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ESD101B102ELSE6327XTSA1

Infineon Technologies

ESD101B102ELSE6327XTSA1 by Infineon Technologies

ESD101B102ELSE6327XTSA1 by Infineon: 30W peak power dissipation, 0.02uA reverse current, 5.5V reverse test voltage. Ideal for transient suppression in electronic devices due to bidirectional polarity and avalanche technology.

Median Price

$0.073

Lifecycle Status

Suppliers In-Stock

26

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 119,387 parts In-Stock

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$0.049

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119,387

$0.049

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$0.049

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Adafruit Industries

USA . 600 parts In-Stock

1+ parts

$0.072

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$0.068

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$0.068

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$0.072

$0.068

$0.068

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Arrow

USA . 4,651 parts In-Stock

1+ parts

$0.150

100+ parts

$0.072

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$0.065

10k+ parts

$0.059

4,651

$0.150

$0.072

$0.065

$0.059

Mouser Electronics

USA . 251,109 parts In-Stock

1+ parts

$0.350

100+ parts

$0.127

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$0.086

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$0.072

251,109

$0.350

$0.127

$0.086

$0.072

DigiKey

USA . 119,982 parts In-Stock

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$0.500

100+ parts

$0.192

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$0.127

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$0.099

119,982

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$0.192

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$0.099

Rochester

USA . 1,892,046 parts In-Stock

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$0.074

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$0.061

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$0.055

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Verical

USA . 1,498,914 parts In-Stock

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Element14

Singapore . 190,168 parts In-Stock

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$0.128

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$0.081

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$0.079

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$0.128

$0.081

$0.079

Farnell

UK . 150,688 parts In-Stock

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$0.054

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Avnet

USA . 75,000 parts In-Stock

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Future Electronics

Canada . 45,000 parts In-Stock

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RS (Exports)

UK . 12,475 parts In-Stock

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Chip1Stop

Japan . 900 parts In-Stock

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$0.029

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$0.024

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900

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$0.029

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Digiode

USA . 944 parts In-Stock

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$0.056

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944

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Nova Conductors

Japan . 57 parts In-Stock

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$0.110

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TME

Poland . 8,196 parts In-Stock

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$0.096

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Vyrian

USA . 327,256 parts In-Stock

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IBS Electronics

USA . 266,570 parts In-Stock

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ComSIT Distribution GmbH

Germany . 66,251 parts In-Stock

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Chip Stock

USA . 47,500 parts In-Stock

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Bristol Electronics

USA . 12,698 parts In-Stock

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$0.144

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$0.086

10k+ parts

$0.043

12,698

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$0.144

$0.086

$0.043

Dan-Mar Components

USA . 12,698 parts In-Stock

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SPM Sales

USA . 6,698 parts In-Stock

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Prism Electronics

USA . 385 parts In-Stock

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Semi Source

USA . 200 parts In-Stock

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Semtec, LLC

USA . 25 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 332,019 parts In-Stock

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Ampacity Inc.

Singapore . 248,729 parts In-Stock

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Modulus Dynamics

Lithuania . 6,602 parts In-Stock

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Corohmni

South Africa . 1,129 parts In-Stock

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Aztec Data Supply Inc.

USA . 711 parts In-Stock

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$0.047

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Corphita

USA . 579 parts In-Stock

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Component Stockers USA

USA . 2,679,833 parts In-Stock

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$0.060

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$0.050

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2,679,833

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$0.050

Advanced Electronics

New Zealand . 600 parts In-Stock

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$0.072

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$0.068

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$0.068

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$0.072

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Argo Parts USA

USA . 2,001 parts In-Stock

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$0.103

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$0.100

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$0.103

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Continental Prestige Electronics

USA . 213,405 parts In-Stock

1+ parts

$0.474

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$0.176

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$0.089

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$0.058

213,405

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$0.176

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$0.058

Perfect Parts

USA . 235,428 parts In-Stock

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Epart123

USA . 210,000 parts In-Stock

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Lixinc

USA . 17,320 parts In-Stock

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iodParts Technologies Inc.

India . 7,085 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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GreenTree Electronics

Israel . 3,414 parts In-Stock

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Robosynatics

Brazil . 200 parts In-Stock

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$4.503

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$4.503

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$4.503

200

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$4.503

Lucentia Tech

USA . 200 parts In-Stock

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$4.503

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$4.503

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$4.503

200

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$4.503

Netroflash

USA . 100 parts In-Stock

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$0.108

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$0.105

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100

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$0.103

Overview

Enhance your electronic devices with the ESD101B102ELSE6327XTSA1 from Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality Transient Suppression Devices that provide reliable protection against voltage spikes and surges. Ideal for a wide range of applications, this product ensures enhanced performance and durability for your electronics. With its advanced technology and superior design, the ESD101B102ELSE6327XTSA1 offers exceptional value, benefits, and advantages that meet the needs of every customer. Trust Infineon to safeguard your devices and elevate your experience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the device, making it suitable for various environments and applications.

Maximum Non Repetitive Peak Reverse Power Dissipation: 30 W

The high power dissipation capability ensures that the device can handle sudden voltage spikes or surges effectively, protecting connected electronics.

Maximum Reverse Current: 0.02 uA

The low reverse current ensures minimal leakage when the device is not actively clamping voltage, improving overall efficiency.

Terminal Finish: GOLD

The gold terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable performance over time.

Maximum Operating Temperature: 125 °C

The wide operating temperature range allows the device to function in extreme conditions without losing effectiveness.

Reference Standard: IEC-61000-4-2, 4-4, 4-5

Compliance with industry standards ensures that the device meets performance and safety requirements for transient suppression applications.

Technical Specifications

Transient Suppression Devices ESD101B102ELSE6327XTSA1 attributes and parameters. Explore more Transient Suppression Devices devices from Infineon Technologies

Specs

Additional Features:

LOW CAPACITANCE

Maximum Clamping Voltage:

30 V

Config:

SINGLE

Diode Element Material:

SILICON

JESD-30 Code:

R-PBCC-N2

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

Maximum Non Repetitive Peak Reverse Power Dissipation:

30 W

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Polarity:

BIDIRECTIONAL

Reference Standard:

IEC-61000-4-2, 4-4, 4-5

Maximum Repetitive Peak Reverse Voltage:

5.5 V

Maximum Reverse Current:

.02 uA

Reverse Test Voltage:

5.5 V

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Finish:

GOLD

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

40

Trade Compliance

ESD101B102ELSE6327XTSA1 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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