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EMB1432QSQX/NOPB

Texas Instruments

EMB1432QSQX/NOPB by Texas Instruments

EMB1432QSQX/NOPB by Texas Instruments is a Power Management IC with 48 terminals, operating at -40 to 125 °C. It has a supply voltage range of 4.75V to 5.5V and is suitable for automotive applications due to its low profile chip carrier package style. The IC supports power supply circuits and offers high-temperature reflow capabilities up to 260C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,407 parts In-Stock

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Digiode

USA . 1,624 parts In-Stock

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1,624

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Distributors (Availability)

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Semicontronic

India . 420 parts In-Stock

1+ parts

$4.500

100+ parts

$4.388

1k+ parts

$4.365

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420

$4.500

$4.388

$4.365

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Ampacity Inc.

Singapore . 1,610 parts In-Stock

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$7.500

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$7.500

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One Stop Electronics

USA . 640 parts In-Stock

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$7.500

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640

$7.500

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Parana Technologies

USA . 1,224 parts In-Stock

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$17.189

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$17.408

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1,224

$17.189

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$17.408

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AZTECH Wire

Italy . 703 parts In-Stock

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$17.691

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703

$17.691

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DigiPath Technology Company

USA . 2,106 parts In-Stock

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$18.928

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$17.414

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2,106

$18.928

$17.414

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IDEA Electronic Components Group

UK . 1,118 parts In-Stock

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$19.314

100+ parts

$18.348

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$17.383

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1,118

$19.314

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$17.383

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ChromeModa Solutions

Germany . 305 parts In-Stock

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$19.314

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$15.837

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305

$19.314

$15.837

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Corphita

USA . 3,508 parts In-Stock

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Native Components

USA . 994 parts In-Stock

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Northwest PG Solutions

USA . 506 parts In-Stock

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Corohmni

South Africa . 487 parts In-Stock

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Overview

Experience the power of Texas Instruments with the EMB1432QSQX/NOPB Power Management IC. Designed with quality and precision, this chip carrier package offers 14 channels for a wide range of applications in automotive settings. With a nominal supply voltage of 5V and a sleek square shape, this IC provides efficient power support while ensuring reliability. Trust in Texas Instruments for cutting-edge technology that delivers value and performance, making your projects shine brighter than ever before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material combination makes the package lightweight and durable, ideal for portable electronic devices.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and labor costs.

Nominal Supply Voltage (Vsup): 5 V

A stable supply voltage of 5V ensures consistent and reliable operation of the power management IC.

No. of Terminals: 48

With a large number of terminals, this IC can support complex power distribution and management tasks effectively.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows the IC to function reliably in demanding industrial or automotive environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures that the IC can withstand extreme cold conditions without performance degradation.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, enhancing the overall reliability of the IC.

Terminal Position: QUAD

Quad terminal position facilitates efficient and accurate placement on circuit boards, optimizing signal integrity and power distribution.

Width (mm): 7 mm

Compact width of 7mm allows for space-efficient PCB design and integration into small form factor electronic devices.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this power management IC meets the stringent requirements for reliability and performance in vehicles.

No. of Channels: 14

With 14 channels, this IC can handle multiple power inputs and outputs simultaneously, enabling versatile power management capabilities.

Moisture Sensitivity Level (MSL): 2

MSL level 2 indicates that the IC is moderately sensitive to moisture, allowing for a reasonable shelf life and operational reliability.

Technical Specifications

Power Management ICs EMB1432QSQX/NOPB attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

14

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7 mm

Trade Compliance

EMB1432QSQX/NOPB Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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