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EMB1433QSQ/NOPB

Texas Instruments

EMB1433QSQ/NOPB by Texas Instruments

EMB1433QSQ/NOPB by Texas Instruments is a Power Management IC with 48 terminals, operating at -40 to 125 °C. It features a 5 V nominal voltage, suitable for automotive applications. This IC has a square package shape, matte tin finish, and very thin profile style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,901 parts In-Stock

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8,901

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Digiode

USA . 4,755 parts In-Stock

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4,755

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Prism Electronics

USA . 90 parts In-Stock

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90

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Distributors (Availability)

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Native Components

USA . 765 parts In-Stock

1+ parts

$0.366

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$0.351

765

$0.366

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$0.351

Northwest PG Solutions

USA . 1,924 parts In-Stock

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$0.402

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$0.355

1,924

$0.402

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$0.355

One Stop Electronics

USA . 672 parts In-Stock

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$5.500

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672

$5.500

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Parana Technologies

USA . 1,555 parts In-Stock

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$10.134

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$10.677

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1,555

$10.134

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$10.677

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DigiPath Technology Company

USA . 2,200 parts In-Stock

1+ parts

$11.158

100+ parts

$10.266

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2,200

$11.158

$10.266

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ChromeModa Solutions

Germany . 4,836 parts In-Stock

1+ parts

$11.386

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$9.337

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4,836

$11.386

$9.337

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IDEA Electronic Components Group

UK . 1,433 parts In-Stock

1+ parts

$11.386

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$10.817

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$10.247

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1,433

$11.386

$10.817

$10.247

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AZTECH Wire

Italy . 329 parts In-Stock

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$14.806

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Corphita

USA . 2,086 parts In-Stock

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2,086

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Overview

Power up your projects with the EMB1433QSQ/NOPB from Texas Instruments. As a leader in Power Management ICs, Texas Instruments delivers unparalleled quality and reliability in every product. This versatile chip carrier is ideal for a wide range of applications, from automotive to industrial. With its very thin profile and adjustable threshold, this power supply management circuit offers maximum flexibility and efficiency. Trust Texas Instruments to provide the best-in-class solutions for all your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is known for its durability and resistance to heat, making it a reliable choice for power management ICs.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and effort during production.

Nominal Supply Voltage (Vsup): 5 V

The 5V supply voltage is a common standard in many electronic devices, ensuring compatibility with a wide range of applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows for reliable performance even in harsh environmental conditions.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, ensuring long-term reliability of connections.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards, ensuring reliability and safety in automotive applications.

No. of Channels: 14

With 14 channels, this power management IC can handle multiple power sources or loads simultaneously, providing flexibility in design.

Technical Specifications

Power Management ICs EMB1433QSQ/NOPB attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

14

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7 mm

Trade Compliance

EMB1433QSQ/NOPB Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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