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EMB1433QSQX/NOPB

Texas Instruments

EMB1433QSQX/NOPB by Texas Instruments

EMB1433QSQX/NOPB by Texas Instruments is a Power Management IC with 48 terminals, operating b/w -40 to 125°C. It features a nominal voltage of 5V and is suitable for automotive applications. The IC has a square package shape, matte tin terminal finish, and very thin profile style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,410 parts In-Stock

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3,410

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Digiode

USA . 3,074 parts In-Stock

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3,074

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,521 parts In-Stock

1+ parts

$0.500

100+ parts

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1,521

$0.500

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Native Components

USA . 706 parts In-Stock

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$1.120

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706

$1.120

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Northwest PG Solutions

USA . 1,080 parts In-Stock

1+ parts

$1.232

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1,080

$1.232

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One Stop Electronics

USA . 1,097 parts In-Stock

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$1.500

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1,097

$1.500

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Semicontronic

India . 1,519 parts In-Stock

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$2.500

100+ parts

$2.438

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$2.425

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1,519

$2.500

$2.438

$2.425

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Parana Technologies

USA . 1,024 parts In-Stock

1+ parts

$4.845

100+ parts

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$5.365

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1,024

$4.845

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$5.365

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DigiPath Technology Company

USA . 1,485 parts In-Stock

1+ parts

$5.335

100+ parts

$4.908

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1,485

$5.335

$4.908

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ChromeModa Solutions

Germany . 1,920 parts In-Stock

1+ parts

$5.444

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$4.464

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1,920

$5.444

$4.464

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IDEA Electronic Components Group

UK . 73 parts In-Stock

1+ parts

$5.444

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$4.900

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73

$5.444

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$4.900

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AZTECH Wire

Italy . 587 parts In-Stock

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$11.042

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587

$11.042

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Corphita

USA . 2,908 parts In-Stock

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2,908

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Corohmni

South Africa . 270 parts In-Stock

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270

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Overview

Experience the power of Texas Instruments with the EMB1433QSQX/NOPB Power Management IC. Crafted with precision and quality, this versatile chip carrier offers top-notch performance in a compact square package. From automotive to industrial applications, this innovative technology ensures reliable power supply management with its adjustable threshold feature. Trust Texas Instruments to deliver the best in power management solutions, providing customers with the value and benefits they deserve. Elevate your projects with the EMB1433QSQX/NOPB - the ultimate choice for all your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is cost-effective and lightweight, making this product suitable for applications where weight and cost are important factors.

Surface Mount: YES

Surface mount packaging makes it easy to mount and integrate this IC onto PCBs, reducing assembly time and costs.

Nominal Supply Voltage (Vsup): 5 V

With a 5V supply voltage, this IC can be easily integrated into a variety of systems that operate within this voltage range.

No. of Terminals: 48

Having 48 terminals allows for more functionality and connections to other components, making this IC versatile and suitable for complex power management applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this IC can withstand harsh operating environments and maintain reliable performance.

Terminal Finish: MATTE TIN

MATTE TIN finish on terminals improves solderability and conductivity, ensuring a strong and reliable connection during assembly.

Temperature Grade: AUTOMOTIVE

Being rated for automotive temperature requirements indicates that this IC is durable and can withstand the temperature fluctuations and demands of automotive applications.

Adjustable Threshold: YES

Having an adjustable threshold allows for customization and fine-tuning of the power management circuit to meet specific requirements and optimize performance.

Technical Specifications

Power Management ICs EMB1433QSQX/NOPB attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

14

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7 mm

Trade Compliance

EMB1433QSQX/NOPB Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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