1+ parts

$0.058

100+ parts

-

1k+ parts

-

10k+ parts

$0.056

3,357

$0.058

-

-

$0.056

Bastille Electronics

Australia . 10 parts In-Stock

1+ parts

$0.058

100+ parts

$0.055

1k+ parts

$0.052

10k+ parts

$0.052

10

$0.058

$0.055

$0.052

$0.052

Advanced Electronics

New Zealand . 50 parts In-Stock

1+ parts

$0.059

100+ parts

$0.059

1k+ parts

$0.059

10k+ parts

-

50

$0.059

$0.059

$0.059

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Ampacity Inc.

Singapore . 179,973 parts In-Stock

1+ parts

$0.064

100+ parts

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179,973

$0.064

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Semicontronic

India . 179,874 parts In-Stock

1+ parts

$0.064

100+ parts

$0.062

1k+ parts

$0.062

10k+ parts

-

179,874

$0.064

$0.062

$0.062

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Corphita

USA . 882 parts In-Stock

1+ parts

$0.068

100+ parts

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882

$0.068

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-

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Aztec Data Supply Inc.

USA . 589 parts In-Stock

1+ parts

$0.080

100+ parts

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589

$0.080

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Corohmni

South Africa . 789 parts In-Stock

1+ parts

$0.162

100+ parts

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789

$0.162

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Modulus Dynamics

Lithuania . 25,219 parts In-Stock

1+ parts

$0.191

100+ parts

$0.183

1k+ parts

$0.176

10k+ parts

-

25,219

$0.191

$0.183

$0.176

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AZTECH Wire

Italy . 482 parts In-Stock

1+ parts

$17.120

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482

$17.120

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Perfect Parts

USA . 74,838 parts In-Stock

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74,838

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Overview

Protect your electronics with the ESD112B102ELSE6327XTSA1 by Infineon Technologies. This transient suppression device offers unparalleled quality and reliability, manufactured by a trusted leader in the industry. Ideal for a variety of applications, this product provides value and peace of mind by safeguarding against voltage spikes and surges. Say goodbye to potential damage and downtime - choose the ESD112B102ELSE6327XTSA1 for superior protection and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes this device lightweight and durable, ideal for various applications.

Config: SINGLE

The single configuration simplifies installation and reduces complexity, making it easy to use for different projects.

Surface Mount: YES

With surface mount capability, this device can be easily mounted on circuit boards, saving space and allowing for efficient use of PCB real estate.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact design, perfect for applications where space is limited.

No. of Terminals: 2

Having only two terminals simplifies the connection process and reduces the chances of wiring errors.

Package Style (Meter): CHIP CARRIER

The chip carrier package style makes it easy to integrate this device into existing systems, enhancing flexibility and compatibility.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliability in demanding environments, making this device a dependable choice.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature allows this device to perform effectively even in extreme cold conditions.

Terminal Finish: GOLD

The gold terminal finish enhances conductivity and provides corrosion resistance, ensuring stable performance over time.

Terminal Position: BOTTOM

The bottom terminal position simplifies the mounting process and allows for easy integration into different systems.

Technical Specifications

Transient Suppression Devices ESD112B102ELSE6327XTSA1 attributes and parameters. Explore more Transient Suppression Devices devices from Infineon Technologies

Specs

Minimum Breakdown Voltage:

7 V

Config:

SINGLE

Diode Element Material:

SILICON

JESD-30 Code:

R-PBCC-N2

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

CHIP CARRIER

Polarity:

BIDIRECTIONAL

Maximum Repetitive Peak Reverse Voltage:

5.3 V

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Finish:

GOLD

Terminal Form:

Terminal Position:

Trade Compliance

ESD112B102ELSE6327XTSA1 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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