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EMB1433QSQE/NOPB

Texas Instruments

EMB1433QSQE/NOPB by Texas Instruments

EMB1433QSQE/NOPB by Texas Instruments is a Power Management IC with 48 terminals, operating at -40 to 125°C. It features a nominal voltage of 5V, suitable for automotive applications. This IC has a square package shape, matte tin finish, and very thin profile style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,192 parts In-Stock

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Digiode

USA . 233 parts In-Stock

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Native Components

USA . 172 parts In-Stock

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$0.339

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-

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$0.326

172

$0.339

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$0.326

Northwest PG Solutions

USA . 900 parts In-Stock

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$0.373

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$0.329

900

$0.373

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$0.329

Ampacity Inc.

Singapore . 1,268 parts In-Stock

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$4.500

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$4.500

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One Stop Electronics

USA . 1,124 parts In-Stock

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$5.500

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$5.500

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Semicontronic

India . 1,134 parts In-Stock

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$7.500

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$7.312

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$7.275

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$7.500

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$7.275

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Parana Technologies

USA . 1,104 parts In-Stock

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$13.534

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$14.038

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$13.534

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$14.038

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AZTECH Wire

Italy . 528 parts In-Stock

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$14.157

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DigiPath Technology Company

USA . 829 parts In-Stock

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$14.903

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ChromeModa Solutions

Germany . 4,319 parts In-Stock

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$15.207

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$12.470

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IDEA Electronic Components Group

UK . 1,719 parts In-Stock

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$15.207

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$14.447

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$13.686

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Corphita

USA . 474 parts In-Stock

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Corohmni

South Africa . 222 parts In-Stock

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Overview

Experience the power of efficient and reliable Power Management ICs with the EMB1433QSQE/NOPB by Texas Instruments. Crafted with precision and quality in mind, this product offers optimal performance in a wide range of applications. From automotive to industrial settings, the EMB1433QSQE/NOPB ensures consistent power supply management without compromising on durability. Trust Texas Instruments for cutting-edge technology that delivers value, benefits, and advantages to customers seeking top-notch power solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making it a reliable choice for power management applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on printed circuit boards, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 5 V

The 5V nominal supply voltage is a common and widely supported standard in many electronic devices, ensuring compatibility with a wide range of applications.

No. of Terminals: 48

Having 48 terminals provides ample connectivity options for interfacing with various power sources and loads, allowing for versatile and flexible power management configurations.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this power management IC can withstand elevated temperatures without compromising performance, making it suitable for demanding industrial environments.

Minimum Operating Temperature: -40 °C

The -40°C minimum operating temperature ensures reliable operation even in extremely cold conditions, making this power management IC suitable for outdoor and automotive applications.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent solderability and corrosion resistance, ensuring reliable electrical connections for long-term performance.

Maximum Seated Height: 0.8 mm

The low maximum seated height of 0.8mm allows for a compact and space-efficient design, making it ideal for applications with limited board space.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade designation ensures that this power management IC meets the strict requirements for reliable operation in automotive applications, ensuring safety and performance.

Maximum Supply Voltage (Vsup): 5.5 V

The 5.5V maximum supply voltage tolerance provides a safety margin and protection against voltage spikes or fluctuations, ensuring the stability and longevity of the power management system.

Technical Specifications

Power Management ICs EMB1433QSQE/NOPB attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

14

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7 mm

Trade Compliance

EMB1433QSQE/NOPB Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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