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DS1776E/883

Texas Instruments

DS1776E/883 by Texas Instruments

DS1776E/883 by Texas Instruments is an 8-bit bus driver with 17ns propagation delay at 5V. It features open-collector/3-state output characteristics, operates in a temperature range of -55 to 125 °C, and is MIL-STD-883 screened. Ideal for military applications requiring bidirectional control with common control interface.

Median Price

$130.711

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,107 parts In-Stock

1+ parts

$130.711

100+ parts

$126.780

1k+ parts

$98.279

10k+ parts

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2,107

$130.711

$126.780

$98.279

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,738 parts In-Stock

1+ parts

$124.175

100+ parts

-

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3,738

$124.175

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Vyrian

USA . 2,249 parts In-Stock

1+ parts

$130.711

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2,249

$130.711

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-

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Anansix

USA . 195 parts In-Stock

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195

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Velocity Electronics

USA . 9 parts In-Stock

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-

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9

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Inland Empire Components Inc.

USA . 9 parts In-Stock

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9

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 4,688 parts In-Stock

1+ parts

$5.330

100+ parts

-

1k+ parts

$3.733

10k+ parts

$3.733

4,688

$5.330

-

$3.733

$3.733

Native Components

USA . 753 parts In-Stock

1+ parts

$6.870

100+ parts

-

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753

$6.870

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Parana Technologies

USA . 1,019 parts In-Stock

1+ parts

$29.367

100+ parts

-

1k+ parts

$58.568

10k+ parts

-

1,019

$29.367

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$58.568

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DigiPath Technology Company

USA . 1,784 parts In-Stock

1+ parts

$32.337

100+ parts

$29.750

1k+ parts

-

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1,784

$32.337

$29.750

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ChromeModa Solutions

Germany . 4,095 parts In-Stock

1+ parts

$32.997

100+ parts

$27.058

1k+ parts

-

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4,095

$32.997

$27.058

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IDEA Electronic Components Group

UK . 1,857 parts In-Stock

1+ parts

$32.997

100+ parts

$31.347

1k+ parts

$29.697

10k+ parts

-

1,857

$32.997

$31.347

$29.697

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Ampacity Inc.

Singapore . 1,633 parts In-Stock

1+ parts

$111.100

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1,633

$111.100

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Corphita

USA . 4,131 parts In-Stock

1+ parts

$117.640

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4,131

$117.640

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Microchip USA

USA . 2,804 parts In-Stock

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2,804

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Northwest PG Solutions

USA . 2,125 parts In-Stock

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$6.733

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2,125

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$6.733

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Overview

Enhance your electronic designs with the DS1776E/883 by Texas Instruments, a high-quality bus driver & transceiver that offers unparalleled reliability and performance. Manufactured using top-notch materials and stringent MIL-STD-883 screening, this chip carrier package delivers fast propagation delay and true output polarity, making it ideal for a variety of applications. With 8 bits and 2 ports, this versatile component is perfect for military-grade projects where precision and durability are key. Trust Texas Instruments to provide you with cutting-edge technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material combination provides durability and reliability for the bus driver/transceiver, making it suitable for rugged environments.

Propagation Delay At Nominal Supply: 17 ns

With a low propagation delay, this bus driver/transceiver ensures fast and efficient signal transmission within the system.

Surface Mount: YES

Being surface mountable makes installation of this component easier and more convenient, saving space on the PCB.

No. of Bits: 8

Having 8 bits allows for versatile data handling and communication capabilities in various applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common 5V supply voltage simplifies power management and compatibility with other components in the system.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature tolerance ensures reliable performance even in harsh environmental conditions.

Technology: BICMOS

Utilizing BiCMOS technology combines the advantages of both bipolar and CMOS technologies, offering high performance and low power consumption.

Technical Specifications

Bus Driver & Transceivers DS1776E/883 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

BTL PORT WITH STANDARD INPUTS AND OPEN COLLECTOR OUTPUTS

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

F/FAST

JESD-30 Code:

S-CQCC-N28

Length:

11.43 mm

Load Capacitance (CL):

50 pF

Maximum I (ol):

100 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

OPEN-COLLECTOR/3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC28,.45SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

17 ns

Propagation Delay (tpd):

17 ns

Qualification:

Not Qualified

Screening Level:

MIL-STD-883

Maximum Seated Height:

1.905 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

11.43 mm

Trade Compliance

DS1776E/883 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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