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ESD108B1CSP0201XTSA1

Infineon Technologies

ESD108B1CSP0201XTSA1 by Infineon Technologies

Infineon's ESD108B1CSP0201XTSA1 is a single TRANS VOLTAGE SUPPRESSOR DIODE with 5.5V max repetitive peak reverse voltage and 18.5V max breakdown voltage. It is designed for transient suppression applications, meeting IEC-61000-4-5 standard, with avalanche technology for high power dissipation up to 18000W.

Median Price

$0.069

Lifecycle Status

Suppliers In-Stock

19

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 28,815 parts In-Stock

1+ parts

$0.069

100+ parts

-

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10k+ parts

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28,815

$0.069

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-

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Arrow

USA . 13,739 parts In-Stock

1+ parts

$0.069

100+ parts

$0.042

1k+ parts

$0.031

10k+ parts

$0.023

13,739

$0.069

$0.042

$0.031

$0.023

DigiKey

USA . 203,408 parts In-Stock

1+ parts

$0.130

100+ parts

$0.036

1k+ parts

$0.031

10k+ parts

$0.030

203,408

$0.130

$0.036

$0.031

$0.030

Newark

USA . 304,884 parts In-Stock

1+ parts

$0.206

100+ parts

$0.079

1k+ parts

$0.046

10k+ parts

-

304,884

$0.206

$0.079

$0.046

-

Mouser Electronics

USA . 134,891 parts In-Stock

1+ parts

$0.220

100+ parts

$0.077

1k+ parts

$0.045

10k+ parts

$0.031

134,891

$0.220

$0.077

$0.045

$0.031

Farnell

UK . 306,984 parts In-Stock

1+ parts

-

100+ parts

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$0.022

10k+ parts

$0.021

306,984

-

-

$0.022

$0.021

Element14

Singapore . 306,984 parts In-Stock

1+ parts

-

100+ parts

$0.052

1k+ parts

$0.044

10k+ parts

$0.042

306,984

-

$0.052

$0.044

$0.042

Rochester

USA . 175,000 parts In-Stock

1+ parts

-

100+ parts

$0.029

1k+ parts

$0.024

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$0.022

175,000

-

$0.029

$0.024

$0.022

Verical

USA . 175,000 parts In-Stock

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175,000

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RS (Exports)

UK . 15,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.080

10k+ parts

$0.066

15,000

-

-

$0.080

$0.066

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 820 parts In-Stock

1+ parts

$0.023

100+ parts

-

1k+ parts

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10k+ parts

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820

$0.023

-

-

-

Nova Conductors

Japan . 70 parts In-Stock

1+ parts

$0.044

100+ parts

-

1k+ parts

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10k+ parts

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70

$0.044

-

-

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Chip Stock

USA . 1,002,500 parts In-Stock

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1,002,500

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Vyrian

USA . 240,170 parts In-Stock

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NAC Semi

USA . 30,000 parts In-Stock

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30,000

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Semtec, LLC

USA . 24,404 parts In-Stock

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24,404

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IBS Electronics

USA . 15,000 parts In-Stock

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15,000

-

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TME

Poland . 15,000 parts In-Stock

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15,000

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SPM Sales

USA . 1,331 parts In-Stock

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1,331

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 241 parts In-Stock

1+ parts

$0.011

100+ parts

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241

$0.011

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Aztec Data Supply Inc.

USA . 4,480 parts In-Stock

1+ parts

$0.014

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4,480

$0.014

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Ampacity Inc.

Singapore . 237,007 parts In-Stock

1+ parts

$0.020

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237,007

$0.020

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Semicontronic

India . 217,833 parts In-Stock

1+ parts

$0.020

100+ parts

$0.020

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$0.019

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217,833

$0.020

$0.020

$0.019

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Corphita

USA . 423 parts In-Stock

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$0.022

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423

$0.022

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Aranea Global

USA . 100 parts In-Stock

1+ parts

$0.043

100+ parts

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$0.041

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100

$0.043

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$0.041

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Argo Parts USA

USA . 2,509 parts In-Stock

1+ parts

$0.044

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$0.043

2,509

$0.044

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-

$0.043

Continental Prestige Electronics

USA . 324,335 parts In-Stock

1+ parts

$0.159

100+ parts

$0.069

1k+ parts

$0.029

10k+ parts

$0.020

324,335

$0.159

$0.069

$0.029

$0.020

Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$0.160

100+ parts

$0.152

1k+ parts

$0.152

10k+ parts

-

2,500

$0.160

$0.152

$0.152

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Modulus Dynamics

Lithuania . 25,526 parts In-Stock

1+ parts

$0.195

100+ parts

$0.187

1k+ parts

$0.179

10k+ parts

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25,526

$0.195

$0.187

$0.179

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RC Electronics

USA . 108,929 parts In-Stock

1+ parts

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$0.020

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$0.020

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$0.020

108,929

-

$0.020

$0.020

$0.020

iodParts Technologies Inc.

India . 19,650 parts In-Stock

1+ parts

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$0.031

19,650

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$0.031

Perfect Parts

USA . 12,548 parts In-Stock

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12,548

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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8,000

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GreenTree Electronics

Israel . 50 parts In-Stock

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50

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Overview

Protect your electronics with the ESD108B1CSP0201XTSA1 by Infineon Technologies, a top-quality transient suppression device that offers unmatched reliability and performance. With its single configuration and surface mount capability, this product is perfect for various applications where protection against voltage spikes is essential. Infineon Technologies, a trusted manufacturer, ensures that this device meets the highest standards, providing customers with peace of mind and confidence in their electronic systems. Invest in the ESD108B1CSP0201XTSA1 today and experience the value, benefits, and advantages it brings to your projects.

Feature Benefit Bullets

Config: SINGLE

Single configuration makes it easy to install and use, without the need for complex wiring setups.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and simplifying assembly.

Maximum Non Repetitive Peak Reverse Power Dissipation: 18000 W

High power dissipation rating ensures reliable protection against transient voltage spikes and surges.

Package Shape: RECTANGULAR

Rectangular package shape provides stability and ease of handling during installation.

No. of Terminals: 2

Having only 2 terminals simplifies connection and reduces chances of wiring errors.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers compact size and durability for long-term usage.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability in various environmental conditions.

Minimum Operating Temperature: -55 °C

Wide range of operating temperatures allows for use in extreme environments without compromising performance.

Maximum Breakdown Voltage: 18.5 V

High breakdown voltage provides effective suppression of voltage spikes and ensures protection of connected devices.

Reference Standard: IEC-61000-4-5

Compliance with industry standards ensures quality and performance reliability.

Diode Type: TRANS VOLTAGE SUPPRESSOR DIODE

Specific diode type designed for transient voltage suppression, offering effective protection against voltage spikes.

Technology: AVALANCHE

Avalanche technology allows for rapid response to voltage surges, minimizing the risk of damage to connected equipment.

Terminal Form: NO LEAD

No lead terminal form reduces the chances of soldering errors and provides a secure connection.

Maximum Repetitive Peak Reverse Voltage: 5.5 V

Low maximum repetitive peak reverse voltage allows for protection of sensitive electronics with lower voltage tolerances.

Polarity: BIDIRECTIONAL

Bidirectional polarity ensures protection for voltage spikes from both directions, enhancing overall reliability.

Diode Element Material: SILICON

Silicon diode element material offers high performance and durability for long-term usage.

Technical Specifications

Transient Suppression Devices ESD108B1CSP0201XTSA1 attributes and parameters. Explore more Transient Suppression Devices devices from Infineon Technologies

Specs

Maximum Breakdown Voltage:

18.5 V

Config:

SINGLE

Diode Element Material:

SILICON

JESD-30 Code:

R-XBCC-N2

Moisture Sensitivity Level (MSL):

1

Maximum Non Repetitive Peak Reverse Power Dissipation:

18000 W

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

CHIP CARRIER

Polarity:

BIDIRECTIONAL

Reference Standard:

IEC-61000-4-5

Maximum Repetitive Peak Reverse Voltage:

5.5 V

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Form:

Terminal Position:

Trade Compliance

ESD108B1CSP0201XTSA1 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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