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DS3654N

Texas Instruments

DS3654N by Texas Instruments

DS3654N by Texas Instruments is a peripheral driver with 16 terminals and built-in transient & under voltage protections. It operates b/w 0-70 °C, with a supply voltage range of 7.5-9.5 V and max output current of 0.25 A. Ideal for applications requiring SIPO based peripheral drivers with inverted output polarity.

Median Price

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Lifecycle Status

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11

In-Stock Inventory

1k+

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Vyrian

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Digiode

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Bristol Electronics

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Atlantic Semiconductor

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Huijzer Components

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Elcom Components

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ABC Electronics Ltd.

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Electronic Expediters

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ACDS - Activité Composants Distribution Service

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LittleDiode

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Parana Technologies

USA . 834 parts In-Stock

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ChromeModa Solutions

Germany . 3,406 parts In-Stock

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IDEA Electronic Components Group

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AZTECH Wire

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One Stop Electronics

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Native Components

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Northwest PG Solutions

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DigiPath Technology Company

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Overview

Experience the exceptional quality and reliability of Texas Instruments with the DS3654N Peripheral Driver. This versatile device offers built-in protections against transients and under voltages, ensuring the safety of your systems. Ideal for a wide range of applications, this product provides inverted output polarity and open-collector output characteristics. With a maximum supply voltage of 9.5V and a nominal output peak current limit of 0.4A, the DS3654N delivers unmatched performance and efficiency. Trust Texas Instruments to bring you cutting-edge technology and innovation in every product.

Feature Benefit Bullets

Maximum Supply Voltage: 9.5 V

Allows for a wide range of input voltage options, making it versatile for different applications.

Package Shape: RECTANGULAR

Rectangular shape makes it easy to mount and integrate into existing systems or circuits.

Built-in Protections: TRANSIENT; UNDER VOLTAGE

Provides protection against transient voltage spikes and under voltage conditions, ensuring the longevity of the product.

Power Supplies (V): 8.5

Stable power supply voltage ensures consistent performance of the peripheral driver.

No. of Terminals: 16

Sufficient number of terminals for connecting to other components or systems.

Package Style (Meter): IN-LINE

In-line package style saves space and allows for easy installation in tight spaces.

Minimum Supply Voltage: 7.5 V

Provides flexibility in power input options while maintaining stable operations.

Maximum Operating Temperature: 70 °C

Can operate in a wide range of temperatures, suitable for various environmental conditions.

Output Characteristics: OPEN-COLLECTOR

Open-collector output allows for easy interfacing with different types of devices or circuits.

Minimum Operating Temperature: 0 °C

Can operate at low temperatures, making it suitable for diverse applications.

Terminal Finish: TIN LEAD

Tin lead finish provides good conductivity and solderability for reliable connections.

Terminal Position: DUAL

Dual terminal position allows for flexibility in connecting the peripheral driver.

Maximum Seated Height: 5.08 mm

Low seated height makes it suitable for compact designs or installations.

Width: 7.62 mm

Compact width allows for easy integration into different setups or circuits.

Output Polarity: INVERTED

Inverted output polarity may be advantageous for certain applications or circuit designs.

Length: 19.305 mm

Optimal length for accommodating the necessary components and connections in the peripheral driver.

Temperature Grade: COMMERCIAL

Suitable for commercial applications and environments.

Maximum Output Current: 0.25 A

Able to handle moderate output current, making it versatile for different loads.

Technology: BIPOLAR

Bipolar technology offers stable operation and precise control in the peripheral driver.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical connections for reliability in operation.

Maximum Supply Current: 70 mA

Moderate supply current requirement, suitable for various power sources.

Input Characteristics: SCHMITT TRIGGER

Schmitt trigger input characteristics provide noise immunity and stable input transitions.

Nominal Supply Voltage: 8.5 V

Nominal supply voltage ensures consistent performance and compatibility with standard power sources.

Terminal Pitch: 2.54 mm

Standard terminal pitch for easy connections and compatibility with common components.

Nominal Output Peak Current Limit: 0.4 A

Nominal peak output current limit ensures safe operation within specified limits.

Interface IC Type: SIPO BASED PERIPHERAL DRIVER

Shift-in parallel-out interface type for efficient data transfer and control in the peripheral driver.

Output Current Flow Direction: SINK

Sink output current flow direction for compatibility with different types of loads or devices.

Technical Specifications

Peripheral Drivers DS3654N attributes and parameters. Explore more Peripheral Drivers devices from Texas Instruments

Specs

Built-in Protections:

TRANSIENT; UNDER VOLTAGE

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

JESD-30 Code:

R-XDIP-T16

JESD-609 Code:

e0

Length:

19.305 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-COLLECTOR

Output Current Flow Direction:

SINK

Maximum Output Current:

.25 A

Nominal Output Peak Current Limit:

.4 A

Output Polarity:

INVERTED

Package Body Material:

UNSPECIFIED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

8.5

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Current:

70 mA

Maximum Supply Voltage:

9.5 V

Minimum Supply Voltage:

7.5 V

Nominal Supply Voltage:

8.5 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

DS3654N Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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