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DS3632N

Texas Instruments

DS3632N by Texas Instruments

DS3632N by Texas Instruments is an AND gate-based peripheral driver with 2 functions. It operates b/w 0-70°C, suitable for commercial applications. With a supply voltage range of 4.75-15V and output current limit of 0.3A, it is ideal for driving peripherals in various electronic systems.

Median Price

$26.040

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (In-Stock)

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Forefront Electronics and Design

USA . 35 parts In-Stock

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$6.130

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$6.130

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American Microsemiconductor Inc.

USA . 7 parts In-Stock

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$45.950

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Digiode

USA . 3,648 parts In-Stock

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Vyrian

USA . 3,174 parts In-Stock

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Electronic Expediters

USA . 159 parts In-Stock

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Anansix

USA . 153 parts In-Stock

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Pegasus Components GmbH

Germany . 67 parts In-Stock

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LWI Electronics Inc

India . 49 parts In-Stock

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Prism Electronics

USA . 19 parts In-Stock

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R&J Components

USA . 12 parts In-Stock

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MISTER SPROCKETS

USA . 8 parts In-Stock

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Holdelec - ElecDif-Pro

France . 3 parts In-Stock

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GES GmbH

Germany . 1 parts In-Stock

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First Choice Components Inc.

USA . 1 parts In-Stock

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Distributors (Availability)

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Benley Electronics

USA . 6 parts In-Stock

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$0.750

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6

$0.750

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Parana Technologies

USA . 1,974 parts In-Stock

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$2.660

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$3.148

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1,974

$2.660

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$3.148

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ChromeModa Solutions

Germany . 3,835 parts In-Stock

1+ parts

$2.989

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$2.451

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3,835

$2.989

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IDEA Electronic Components Group

UK . 488 parts In-Stock

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$2.989

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$2.690

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$2.989

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AZTECH Wire

Italy . 535 parts In-Stock

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$6.157

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535

$6.157

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One Stop Electronics

USA . 1,393 parts In-Stock

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$8.500

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$8.500

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Native Components

USA . 99 parts In-Stock

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$36.495

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$35.035

99

$36.495

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$35.035

Northwest PG Solutions

USA . 1,935 parts In-Stock

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$40.144

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1,935

$40.144

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Alle Elektronik GmbH

Germany . 4,928 parts In-Stock

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4,928

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DigiPath Technology Company

USA . 525 parts In-Stock

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$2.695

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525

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$2.695

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Corphita

USA . 512 parts In-Stock

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512

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Assy Fe

Spain . 476 parts In-Stock

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RC Electronics

USA . 198 parts In-Stock

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Overview

Enhance your electronic projects with the DS3632N by Texas Instruments, a top-quality peripheral driver that offers reliability and performance. Texas Instruments is known for its cutting-edge technology and this product is no exception. Ideal for a wide range of applications, this AND gate based peripheral driver provides seamless operation and precise output control. With a nominal peak current limit of 0.3 A and a maximum supply voltage of 15 V, the DS3632N ensures optimal functionality while maintaining cost-effectiveness. Elevate your projects with the DS3632N and experience the superior quality and value that Texas Instruments delivers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the peripheral driver, making it suitable for various environments.

Maximum Supply Voltage: 15 V

Allows compatibility with a wide range of power sources, ensuring flexibility in usage.

No. of Functions: 2

Provides multiple functions in a single device, allowing for efficient use of space and resources.

Package Shape: RECTANGULAR

Rectangular shape makes it easy to integrate the peripheral driver into existing electronic setups.

No. of Terminals: 8

Sufficient terminals for connectivity options, enabling versatile application scenarios.

Minimum Operating Temperature: 0 °C

Can operate even in low-temperature environments, expanding usage possibilities.

Nominal Output Peak Current Limit: 0.3 A

Provides a decent output current limit, suitable for driving various peripherals effectively.

Technical Specifications

Peripheral Drivers DS3632N attributes and parameters. Explore more Peripheral Drivers devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T8

Length:

9.817 mm

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

.3 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage:

15 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

DS3632N Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-156-7603, 5962011567603

NIIN

011567603

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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