Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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ESD101B102ELE6327XTMA1 by Infineon is a single bidirectional Trans Voltage Suppressor Diode with 5.5V peak reverse voltage, ideal for transient suppression applications. It operates b/w -55°C to 125°C, features avalanche technology, and comes in a chip carrier package suitable for surface mount assembly.
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Element14
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Eastek
Authorized Procurement Solutions
BidChips
iBuyXS LLC
Glotronic Ltd.
Lixinc
Plastic/epoxy material provides durability and protection to the device, ensuring long-term reliability.
Single configuration simplifies installation and maintenance, making it user-friendly.
Surface mount capability allows for easy integration into circuit boards, saving space and reducing assembly time.
Rectangular shape provides versatility in placement and mounting options, making it suitable for various applications.
Having only 2 terminals simplifies wiring and connections, reducing the chance of errors during installation.
Chip carrier style offers compact size and efficient heat dissipation, ideal for high-density applications.
High maximum operating temperature ensures reliable performance in various environmental conditions.
Low minimum operating temperature allows for use in extreme cold environments without compromising functionality.
Gold terminal finish provides excellent conductivity and corrosion resistance, enhancing the overall performance of the device.
Bottom terminal position simplifies installation and ensures proper alignment in circuit board layouts.
Trans voltage suppressor diode is specifically designed to protect sensitive electronics from voltage spikes and surges.
Avalanche technology allows for quick response and high energy absorption capability, offering superior protection against transient events.
No lead terminal form reduces the risk of mechanical failure and ensures a reliable connection over time.
High maximum repetitive peak reverse voltage rating provides ample protection for sensitive components in the circuit.
Bidirectional polarity allows for protection from voltage spikes in both directions, ensuring comprehensive coverage for the entire circuit.
Silicon diode element material offers high efficiency and durability, making it a reliable choice for transient suppression applications.
Transient Suppression Devices ESD101B102ELE6327XTMA1 attributes and parameters. Explore more Transient Suppression Devices devices from Infineon Technologies
Config:
Diode Element Material:
Diode Type:
JESD-30 Code:
JESD-609 Code:
Moisture Sensitivity Level (MSL):
No. of Elements:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Shape:
Package Style (Meter):
Polarity:
Maximum Repetitive Peak Reverse Voltage:
Surface Mount:
Technology:
Terminal Finish:
Terminal Form:
Terminal Position:
ESD101B102ELE6327XTMA1 Diodes trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8541.10.00.50
SB
PCN Packaging - Mult Dev Packing Box Chg 18/Oct/2019 Recyclable Glass Carrier 14/Oct/2014
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
STM32H743XIH6
STMicroelectronics
STM32H743XIH6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU, 36-Ch 16-Bit ADC, and 2-Ch 12-Bit DAC. It operates at up to 48 MHz, has 1085440 bytes of RAM, and offers connectivity options like CAN, I2C, USB. Ideal for industrial applications requiring high-performance processing and extensive peripheral support.
LFXTAL025159REEL
Iqd Frequency Products
LFXTAL025159REEL by IQD Frequency Products is a 32.768 kHz crystal oscillator with 20 ppm frequency tolerance and 40,000 ohm series resistance. It is ideal for applications requiring precise timekeeping, such as real-time clocks in IoT devices or microcontrollers in wearables. The surface-mount design with a drive level of 1 uW makes it suitable for compact electronic systems.
BSS138BK,215
NXP Semiconductors
NXP Semiconductors' BSS138BK,215 is a N-CHANNEL FET with 0.36A max drain current and 0.42W power dissipation. Ideal for applications requiring single configuration and surface mount technology, such as enhancement mode operation in temperatures up to 150°C.
SMBJ18CA
Onsemi
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
2N7002
Secos
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .3 W; Maximum Drain Current (ID): .115 A; Maximum Drain-Source On Resistance: 7.5 ohm;
Teledyne Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; JESD-30 Code: R-PDSO-G3; Maximum Operating Temperature: 150 Cel; No. of Terminals: 3;
1N5819HW-7-F
SPC TECHNOLOGY/ MULTICOMP
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
DP83848IVVX/NOPB
National Semiconductor
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: QFP; Package Shape: SQUARE;
LM317T
Inchange Semiconductor
Other Regulators; No. of Terminals: 3; Surface Mount: NO; Technology: BIPOLAR; Minimum Output Voltage-1: 1.2 V; No. of Outputs: 1;
1N4148WS-7-F
Diodes Incorporated
1N4148WS-7-F by Diodes Inc. is a single rectifier diode with max reverse recovery time of 0.004 us and max reverse current of 1 uA. It operates b/w -65 to 150 °C, ideal for applications requiring small outline surface mount diodes with a max output current of 0.15 A.
ULN2803A
Sanken Electric
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; JESD-30 Code: R-PDIP-T18; Package Body Material: PLASTIC/EPOXY;
RC0603FR-071KL
Yageo
Yageo's RC0603FR-071KL is a fixed resistor with 1000 ohm resistance, 1% tolerance, and 0.1 W power dissipation. Ideal for surface mount applications in electronics, it operates b/w -55 to 155 °C with a temperature coefficient of 100 ppm/°C.
1552200253
Molex
WIRE AND CABLE;
KSZ9031RNXIC
Microchip Technology
KSZ9031RNXIC by Microchip Technology is a network interface chip with 1 transceiver. It operates at a data rate of 1000 Mbps and has a nominal voltage of 1.2V. This chip is commonly used in industrial applications requiring Ethernet connectivity.
BSS138-7-F
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain Current (ID): .2 A; Minimum DS Breakdown Voltage: 50 V; Operating Mode: ENHANCEMENT MODE;
1N4148
Philips Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Terminal Finish: MATTE TIN; Maximum Operating Temperature: 200 Cel; Maximum Output Current: .15 A; JESD-609 Code: e3;
LM317BD2TG
LM317BD2TG by Onsemi is an adjustable positive single output standard regulator with a max output current of 1.5A and a max load regulation of 5.8%. Operating temperature ranges from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact designs.
1N4148WS
Daco Semiconductor
Diotec Semiconductor Ag
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Time At Peak Reflow Temperature (s): 10; Terminal Finish: MATTE TIN;
5KP33A
General Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SMBJ5.0A
Microsemi
5KP33CA
SMAJ5.0CA
Db Lectro
SMBJ12CA
Sangdest Microelectronics (Nanjing)
P6KE200A
Concord Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: NO; Nominal Breakdown Voltage: 200 V; Maximum Repetitive Peak Reverse Voltage: 171 V; Polarity: UNIDIRECTIONAL; Maximum Clamping Voltage: 274 V;
Protek Devices
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Nominal Breakdown Voltage: 14 V; Maximum Repetitive Peak Reverse Voltage: 12 V; Maximum Clamping Voltage: 19.9 V; Polarity: BIDIRECTIONAL;
SMBJ30A
SMBJ36CA
SMAJ5.0A
Lite-on Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Repetitive Peak Reverse Voltage: 18 V; Nominal Breakdown Voltage: 21.05 V; Polarity: BIDIRECTIONAL; Maximum Clamping Voltage: 29.2 V;
P6KE24A
Leshan Radio
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: NO; Maximum Repetitive Peak Reverse Voltage: 20.5 V; Polarity: UNIDIRECTIONAL; Nominal Breakdown Voltage: 24 V; Maximum Clamping Voltage: 33.2 V;
SMAJ12CA
Brightking
Pulse Electronics
Eic Semiconductor
P6KE51A
Synsemi
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
ESD101B102ELSE6327XTSA1
Infineon Technologies
ESD101B102ELSE6327XTSA1 by Infineon: 30W peak power dissipation, 0.02uA reverse current, 5.5V reverse test voltage. Ideal for transient suppression in electronic devices due to bidirectional polarity and avalanche technology.
ESD112B102ELE6327XTMA1
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: BOTTOM; Terminal Form: NO LEAD; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
ESD108B1CSP0201XTSA1
Infineon's ESD108B1CSP0201XTSA1 is a single TRANS VOLTAGE SUPPRESSOR DIODE with 5.5V max repetitive peak reverse voltage and 18.5V max breakdown voltage. It is designed for transient suppression applications, meeting IEC-61000-4-5 standard, with avalanche technology for high power dissipation up to 18000W.
ESD122DMXR
Texas Instruments
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: QUAD; Terminal Form: NO LEAD; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
ESD103B102ELSE6327XTSA1
ESD103B102ELSE6327XTSA1 by Infineon is a single TRANS VOLTAGE SUPPRESSOR DIODE with 15V peak reverse voltage. It operates b/w -55°C to 125°C, in bidirectional polarity. Ideal for transient suppression applications due to AVALANCHE technology and gold terminal finish.
ESD1P0RFWH6327XTSA1
ESD1P0RFWH6327XTSA1 by Infineon: Transient Suppressor Diode with 70V Breakdown Voltage, 12V Clamping Voltage, and Avalanche Technology. Ideal for protecting sensitive electronics from voltage spikes in applications like consumer electronics and industrial equipment.
ESD122DMYR
ESD122DMYR by Texas Instruments is a transient suppression device with 2 elements, common anode config, and max power dissipation of 20W. It operates b/w -40 to 125°C, has bidirectional polarity, and complies with IEC-61000-4 standards. Ideal for protecting electronic circuits from voltage spikes in various applications.
ESD112B102ELSE6327XTSA1
Infineon's ESD112B102ELSE6327XTSA1 is a single bidirectional Trans Voltage Suppressor Diode with 7V breakdown voltage, ideal for transient suppression. With avalanche technology and silicon diode element, it operates b/w -55°C to 125°C. This chip carrier package has gold terminal finish and is surface mountable.
ESD131B1W0201E6327XTSA1
ESD102U102ELSE6327XTSA1
ESD114U102ELE6327XTMA1
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Nominal Breakdown Voltage: 6 V; Terminal Finish: GOLD; JESD-609 Code: e4; Moisture Sensitivity Level (MSL): 1;
ESD105B102ELE6327XTMA1
ESD103B102ELE6327XTMA1
ESD119B1W01005E6327XTSA1
Infineon's ESD119B1W01005E6327XTSA1 is a single transient suppression device with 35W power dissipation. It operates b/w -55 to 125 °C, meeting IEC-61000-4-2, 4-4, and 4-5 standards. This bidirectional diode is ideal for protecting sensitive electronics from voltage spikes in various applications.
ESD144B1W0201E6327XTSA1
TRANS VOLTAGE SUPPRESSOR DIODE; Moisture Sensitivity Level (MSL): 1;
ESD114U102ELSE6327XTSA1
Infineon's ESD114U102ELSE6327XTSA1 is a 6V TRANS VOLTAGE SUPPRESSOR DIODE with 5.3V peak reverse voltage and 28V clamping voltage. It is surface mountable and unidirectional, ideal for transient suppression in electronic circuits.
ESD12VD5-TP
Micro Commercial Components
ESD12VD5-TP by Micro Commercial Components is a unidirectional Trans Voltage Suppressor Diode with 12V max repetitive peak reverse voltage and 25V clamping voltage. It has a max power dissipation of 0.2W, making it suitable for transient suppression in electronic circuits operating b/w -55°C to 150°C. The device comes in a small outline package with matte tin finish, ideal for surface mount applications requiring high reliability.
ESD130B1W0201E6327XTSA1
Infineon Technologies' ESD130B1W0201E6327XTSA1 is a single-configured, surface mount transient suppression device with a max non-repetitive peak reverse power dissipation of 27.5 W. It operates in temperatures ranging from -55 to 125 °C and complies with IEC-61000-4-2, 4-4, and 4-5 standards. This diode-type device is commonly used for voltage suppression applications due to its bidirectional polarity and silicon diode element material.
ESD113B102ELSE6327XTSA1
Infineon's ESD113B102ELSE6327XTSA1 is a single bidirectional transient voltage suppressor diode with 3.6V peak reverse voltage, ideal for protecting sensitive electronics from voltage spikes. With avalanche technology and gold terminal finish, it operates b/w -40°C to 125°C in chip carrier package style. Suitable for surface mount applications requiring high reliability and robust protection against ESD events.
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